This invention relates to pipette tip systems, and more particularly support cards for the same.
Current pipette tips systems have many drawbacks. First, the pipette tip is disposed in a support card, but is permitted to move significantly within the support card, ultimately rubbing against adjacent tips and building static electricity. This static can misalign the tips, making it more difficult, if not impossible, for a pipetter to accurately mate and seal with the pipette tip.
Second, the pipette tips are shipped in support cards that are individually wrapped and boxed with several of these individually wrapped support cards. During shipping the individual support cards can jostle against each other, and the pipette tips disposed within each support card and rub against each other, building static electricity. Again, this static misaligns the tips making it more difficult, if not impossible for a pipetter to accurately mate and seal with the pipette tip.
Third, an apron or a stand extends away from the support card to suspend the pipette tips above the laboratory bench surface. The apron enlarges the size of the support card, increasing shipping costs and waste.
What is needed, therefore, is a system that overcomes these problems.
Provided herein is an interleaved support card bundle comprised of two pipette tip support cards. Each of the support cards can be removed from the bundle and the pipette tips can be accessed. The interleaved support card bundle includes a first support card with a first top surface that contains a first plurality of pipette tip support holes. A first plurality of pipette tips is disposed in the first plurality of pipette tip support holes, and those tips extend away from the first top surface. The bundle also has second support card with a similar construction as that of the first support card. Specifically, the second support card includes a second top surface containing a second plurality of pipette tip support holes. A second plurality of pipette tips is disposed in the second plurality of pipette tip support holes, and those tips extend away from the second top surface. The first top surface is parallel to the second top surface, and the first plurality of pipette tips extends towards the second top surface. Likewise, the second plurality of pipette tips extends towards the first top surface. The pipette tips interleave with each other in the interleaved region.
The first and second support cards may have an apron, and may have a lid. The lid may fit over the top surface and may secure the plurality of pipette tips in its respective support holes. The lids may slide over the top surface, or may snap fit over the top surface. The edge of the either or both support cards may have a plurality of partial holes to prevent obstruction to a pipetter.
The interleaved support card bundle may be comprised of four or six support cards, all of similar construction, with their respective pipette tips interleaved.
Additional aspects, alternatives and variations as would be apparent to persons of skill in the art are also disclosed herein and are specifically contemplated as included as part of the invention. The invention is set forth only in the claims as allowed by the patent office in this or related applications, and the following summary descriptions of certain examples are not in any way to limit, define or otherwise establish the scope of legal protection.
The invention can be better understood with reference to the following figures. The components within the figures are not necessarily to scale, emphasis instead being placed on clearly illustrating example aspects of the invention. In the figures, like reference numerals designate corresponding parts throughout the different views and/or embodiments. Furthermore, various features of different disclosed embodiments can be combined to form additional embodiments, which are part of this disclosure. It will be understood that certain components and details may not appear in the figures to assist in more clearly describing the invention.
Reference is made herein to some specific examples of the present invention, including any best modes contemplated by the inventor for carrying out the invention. Examples of these specific embodiments are illustrated in the accompanying figures. While the invention is described in conjunction with these specific embodiments, it will be understood that they are not intended to limit the invention to the described or illustrated embodiments. To the contrary, they are intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims.
In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention. Example embodiments of the present invention may be implemented without some or all these specific details. In other instances, process operations well-known to persons of skill in the art have not been described in detail so as not to obscure unnecessarily the present invention. Various techniques and mechanisms of the present invention will sometimes be described in singular form for clarity. However, it should be noted that some embodiments include multiple iterations of a technique or multiple mechanisms, unless noted otherwise. Similarly, various steps of the methods shown and described herein are not necessarily performed in the order indicated, or performed at all, in certain embodiments. Accordingly, some implementations of the methods discussed herein may include more or fewer steps than those shown or described. Further, the techniques and mechanisms of the present invention will sometimes describe a connection, relationship or communication between two or more entities. It should be noted that a connection or relationship between entities does not necessarily mean a direct, unimpeded connection, as a variety of other entities or processes may reside or occur between any two entities. Consequently, an indicated connection does not necessarily mean a direct, unimpeded connection, unless otherwise noted.
The following list of example features corresponds with the attached figures and is provided for ease of reference, where like reference numerals designate corresponding features throughout the specification and figures:
Now turning to the drawing,
The distance the first apron 12-2 extends away from the first top surface 20-1 is less than the distance the first plurality of pipette tips 50-1 extends away from the first top surface 20-1; thus, the first plurality of pipette tips 50-1 extend past the first apron distal edge 18-1. The second apron 12-2 has a similar construction to that of the first apron 12-2 as shown in
The first support card 10-1 may have a first lid 15-1 constructed cover the first top surface 20-1 and secure the first plurality of pipette tips 50-1 in its respective support holes 25-1. The first lid 15-1 may slide over the first top surface 20-1 as shown in
The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles described herein can be applied to other embodiments without departing from the spirit or scope of the invention. Thus, it is to be understood that the description and drawings presented herein represent a presently preferred embodiment of the invention and are therefore representative of the subject matter that is broadly contemplated by the present invention. It is further understood that the scope of the present invention fully encompasses other embodiments that may become obvious to those skilled in the art, and that the scope of the present invention is accordingly limited by nothing other than the appended claims.
This application claim priority to U.S. 63/614,919 filed on Dec. 26, 2023 entitled “Pipette Tip Support Card Bundles”, and U.S. 63/567,766 filed on Mar. 20, 2024 entitled “Pipette Tip Support Card Bundles”, the entire contents of these applications is incorporated herein by reference. This application is also related to U.S. Pat. No. 11,701,663 issued on Jul. 18, 2023, which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 63567766 | Mar 2024 | US | |
| 63614919 | Dec 2023 | US |