Various example embodiments relate to optical communication equipment and, more specifically but not exclusively, to optical transmitters and receivers.
This section introduces aspects that may help facilitate a better understanding of the disclosure. Accordingly, the statements of this section are to be read in this light and are not to be understood as admissions about what is in the prior art or what is not in the prior art.
A fiber-optic system typically employs an optical transmitter at one end of an optical fiber line and an optical receiver at the other end of the optical fiber line. Some fiber-optic systems operate by transmitting in one direction on one carrier wavelength and in the opposite direction on another carrier wavelength to achieve full duplex (FDX) operation. An FDX system can be implemented using optical transceivers, wherein each optical transceiver includes a respective optical transmitter and a respective optical receiver, which may be physically integrated. The telecom industry and its suppliers develop, manufacture, sell, and use a large variety of optical transceivers for many different applications.
Some embodiments herein include planar assemblies enabling the coupling of a plurality of optical transceivers to the same optical fiber. For example, the optical transceivers may be passive-optical-network (PON) transceivers functioning according to different data rates and/or different modulation formats. Each optical transceiver communicates using one or more different wavelength channels. At least some of the disclosed planar assemblies belong to scalable architectures. Thus, the planar assemblies may be in embodiments coupling various numbers of optical transceivers to the same end face of an optical fiber, e.g., by fixing a corresponding number of passive, slab-like optical filters to a substantially planar surface of the support substrate to which the optical transceivers are also fixed adjacent and along. Some embodiments may employ various bulk lenses fixed to said planar surface to suitably relay light-beam segments between the end face of the fiber and the optical transceivers and/or between the different slab-like optical filters. In some embodiments, a planar assembly may be configured to couple some of the optical transceivers to end faces of at least two different optical fibers.
According to an example embodiment, provided is an apparatus comprising: a substrate having a substantially planar surface; first and second optical transceivers fixed to said substrate adjacent and along said planar surface, the first and second optical transceivers having non-overlapping footprints on said planar surface; and a passive optical filter fixed to said substrate and configured to direct along said planar surface, between an end face of an optical fiber and the first optical transceiver, light of first wavelengths, and to direct along said planar surface, between the end face and the second optical transceiver, light of second wavelengths, the first wavelengths being different from the second wavelengths.
In some embodiments of the above apparatus, the apparatus further comprises a connector fixed to the substrate to stabilize an end segment of the optical fiber along said planar surface, the end segment including the end face.
Other aspects, features, and benefits of various disclosed embodiments will become more fully apparent, by way of example, from the following detailed description and the accompanying drawings, in which:
In some embodiments, system 100 complies with the ITU-T G.709/Y.1331 Recommendation, which is incorporated herein by reference in its entirety.
In an example embodiment, link 150 can be implemented using one or more spans of optical fiber 140. In addition, link 150 may optionally have one or more optical amplifiers (not explicitly shown in
In an example embodiment, WDM transceivers 102W and 102E are configured to use carrier wavelengths λ1-λ2N, with the carrier wavelengths λ1-λN being used to transmit optical signals in the Eastward direction, and the carrier wavelengths λN+1-λ2N being used to transmit optical signals in the Westward direction. In some embodiments, the carrier wavelengths may be arranged on one or more frequency (wavelength) grids, such as the frequency grids that comply with one or more of ITU-T G.694.1, ITU-T G.989.2, and ITU-T G.9807 Recommendations, which are incorporated herein by reference in their entirety. For example, different respective frequency grids may be used for the Eastward and Westward directions.
In an example embodiment, a frequency grid used in system 100 can be defined, e.g., in a frequency range between about 180 THz and about 220 THz, with a 500, 200, 100, 50, 25, or 12.5-GHz spacing of the channels therein. While typically defined in frequency units, the parameters of the grid can equivalently be expressed in wavelength units. For example, in the wavelength range from about 1528.8 nm to about 1563.9 nm, the 100-GHz spacing between the centers of neighboring WDM channels is equivalent to approximately 0.8 nm spacing. In alternative embodiments, other suitable frequency grids (e.g., flexible or having other spacing grids) can also be used.
In some embodiments, system 100 can be configured to transport polarization-division-multiplexed (PDM) signals, wherein each of the two orthogonal polarizations of each optical WDM channel can be used to carry a different respective data stream.
