The present invention relates to a piping unit for introduction of fluid, and more particularly to a piping unit having a heat exchange structure for dissipating heat of heated fluid before introduction of the heated fluid into a cooler and the like or for transferring heat to cooled fluid before introduction of the cooled fluid.
Known conventional devices for cooling heated fluid, such as air and coolant, in an internal combustion engine or the like include cooling devices that cool fluid using a cooler such as an intercooler or a radiator.
As shown in Japanese Patent Laid-Open No. 2007-182871, for instance, a piping structure that directs pressurized air from a supercharger into an intercooler for cooling therein is known. The piping structure shown in Japanese Patent Laid-Open No. 2007-182871 has strength enough for preventing deformation under pressurized air having a pressure increased by a supercharger. The piping structure also has a prescribed cross-sectional area of a joint relative to a cross sectional area of a flow passage at a distal end of a header tank in order to reduce stress on a tube root of an intercooler.
It is also a known practice to attach an insulator to an internal combustion engine to control increase in temperatures of metallic parts in order to suppress heat coming from the internal combustion engine and/or heat dissipation around the internal combustion engine. As shown in Japanese Patent Laid-Open No. 2010-203310, for instance, a heat insulator that provides heat dissipation effect by forming insulator surfaces with a predetermined roughness to increase surface roughness is known.
Since these conventional coolers have a function of cooling introduced fluid, they require securing of a certain contact area to achieve a desired cooling effect, having a problem of difficulty in downsizing the cooler itself. In view of automobile downsizing in recent years and/or improvement in fuel efficiency associated with reduction in weight, however, there is a demand for downsizing of the cooler itself.
One possible way is to decrease the temperature of heated fluid to be introduced into the cooler for reducing the size of the cooler. However, sufficient heat dissipation effect cannot be achieved with conventional heat dissipation structures, such as one with a piping unit wrapped with heat insulator or one with an increased contact area provided by an increased surface roughness of an outer surface of a piping unit. Thus, there has been the problem of difficulty in sufficient downsizing of a cooler and still being unable to reduce the cooler size.
The present invention was made in view of such a problem, and an object thereof is to provide a piping unit that facilitates downsizing of a cooler by decreasing the temperature of fluid to be introduced into the cooler without reducing the cooling effect of a cooler.
A piping unit according to the present invention is for introduction of heated fluid, wherein the piping unit is formed from synthetic resin and includes a heat exchange structure on an inner peripheral surface.
In the piping unit according to the present invention, the heat exchange structure is preferably an asperity geometry formed on the inner peripheral surface of the piping unit.
In the piping unit according to the present invention, the heat exchange structure is preferably a rib erected on the inner peripheral surface of the piping unit.
The piping unit according to the present invention is preferably constructed of a combination of at least a first segment and a second segment.
The piping unit according to the present invention preferably includes a bent portion.
In the piping unit according to the present invention, the fluid is preferably compressed and heated by a supercharger.
The summary of the invention above is not an exhaustive listing of essential features of the present invention and any sub-combination of these features may also fall in the invention.
Since the piping unit according to the present invention has a heat exchange structure on its inner peripheral surface, it can efficiently dissipate the heat of heated fluid flowing in the piping unit or transfer heat to cooled fluid without degrading air flow resistance. The temperature of fluid to be introduced into a cooler and the like can thereby be decreased or increased, so that downsizing of the cooler is facilitated without lowering of cooling efficiency of the cooler and the like.
A preferred embodiment for practicing the present invention is described below with reference to the drawings.
The embodiment described below is not intended to limit the subject matters set forth in the claims and not all of the combinations of features described in the embodiment are essential for a solution of the present invention.
Such a supercharger system 1 can produce higher combustion energy by increasing a density of external air to be supplied to the internal combustion engine 6 at the supercharger 2 and sending more oxygen to a combustion chamber. Consequently, it can provide sufficient output even with an internal combustion engine of smaller displacement, thus allowing improvement in fuel efficiency associated with the smaller displacement of the internal combustion engine
As shown in
As shown in
On inner peripheral surfaces of the first segment 11 and the second segment 12, a heat exchange structure 20 composed of inner heat exchange structures 20a, 20b having a certain asperity geometry is formed. Preferably, outer heat exchange structures 21a, 21b having a similar asperity geometry to that of the heat exchange structure 20 are further formed on outer surfaces of the first segment 11 and the second segment 12 as well. The asperity geometry may be formed on the entire inner and outer peripheral surfaces; however, they may instead be formed only in portions with high heat exchange effect, and other portions may be smooth inner or outer peripheral surfaces as in conventional practices.
As shown in
For a pattern of the grain texture, various known grain texture geometries can be applied, among which a speckle grain geometry such as shown in
In this manner, provision of the heat exchange structure 20 at least on the inner peripheral surface of the piping unit 10 increases the contact area between the fluid flowing in the piping unit 10 and its inner peripheral surface, which can enhance the heat exchange effect of heated fluid. Also in synergy with the outer heat exchange structures 21a, 21b formed on the outer peripheral side, the temperature of fluid to enter the cooler 4 can be decreased, facilitating downsizing of the cooler 4. In addition, as the asperity geometry is set within a range that does not affect the air flow resistance, degradation of the air flow resistance can be prevented despite formation of the heat exchange structure 20 on the inner peripheral surface of the piping unit 10.
As discussed later, the heat exchange structure 20 provides higher heat exchange effect when it is formed at a location on the inner peripheral surface of the piping unit 10 that corresponds to the bent portion.
As to the air flow resistance, as shown in
Further,
While the piping unit 10 according to this embodiment was described above as being provided with an asperity geometry by formation of grain texture on its inner and outer peripheral surfaces, a specific geometry of the heat exchange structure is not limited to it. For example, a rib 16 may be erected on the inner peripheral surface as shown in
Although the piping unit 10 according to this embodiment was described above as being composed of the first segment 11 and the second segment 12, the piping unit may also be constructed with three or more segment components.
Although the piping unit according to this embodiment was described above as being applied to a cooler of a supercharger system, an application of the present piping unit is not limited to a supercharger system but may also be applied to a radiator for cooling coolant in an internal combustion engine or a condenser for cooling refrigerant used in an air conditioning system, for example. Also, although the piping unit was described above for a case of dissipating the heat of heated fluid, it may be configured to transfer heat to cooled fluid in order to heat the cooled fluid. It is apparent from the description of claims that forms with such modifications or improvements can also fall in a technical scope of the present invention.
The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
The entire disclosure of Japanese Patent Application No. 2018-201108 filed on Oct. 25, 2018 including the specification, claims, drawings and summary is incorporated herein by reference in its entirety.
Number | Date | Country | Kind |
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2018-201108 | Oct 2018 | JP | national |