The present disclosure relates to communication headsets and, more particularly to a headset positioning assembly for a helmet-mounted headset and a headset interface which provide quick attachment and detachment and pivoting or rotating movement of an associated headset.
A communications headset positioning assembly can be detachably coupled to a modular helmet accessory attachment system or platform. The modular helmet accessory platform includes a side shroud which includes a powered headset attachment receptacle or socket. The attachment receptacle detachably receives a complementary plug on a headset positioning assembly. The plug is configured for rotational movement within the socket, allowing movement of the headset assembly between a deployed position and a stowed position. The plug includes a plurality of contact pins configured to establish and maintain electrical contact with annular contact rings disposed on a printed circuit board (PCB) housed within the side shroud. The contact rings serve as electrical pathways for transmitting signals between an associated headset on the headset positioning assembly and the modular helmet accessory platform. The contact pins maintain electrical contact with the contact rings by riding on the rings during pivoting movement.
In another aspect, a rotatable headset positioning interface is provided.
One advantage of the present development is that it allows a headset to be readily attached to and detached from a helmet.
Another advantage of the present development is that it allows a headset to be readily pivoted between a deployed position over the user's ear when the headset is in use and a stowed position over the helmet when the headset is not in use.
Another advantage of the present development resides in its ability to maintain electrical contact between the headset and the helmet accessory attachment system when the headset positioning assembly is reoriented between the deployed and stowed positions.
Still further advantages and benefits of the present invention will become apparent to those of ordinary skill in the art upon reading and understanding the following
The invention may take form in various components and arrangements of components, and in various steps and arrangements of steps. The drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the invention.
Reference will now be made in detail to presently preferred embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the invention, not limitation of the invention, which may be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present inventive concept in virtually any appropriately detailed structure. Further, the terms and phrases used herein are not intended to be limiting but rather to provide an understandable description of the present development. In fact, it will be apparent to those skilled in the art that modifications and variations can be made in the present invention without departing from the scope or spirit thereof. For instance, features illustrated or described as part of one embodiment may be used on another embodiment to yield a still further embodiment. Thus, it is intended that the present invention cover such modifications and variations as come within the scope of the appended claims and their equivalents.
The terms “a” or “an,” as used herein, are defined as one or more than one. The term “another,” as used herein, is defined as at least a second or more. The terms “including” and/or “having” as used herein, are defined as comprising (i.e., open transition). The term “coupled” or “operatively coupled,” as used herein, is defined as indirectly or directly connected.
As used in this application, the terms “front,” “rear,” “upper,” “lower,” “upwardly,” “downwardly,” “left,” “right,” and other orientation descriptors are intended to facilitate the description of the exemplary embodiment(s) of the present invention and are not intended to limit the structure thereof to any particular position or orientation.
All numbers herein are assumed to be modified by the term “about,” unless stated otherwise. The recitation of numerical ranges by endpoints includes all numbers subsumed within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).
Referring now to the drawings, wherein like reference numerals refer to like or analogous components throughout the several views,
Referring now to
The headset positioning assembly 116 includes an interface plug 120 which detachably engages an interface receptacle or socket 124 on the shroud 108. The interface plug 120 cooperates with the interface socket 124 to define a headset assembly coupling interface 130 (see
As best seen in
In operation, when the headset assembly 112 is in the inverted position as shown in
As best seen in
As best seen in
Referring now to
The interface plug 120 further includes a pivoting earpiece interconnect member 170 hingedly attached thereto. A pair of opposing, spaced apart outer arms 168 extend from the flange 164, each arm 168 having a first pivot hole 172. A pair of opposing, spaced apart inner arms 176 extend from a main body portion 174 of the interconnect member 170, each having an aligned inner pivot hole 178. Each pair of the pivot holes 172, 178 receives a pivot pin 181 (see
Electrical contact pins 182a-182f pass through respective aligned openings 186 in a pin insulator 184, which is formed of an electrically insulating material. A pin gasket 188 is disposed over the pin insulator 184 and includes aligned openings 190 for allowing a respective one of the electrical contact pins 182a-182f to pass through. The pin gasket 188 may be formed of an elastomeric material such as silicone, rubber, or other elastomeric polymer. In embodiments, the openings in the pin gasket 188 form a tight seal around the pins 182a-182f to provide environmental sealing against moisture, dust, or other potentially harmful elements. The pins 182a-182f are positioned and aligned so as to establish electrical connections with the contact pads 150a-150f, respectively. The contact pads 150a-150f, in turn, are electrically coupled to the relevant subsystems or functionalities within the helmet accessory mount platform.
In the illustrated exemplary embodiment, the contacts 150a-150f and the respective pins 182a-182f are configured to transmit power and data signals between the headset assembly 112 and the shroud 108. In certain embodiments, the pins 182a-182f are spring loaded telescoping pins, e.g., pogo pins. In certain embodiments, the contacts 150a-150f and the respective pins 182a-182f correspond to SHIELD, CC, VBUS, D+, D−, and GND. The SHIELD serves to provide shielding against electromagnetic interference (EMI) and/or radio-frequency interference (RFI). The CC (configuration channel) enables devices to negotiate power requirements and data roles, detect attachment, and so forth. The VBUS (voltage bus) carries the electrical power required for the operation of the headset assembly 112. The D+ (data positive) contact handles the transmission of positive data signals and the D− (data negative) contact handles the transmission of negative data signals. The GND connection provides a pathway for electrical currents to dissipate. In certain embodiments, the interface 130 adheres to the Universal Serial Bus (USB) 2.0 protocol.