In an example embodiment, WDM transceiver 102W comprises N individual transceivers 1101W-110NW, where the number N is an integer greater than one. Each of transceivers 1101W-110NW comprises a respective optical transmitter (not explicitly shown in
Each of transceivers 1101W-110NW further comprises a respective optical receiver (not explicitly shown in
In an example embodiment, WDM transceiver 102E can be constructed using components similar to those of WDM transceiver 102W and configured to operate in a similar manner. A description of WDM transceiver 102E for such embodiments can therefore be substantially obtained from the above description of WDM transceiver 102W, e.g., by interchanging the subscripts E and W.
In some embodiments, system 100 may be constructed to implement a passive optical network (PON) or a part thereof. A typical PON has a point-to-multipoint architecture in which a passive optical router (e.g., a passive optical splitter) is used to enable an optical line terminal (OLT) located at a central office to send data transmissions to and receive data transmissions from optical network units (ONUs) located at different respective customer sites. In such embodiments, WDM transceiver 102W may be a part of the OLT and be constructed such that different components thereof are not farther away from each other than about 10 m. On the other hand, in a typical PON embodiment of system 100, some of individual transceivers 1101E-110NE may be separated from one another by relatively large distances, e.g., more than 20 m, and more typically by about 100 m or more. Also, MUX/DMUX 120E may be implemented using a passive optical router whose one or more components are located at a relatively large distance, e.g., 1 km or more, from any one of the individual transceivers 1101E-110NE.
Device 200 is constructed using a plurality of components and discrete elements appropriately arranged and mounted on a main surface of a substrate 202, e.g., a substantially planar surface. In other words, substrate 202 is a common substrate to some or all of those components and discrete elements. Some components and/or discrete elements may be mounted on substrate 202 using appropriate support structures, e.g., holders, mounts, connectors, etc., attached to the main surface of the substrate. The heights of such support structures may vary and be selected, e.g., to provide proper optical alignment within device 200.
As used herein, the term “substrate” refers to a circuit or device carrier, a plate, a board, or a base designed and configured to provide and/or support electrical and/or optical connections between different parts thereof to enable proper operation of electrical, optical, and/or optoelectronic components located at, mounted on, or connected to those parts. Such components may include any combination of packaged or non-packaged electronic integrated circuits, photonic integrated circuits, and discrete (e.g., lumped) elements. Electrical connections between different parts of the substrate can be formed, e.g., using patterned conducting (such as metal) layers located within the body or on the surface of the substrate and/or conventional electrical wiring. Optical connections between different optical and/or optoelectronic components on the substrate can be formed through free space, e.g., using discrete optical elements mounted on the substrate. In some embodiments, the substrate may have several distinct levels, e.g., comprising a redistribution layer (RDL), an interposer, a laminated plate, and/or a printed circuit board.
In some example embodiments, a substrate can be implemented using a semiconductor wafer, e.g. a silicon or silicon on insulator (SOI) wafer substrate, or a silicon optical bench (SiOB). A main surface of such a substrate can be micromachined to enable precise optical alignment of various optical components placed thereon.
In some embodiments, a substrate can be a substrate whose lateral dimensions (e.g., length and width) are significantly larger than its thickness. In the view shown in
A main surface of a substrate may be referred to as being substantially planar if feature-height variation thereon is significantly smaller than the smaller one of the two lateral sizes of the substrate. In some cases, a main surface of a substrate may be referred to as being substantially planar if the feature-height variation thereon is significantly smaller than the thickness of the substrate.
Device 200 comprises a laser 210, a photodiode (e.g., an avalanche photodiode, APD) 270, and an optical fiber 290, all mounted on a main (e.g., top) surface of substrate 202 to appropriately optically couple the laser and photodiode to a proximate end 288 of the fiber. Laser 210 can be used in the optical transmitter of the corresponding transceiver 110. Photodiode 270 can be used in the optical receiver of the corresponding transceiver 110.
In an example embodiment, laser 210 is a directly modulated laser configured to emit light of carrier wavelength λN+n. In operation, laser 210 emits modulated light in response to a drive signal received through an electrical port 208, e.g., from an external drive circuit or data source. Relay optics, e.g., comprising ball lenses 214 and 284, is used to couple the emitted light, through end 288, into optical fiber 290. Ball lenses 214 and 284 are both mounted on the top surface of substrate 202.
In some embodiments, laser 210 may be replaced, e.g., as known in the pertinent art, by a pulsed or continuous-wave (CW) laser outfitted with an external (e.g., located outside the laser cavity) optical modulator.
