This Application is a Divisional Application of Ser. No. 09/629,922, now U.S. Pat. No. 6,359,362 filed on Jul. 31, 2000.
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| Entry |
|---|
| J. Intrater, “Review of Some Processes For Ceramic-To-Metal Joining”, Materials & Manufacturing Processes, 8(3), 353-373 (1993). |
| “Sputtering Target Bonding”, ATI Materials. “A New Direction In Surface Analysis”, TTS 100 Oryn Technology Corporation. |
| “Electromagnet Systems”, ATI Magnetics. “SurgX™ ESD Protection On Board”, Oryx Technology Corporation, Feb. 1995. |
| James Intrater, “Intragene™ Metallization on 96% A1203 And A1N: Solder Pull Strength Data”, pp. 1-3, Oryx Technology Corporation. |
| James Intrater, “Intragene™ Metallization On CVD-Diamond Coated Si3N4”, pp. 1-3, Oryx Technology Corporation. |
| James Intrater. “The Challenge of Bonding Metals to Ceramics”, Technical Bulletin, Ceramic/Metal Bonding, Advanced Technology, Inc., Reprinted from Machine Design Nov. 23, 1989. |
| James Intrater, “How to Select the Right Metallization/Joining Method”, Advanced Technology, Inc., Reprinted from Ceramic Industry Feb. 1991, Business News Publishing Company. |
| Francis W. Sears, Mark W. Zemansky, Hugh D. Young, “University Physics”, Sixth Edition. |