A pin cap 192 is disposed over the pins 182a-182f. A retaining spring clip fastener 194 is provided to retain the pin cap 192, pins 182a-182f, pin insulator 184, and pin gasket 188 within counterbore 165 of the interface plug 120. In embodiments, the retaining spring clip fastener 194 is an internal spring clip which is received within a groove (not shown) formed within the counterbore 165.
Referring now to
A thumb screw 212 is disposed in the main body 174 and provides an adjustment mechanism for selectively increasing or decreasing the pivot angle between the interface plug 120 and the interconnect member 170, thereby allowing the user to selectively increase or decrease the pressure of the earpiece 122 against the user's car/head. The lower or distal end of each leg 208 includes an earpiece attachment member 222 for attaching the carpiece 122.
In certain embodiments, and as best seen in
A second pivot member 214 is carried on the outer arms 168 of the interface plug 120 which pivots about a pivot axis 226, which is parallel to the pivot axes 180 and 206. The second pivot member 214 is pivotally attached to the outer arms 168 via pivot pins 225 engaging the openings 173 (see
The second pivot member 214 includes an elongated or protruding boss 218 which features a perpendicular bore threadably receiving the shaft of the thumbscrew 212. Rotatably advancing the thumbscrew 212 within the boss 218 decreases the distance between the axis 206 and the axis 226, causes pivoting movement interconnect member 170 away from the user's head about the axis 180, thereby reducing the pressure exerted by the earpiece 122 against the head of the user. Rotatably retracting the thumbscrew 212 with respect to the boss 218 increases the distance between the axis 206 and the axis 226, causes pivoting movement of the interconnect member 170 toward the user's head about the axis 180, thereby increasing the pressure exerted by the earpiece 122 against the head of the user. That is, manual rotation of the thumbscrew 212 in a first direction pivots the interconnect member about the pivot axis 180 toward the user's head, thereby increasing the pressure of the carpiece 122 against the user's head and, conversely, manual rotation of the thumb screw 212 in a second direction opposite the first direction pivots the interconnect member about the pivot axis 180 away from the user's head, thereby decreasing the pressure of the carpiece 122 against the user's head.
Referring now to
Referring now to
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The operator interface 158 may include, for example, one or more user operable actuators, such as a rotary encoder 196, button controls 198, or the like. Other actuator types are also contemplated, such as a magnetic encoder.
In embodiments, a power negotiator circuit or subsystem 216 is coupled to the control unit 146 for facilitating power management with the headset assembly 112. In embodiments, a digital audio interface 220 is provided to receive an audio data stream, e.g., from the helmet mount accessory platform 100. Audio data is then sent to the headset assembly 112 via the headset positioning assembly 116 and the plug 120 and socket 124 interface. In optional embodiments, an RF antenna 228 is provided in the side shroud 108. In embodiments, the antenna 228 is coupled to a wireless transceiver module present at a remote location on the helmet accessory platform 100. In embodiments, an optional high-speed, low-latency interface 246 is coupled to the interface socket 124.
Referring now to
The interface plug 120 connector is coupled to a circuit board 141 within the headset assembly 112 and serves as a primary interface to the shroud 108, allowing for both digital audio transmission and input of power from an external power supply. The power supply is advantageously a remote battery pack associated with the helmet accessory attachment system of which the side shroud 108 is a part.
The interface plug 120 is operably coupled to a computer-based control unit 230 which may be microcontroller, microprocessor, or the like. The control unit 230 manages and coordinates the functionalities of the headset. The term control unit 230 as used herein is intended to encompass a processing unit operably coupled to an associated memory, the associated memory configured to store and facilitate the execution of executable program instructions by the control unit 230.
In embodiments, a wireless communications interface 232, such as a Bluetooth module or other radio frequency (RF) transceiver module, is operably coupled to the control unit 230 to facilitate wireless communication. In embodiments, the wireless communications interface 232 is a Bluetooth module to enable the headset to connect to Bluetooth-enabled devices. The wireless communications interface 232 includes an antenna 234.
In embodiments, a digital signal processor (DSP) 236 is provided to enhance audio quality by processing digital audio signal. In embodiments, the DSP 236 is configured to provide one or more features, such as noise reduction, noise cancellation, equalization, audio optimization, and so forth.
In embodiments, an audio codec 238 converts digital audio signals to analog audio signals for output to a speaker 240, which, in turn, converts the analog audio signals into human-audible output. The headset assembly 112 may optionally include a microphone 242 for capturing acoustic input and converts it to an electrical signal which is transmitted to the audio codec 238. In alternative embodiments, the microphone 242 is omitted and acoustic input from the user is captured by an external microphone, such as a microphone associated with a helmet communication system integrated with the helmet 104 or a microphone disposed elsewhere on the helmet accessory attachment platform.
In embodiments, optional manual controls 244 are provided. The control 244 may comprise one or more buttons, dials, or keys for controlling one or more settings of the headset assembly, such as increasing and decreasing volume.
The functions described herein may be implemented using various technologies, including hardware, software, and firmware. Hardware implementations may involve dedicated electronic circuits, processors, or programmable logic devices. Software implementations may utilize computer-executable instructions executed by a processor, while firmware implementations may involve a combination of both hardware and software stored in non-volatile memory. The functions described herein may be implemented in common or separate hardware components. Common hardware implementations involve the integration of multiple functions within a single physical device or system. Separate hardware implementations may distribute the functions across distinct components or devices, providing modularity and design flexibility.
The invention has been described with reference to the preferred embodiment(s). Modifications and alterations will occur to others upon a reading and understanding of the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
This application claims the priority benefit of U.S. Provisional Patent Ser. No. 63/621,230 filed Jan. 16, 2024. The aforementioned application Application is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 63621230 | Jan 2024 | US |