Photodiode 270 is optically coupled to end 288 of fiber 290 using ball lenses 266 and 284. Similar to ball lenses 214 and 284, ball lens 266 is mounted on the top surface of substrate 202. In response to light received from fiber 290, photodiode 270 generates a corresponding electrical output 272, which is then amplified using an electrical amplifier (e.g., transimpedance amplifier, TIA) 280. A resulting amplified signal is applied to an electrical port 282 for transmission to external circuits. In some embodiments, electrical amplifier 280 can be implemented using an integrated circuit mounted on the top surface of substrate 202.
In some embodiments, optical fiber 290 may be supported on a separate support structure, e.g., a fiber connector that is not mounted on substrate 202. The end segment of optical fiber 290 having the end face 288 may be oriented, e.g., substantially orthogonally to the main surface of substrate 202, and a mirror (not shown in
Device 200 further comprises an optical wavelength diplexer 230 mounted on the top surface of substrate 202 and optically coupled to ball lenses 214, 266, and 284, e.g., as indicated in
In an example embodiment shown in
Although, as shown in
Device 200 further comprises an optical isolator 220 located between diplexer 230 and lens 214. Optical isolator 220 is mounted on the top surface of substrate 202. In operation, optical isolator 220 transmits light substantially in one direction, e.g., as indicated in
Device 200 further comprises an optical filter 240 located between diplexer 230 and lens 266. Filter 240 is mounted on the top surface of substrate 202. The optical properties of filter 240 are selected such as to prevent most of spurious unwanted light from reaching photodiode 270. In an example embodiment, filter 240 can be a conventional band-pass optical filter or a low-pass optical filter, e.g., implemented using a colored glass plate.
In some embodiments, photodiode 270 can be replaced by a photodetector that enables coherent detection. Such a photodetector may include two or more photodiodes and, in some embodiments, an optical mixer, such as an optical hybrid or a polarization mixer. For such embodiments, a person of ordinary skill in the art will understand how to modify or replace amplifier 280 to make the resulting electrical circuit compatible with the used photodetector.
In some embodiments, some or all of ball lenses 214, 266, and 284 may be made of different respective materials (e.g., having different refractive indices) to adjust beam sizes and/or have different sizes (e.g., diameters) to adjust the beam-segment heights and angles.
In some embodiments, some or all of ball lenses 214, 266, and 284 may be replaced by suitable lenses of other shapes, e.g., various bulk optical lenses.
As shown in
Other components and elements of device 200 that have been previously described in reference to
Device 400 is constructed using many of the same device elements/components as those used in device 200 (
Device 400 comprises optical assemblies 4021 and 4022, both mounted on a main surface of substrate 202. According to the terminology used in some relevant literature, each of optical assemblies 4021 and 4022 may be referred to as a bidirectional optical sub-assembly or BOSA. That is, each of the optical assemblies 4021 and 4022 is configured to transmit and receive light via the corresponding same optical path.
In an example embodiment, optical assemblies 4021 and 4022 can be used to implement, e.g., individual optical transceivers 1101W and 1102W, respectively. In such an embodiment, optical assembly 4021 is configured to operate using carrier wavelengths λ1 and λ3; and optical assembly 4022 is configured to operate using carrier wavelengths λ2 and λ4.
An optical wavelength diplexer 430 is used in device 400 to appropriately route the corresponding optical signals between fiber 290 and optical assemblies 4021 and 4022, e.g., as indicated in
In optical assembly 4021, laser 2101 is configured to emit light of carrier wavelength λ1. Optical wavelength diplexer 2301, which is optically coupled to optical wavelength diplexer 430 as indicated in
In optical assembly 4022, laser 2102 is configured to emit light of carrier wavelength λ2. Optical wavelength diplexer 2302, which is optically coupled to optical wavelength diplexer 430 as indicated in
In some embodiments, one or both of ball lenses 414 and 484 may be replaced by suitable lenses of other shapes, e.g., various bulk optical lenses.
Device 500 is constructed using many of the same device elements/components as those used in device 400 (
Device 500 comprises an array of optical assemblies 4021-402N mounted on a main (e.g., top) surface of substrate 202. Optical assemblies 4021 and 4022 are labeled in
Optical assembly 4021′ is configured to use carrier wavelengths λ1 and λN+1. Optical assembly 4022′ is configured to use carrier wavelengths λ2 and λN+2. Optical assembly 4023 is configured to use carrier wavelengths λ3 and λN+3, and so on. Optical assembly 402N is configured to use carrier wavelengths λN and λ2N.
Device 500 further comprises a passive optical router 530 that operates to provide proper wavelength routing between optical fiber 290 and the various ones of optical assemblies 4021-402N. In an example embodiment, optical router 530 is a substantially planar optical device mounted on the top surface of substrate 202. As shown, optical router 530 comprises a sequence of optical wavelength diplexers 4301-430N and relay-optics sub-systems, wherein each of such sub-systems employs a respective pair of ball lenses 414 and 484. A person of ordinary skill in the art will understand that the shown placement of ball lenses 414 and 484 represents a non-limiting example of how the relay optics of device 500 can be configured and that other lens configurations are also possible. For example, some or all of the ball lenses 414 and 484 can be moved from the “through” optical path of passive optical router 530 to the corresponding “drop” optical paths, i.e. the optical paths between optical wavelength diplexers 430 and optical assemblies 402.
In an example embodiment, optical router 530 may have a plurality of bidirectional optical ports that include: (i) a first optical port 528; and (ii) N second optical ports 532i-532N. Optical port 528 transmits light propagating between optical wavelength diplexer 4301 and end 288 of fiber 290. Optical port 5321 transmits light propagating between optical wavelength diplexer 4301 and optical assembly 4021′. Optical port 5322 transmits light propagating between optical wavelength diplexer 4302 and optical assembly 4022′. Optical port 5323 transmits light propagating between optical wavelength diplexer 4303 and optical assembly 4023. Optical port 532N transmits light propagating between optical wavelength diplexer 430N and optical assembly 402N.
Optical wavelength diplexer 4301 is an optical filter configured to: (i) pass through the optical signals corresponding to the wavelengths λ1 and λN+1; and (ii) reflect at an angle the optical signals corresponding to the wavelengths λ2, λ3, . . . , λN, λN+2, λN+3, . . . , λ2N. The optical signals corresponding to the wavelengths λ1 and λN+1 are coupled through optical port 5321 to various optical components of optical assembly 4021′ in a manner similar to that described in reference to
Optical wavelength diplexer 4302 is an optical filter configured to: (i) pass through the optical signals corresponding to the wavelengths λ3, . . . , λN, λN+3, . . . , λ2N; and (ii) reflect at an angle the optical signals corresponding to the wavelengths λ2 and λN+2. The optical signals corresponding to the wavelengths λ2 and λN+2 are coupled through optical port 5322 to various optical components of optical assembly 4022′ in a manner similar to that described in reference to
Optical wavelength diplexer 4303 is an optical filter configured to: (i) pass through the optical signals corresponding to the wavelengths λ4, . . . , λN, λN+4, . . . , λ2N; and (ii) reflect at an angle the optical signals corresponding to the wavelengths λ3 and λN+3. The optical signals corresponding to the wavelengths λ3 and λN+3 are coupled through optical port 5323 to various optical components of optical assembly 4023 in a manner similar to that described in reference to
Optical wavelength diplexer 430N is an optical filter configured to: (i) reflect at an angle the optical signals corresponding to the wavelengths λN and λ2N; and (i) block or otherwise discard other optical signals (if present). The optical signals corresponding to the wavelengths λN and λ2N are coupled through optical port 532N to various optical components of optical assembly 402N in a manner similar to that described in reference to
In one possible alternative embodiment, optical wavelength diplexer 430N can be replaced by a mirror or other suitable light reflector.
In another possible alternative embodiment, optical wavelength diplexer 430N can be removed, and optical assembly 402N can be repositioned to directly optically couple to the next upstream optical wavelength diplexer 430 (e.g., optical wavelength diplexer 430N−1, not explicitly shown in
In an example embodiment, passive optical router 530 performs an optical function similar to that of a multi-port optical add-drop multiplexer. More specifically, such an optical add-drop multiplexer can be designed and configured to: (i) drop optical signals corresponding to the carrier wavelengths λN+1, . . . , λ2N at different respective optical ports thereof; and (ii) add optical signals corresponding to the carrier wavelengths λ1, . . . , λN at said different respective optical ports thereof. Based on the above description, a person of ordinary skill in the art will understand how to make and use alternative (e.g., grating-based) embodiments of passive optical router 530.
In some alternative embodiments, passive optical router 530 may be optically coupled to more than one optical fiber 290.
For example, in one alternative embodiment, another optical fiber 290 and another ball lens 284 can be placed in device 500 next to optical wavelength diplexer 430n (where n=2, 3, . . . , N−1) in a planar arrangement similar to that of the shown optical fiber 290, ball lens 284, and optical wavelength diplexer 4301. As a non-limiting example,
In another alternative embodiment, another optical fiber 290 and another ball lens 284 can replace one of optical assemblies 4022-402N in device 500.
A person of ordinary skill in the art will understand how to change the relevant optical characteristics of some or all of the optical wavelength diplexers 430 in the above-indicated alternative embodiments of device 500 to implement various wavelength routing schemes with respect to the shown optical fiber 290 and said another optical fiber 290.
Some wavelength plans for device 500 may rely on wavelength-diplexer slabs 430 designed for a relatively steep angle of light-beam incidence (e.g., smaller than 45 degrees with respect to the normal). In such embodiments, respective mirrors (not shown in
In an example embodiment, passive optical router 530 can be used to implement the whole or a portion of a MUX/DMUX 120 (also see
According to an example embodiment disclosed above, e.g., in the summary section and/or in reference to any one or any combination of some or all of
In some embodiments of the above apparatus, the apparatus further comprises a connector (e.g., 390,
In some embodiments of any of the above apparatus, the apparatus further comprises one or more bulk lenses (e.g., 284, 414, 484,
In some embodiments of any of the above apparatus, the one or more bulk lenses include an optical relay system (e.g., 414, 484,
In some embodiments of any of the above apparatus, each of the optical transceivers includes a respective photodiode (e.g., 270,
In some embodiments of any of the above apparatus, each of the optical transceivers includes a respective slab-like optical filter (e.g., 230,
In some embodiments of any of the above apparatus, each of the optical transceivers comprises a respective coherent optical detector that includes the respective photodiode.
In some embodiments of any of the above apparatus, the passive optical filter comprises an optical slab (e.g., 430,
In some embodiments of any of the above apparatus, the optical slab is configured to transmit therethrough light of the first wavelengths and to reflect therefrom light of the second wavelengths.
In some embodiments of any of the above apparatus, the apparatus further comprises a passive optical router (e.g., 530,
In some embodiments of any of the above apparatus, the passive optical router is fixed to said substrate adjacent and along said planar surface and has a footprint on said planar surface non-overlapping with the footprints of the first and second optical transceivers (e.g., as in
In some embodiments of any of the above apparatus, the passive optical router comprises a sequence of optical slabs (e.g., 4301-430N,
In some embodiments of any of the above apparatus, the apparatus further comprises one or more additional optical transceivers (e.g., 4023-402N,
In some embodiments of any of the above apparatus, the passive optical router is a part of an optical add-drop multiplexer.
In some embodiments of any of the above apparatus, different ones of the second optical ports are configured to transmit light of different respective non-overlapping sets of wavelengths.
In some embodiments of any of the above apparatus, each of the first and second optical ports is a bidirectional optical port.
In some embodiments of any of the above apparatus, the passive optical router is configured to receive light from or transmit light to an end face of another optical fiber (e.g., 2903,
While this disclosure includes references to illustrative embodiments, this specification is not intended to be construed in a limiting sense.
For example, while various embodiments are described above as being constructed using ball lenses, other suitable lenses and/or lens systems may also be used in at least some alternative embodiments.
Various modifications of the described embodiments, as well as other embodiments within the scope of the disclosure, which are apparent to persons skilled in the art to which the disclosure pertains are deemed to lie within the principle and scope of the disclosure, e.g., as expressed in the following claims.
Unless explicitly stated otherwise, each numerical value and range should be interpreted as being approximate as if the word “about” or “approximately” preceded the value or range.
It will be further understood that various changes in the details, materials, and arrangements of the parts which have been described and illustrated in order to explain the nature of this disclosure may be made by those skilled in the art without departing from the scope of the disclosure, e.g., as expressed in the following claims.
The use (if any) of figure numbers and/or figure reference labels in the claims is intended to identify one or more possible embodiments of the claimed subject matter in order to facilitate the interpretation of the claims. Such use is not to be construed as necessarily limiting the scope of those claims to the embodiments shown in the corresponding figures.
Although the elements in the following method claims, if any, are recited in a particular sequence with corresponding labeling, unless the claim recitations otherwise imply a particular sequence for implementing some or all of those elements, those elements are not necessarily intended to be limited to being implemented in that particular sequence.
Reference herein to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the disclosure. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments necessarily mutually exclusive of other embodiments. The same applies to the term “implementation.”
Unless otherwise specified herein, the use of the ordinal adjectives “first,” “second,” “third,” etc., to refer to an object of a plurality of like objects merely indicates that different instances of such like objects are being referred to, and is not intended to imply that the like objects so referred-to have to be in a corresponding order or sequence, either temporally, spatially, in ranking, or in any other manner.
Throughout the detailed description, the drawings, which are not to scale, are illustrative only and are used in order to explain, rather than limit the disclosure. The use of terms such as height, length, width, top, bottom, is strictly to facilitate the description of the embodiments and is not intended to limit the embodiments to a specific orientation. For example, height does not imply only a vertical rise limitation, but is used to identify one of the three dimensions of a three dimensional structure as shown in the figures. Such “height” would be vertical where the corresponding substrate is horizontal but would be horizontal where the corresponding substrate is vertical, and so on.
Also for purposes of this description, the terms “couple,” “coupling,” “coupled,” “connect,” “connecting,” or “connected” refer to any manner known in the art or later developed in which energy is allowed to be transferred between two or more elements, and the interposition of one or more additional elements is contemplated, although not required. Conversely, the terms “directly coupled,” “directly connected,” etc., imply the absence of such additional elements. The same type of distinction applies to the use of terms “attached” and “directly attached,” as applied to a description of a physical structure. For example, a relatively thin layer of adhesive or other suitable binder can be used to implement such “direct attachment” of the two corresponding components in such physical structure.
The described embodiments are to be considered in all respects as only illustrative and not restrictive. In particular, the scope of the disclosure is indicated by the appended claims rather than by the description and figures herein. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
As used in this application, the term “circuitry” may refer to one or more or all of the following: (a) hardware-only circuit implementations (such as implementations in only analog and/or digital circuitry); (b) combinations of hardware circuits and software, such as (as applicable): (i) a combination of analog and/or digital hardware circuit(s) with software/firmware and (ii) any portions of hardware processor(s) with software (including digital signal processor(s)), software, and memory(ies) that work together to cause an apparatus, such as a mobile phone or server, to perform various functions); and (c) hardware circuit(s) and or processor(s), such as a microprocessor(s) or a portion of a microprocessor(s), that requires software (e.g., firmware) for operation, but the software may not be present when it is not needed for operation.” This definition of circuitry applies to all uses of this term in this application, including in any claims. As a further example, as used in this application, the term circuitry also covers an implementation of merely a hardware circuit or processor (or multiple processors) or portion of a hardware circuit or processor and its (or their) accompanying software and/or firmware. The term circuitry also covers, for example and if applicable to the particular claim element, a baseband integrated circuit or processor integrated circuit for a mobile device or a similar integrated circuit in server, a cellular network device, or other computing or network device.
It should be appreciated by those of ordinary skill in the art that any block diagrams herein represent conceptual views of illustrative circuitry embodying the principles of the disclosure.
Number | Name | Date | Kind |
---|---|---|---|
6219470 | Tu | Apr 2001 | B1 |
6222967 | Amano | Apr 2001 | B1 |
6385374 | Kropp | May 2002 | B2 |
6493121 | Althaus | Dec 2002 | B1 |
7203391 | Uekawa | Apr 2007 | B2 |
7218451 | Lee | May 2007 | B2 |
7450858 | Verdiell | Nov 2008 | B2 |
7486846 | Warashina | Feb 2009 | B2 |
7729569 | Beer | Jun 2010 | B2 |
7945169 | Oki | May 2011 | B2 |
8165433 | Jenkins | Apr 2012 | B2 |
8335411 | Kuznia | Dec 2012 | B2 |
8469610 | Shao | Jun 2013 | B2 |
8923670 | Zbinden | Dec 2014 | B2 |
8985871 | Mizobuchi | Mar 2015 | B2 |
9191118 | Hui | Nov 2015 | B2 |
9223123 | Trzeciakowski | Dec 2015 | B2 |
9235014 | Wang | Jan 2016 | B2 |
9250401 | Lim | Feb 2016 | B2 |
9419717 | Huang | Aug 2016 | B2 |
9479258 | Wolff | Oct 2016 | B1 |
9541714 | Lim | Jan 2017 | B2 |
9709746 | Heroux | Jul 2017 | B2 |
9749054 | Ben Ezra | Aug 2017 | B2 |
9753223 | Yang | Sep 2017 | B2 |
9784919 | Wang | Oct 2017 | B2 |
9971089 | Zhang | May 2018 | B2 |
9977200 | Lin | May 2018 | B2 |
10044445 | Ho | Aug 2018 | B2 |
10222564 | Jou | Mar 2019 | B2 |
10345542 | Rockman | Jul 2019 | B2 |
20030063844 | Caracci | Apr 2003 | A1 |
20030190124 | Kuhara | Oct 2003 | A1 |
20040105161 | Tatum | Jun 2004 | A1 |
20040208601 | Tan et al. | Oct 2004 | A1 |
20050117201 | Yamane | Jun 2005 | A1 |
20050191057 | Nakamoto | Sep 2005 | A1 |
20060088255 | Wu | Apr 2006 | A1 |
20060274999 | Wu | Dec 2006 | A1 |
20070280605 | Mendoza | Dec 2007 | A1 |
20080055589 | Asami | Mar 2008 | A1 |
20080226228 | Tamura | Sep 2008 | A1 |
20080247713 | Tamura | Oct 2008 | A1 |
20090034983 | Shinoda | Feb 2009 | A1 |
20100086310 | Lee | Apr 2010 | A1 |
20100209103 | Sakigawa | Aug 2010 | A1 |
20100267049 | Rutter | Oct 2010 | A1 |
20110058771 | Lee | Mar 2011 | A1 |
20110311229 | Kondo | Dec 2011 | A1 |
20130039662 | Brooks | Feb 2013 | A1 |
20150104129 | Nakagawa | Apr 2015 | A1 |
20150153522 | Nakagawa | Jun 2015 | A1 |
20150188659 | Lipson et al. | Jul 2015 | A1 |
20160164612 | Wilks et al. | Jun 2016 | A1 |
20190140761 | Chan et al. | May 2019 | A1 |
Entry |
---|
International Telecommunication Union Recommendation, Recommendation G.709/Y.1331, “Interfaces for the optical transport network”, Jun. 2016: (244 pages). |
International Telecommunication Union Recommendation, Recommendation G.989.2, “40-Gigabit-capable passive optical networks 2 (NG PON2): Physical media dependent (PMD) layer specification”, Feb. 2019: (122 pages). |
International Telecommunication Union Recommendation, Recommendation G.9807.2, “10 Gigabit-capable passive optical networks (XG(S)-PON): Reach extension”, Aug. 2017: (48 pages). |
International Telecommunication Union Recommendation, Recommendation G.694.1, “Spectral grids for WDM applications: DWDM frequency grid”, Feb. 2012: (16 pages). |
Huh, Joon Young, et al. “Highly alignment tolerant and high-sensitivity 100Gb/s (4× 25Gb/s) APD-ROSA with a thin-film filter-based de-multiplexer.” Optics Express 24.24 (2016): pp. 27104-27114. |
Murao, Tadashi, et al. “Integrated Spatial Optical System for Compact 28-GB/sx4-lane Transmitter Optical Subassemblies.” IEEE Photonics Technology Letters 26.22 (2014): pp. 2275-2278. |
Jung, Youngbeom, et al. “Four-channel signal-receiver optical subassembly module using a thin-film filter-based coarse-wavelength-division-multiplexing demultiplexer for monitoring 22.9-kV XLPE cable joints.” Optical Engineering 57.10 (2018): 100505. |
Choi, Jae-Shik, et al. “Optical coupling efficiency of bidirectional transceiver sub-module with refractive index control.” Technical Digest. CLEO/Pacific Rim'99. Pacific Rim Conference on Lasers and Electro-Optics (Cat. No. 99TH8464). vol. 4. IEEE. (1999): pp. 1208-1209. |
Mikkelsen, Benny “Tackling Capacity and Density Challenges by Electro-photonic Integration”, Presentation, Optical Fiber Communication Conference and Exhibition (OFC), San Diego, California (2019): (32 pages). |
Harstead, E. et al., “Optimal split ratio and channel capacity of point to multipoint networks for FITL.” Proc. IEEE 4th Workshop on Optical Local Networks, 1992: (8 pages). |
Number | Date | Country | |
---|---|---|---|
20210058158 A1 | Feb 2021 | US |