Claims
- 1. An electrochemical device assembly, comprising:
a porous electrically conductive support layer; a prefabricated electrochemical device layer; and a bonding layer between said support layer and said electrochemical device layer.
- 2. An electrochemical device assembly as recited in claim 1, wherein said support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 3. An electrochemical device assembly as recited in claim 2, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 4. An electrochemical device assembly as recited in claim 1, wherein said bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 5. An electrochemical device assembly as recited in claim 4, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 6. An electrochemical device assembly as recited in claim 1, further comprising:
a second porous electrically conductive support layer bonded to said electrochemical device layer, wherein said electrochemical device layer is positioned between said support layers.
- 7. An electrochemical device assembly as recited in claim 6, wherein said second support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 8. An electrochemical device assembly as recited in claim 7, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 9. An electrochemical device assembly as recited in claim 6, further comprising:
a second bonding layer between said second porous support layer and said electrochemical device.
- 10. An electrochemical device assembly as recited in claim 9, wherein said second bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 11. An electrochemical device assembly as recited in claim 10, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 12. An electrochemical device assembly as recited in claim 1, wherein said electrochemical device layer comprises a first electrode layer, a second electrode layer, and an electrolyte layer positioned between said electrode layers that is at least 90% dense.
- 13. An electrochemical device assembly as recited in claim 1, further comprising:
a gas duct sealably connected to said porous support layer.
- 14. An electrochemical device assembly as recited in claim 13, wherein said gas duct is sealably connected to said porous support layer using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 15. An electrochemical device assembly as recited in claim 6, further comprising:
a first gas duct sealably connected to said first porous support layer; and a second gas duct sealably connected to said second porous support layer.
- 16. An electrochemical device assembly as recited in claim 15, wherein said gas ducts are sealably connected to said porous support layers using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 17. An electrochemical device assembly, comprising:
a porous electrically conductive support plate; a plurality of edgewise separated prefabricated electrochemical devices; a bonding layer between said support plate and each said electrochemical device; and sealant between edges of said electrochemical devices.
- 18. An electrochemical device assembly as recited in claim 17, wherein said support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 19. An electrochemical device assembly as recited in claim 18, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 20. An electrochemical device assembly as recited in claim 17, wherein said bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 21. An electrochemical device assembly as recited in claim 20, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 22. An electrochemical device assembly as recited in claim 17, further comprising:
a second porous electrically conductive support layer bonded to said electrochemical devices, wherein said electrochemical devices are positioned between said support layers.
- 23. An electrochemical device assembly as recited in claim 22, wherein said second support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 24. An electrochemical device assembly as recited in claim 23, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 25. An electrochemical device assembly as recited in claim 22, further comprising:
a second bonding layer between said second porous support layer and said electrochemical devices.
- 26. An electrochemical device assembly as recited in claim 25, wherein said second bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 27. An electrochemical device assembly as recited in claim 26, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 28. An electrochemical device assembly as recited in claim 17, wherein said electrochemical device layer comprises a first electrode layer, a second electrode layer, and an electrolyte layer positioned between said electrode layers that is at least 90% dense.
- 29. An electrochemical device assembly as recited in claim 17, further comprising:
a gas duct sealably connected to said porous support layer.
- 30. An electrochemical device assembly as recited in claim 29, wherein said gas duct is sealably connected to said porous support layer using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 31. An electrochemical device assembly as recited in claim 22, further comprising:
a first gas duct sealably connected to said first porous support layer; and a second gas duct sealably connected to said second porous support layer.
- 32. An electrochemical device assembly as recited in claim 31, wherein said gas ducts are sealably connected to said porous support layers using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 33. A method of fabricating an electrochemical device assembly, comprising:
providing a porous electrically conductive support layer; providing a prefabricated electrochemical device layer; and bonding said support layer and said electrochemical device layer with a bonding layer.
- 34. A method as recited in claim 33, wherein said support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 35. A method as recited in claim 34, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 36. A method as recited in claim 34, wherein said bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 36. A method as recited in claim 36, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 37. A method as recited in claim 33, further comprising:
bonding a second porous electrically conductive support layer to said electrochemical device layer with a second bonding layer, wherein said electrochemical device layer is positioned between said support layers.
- 38. A method as recited in claim 37, wherein said second support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 39. A method as recited in claim 38, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 40. A method as recited in claim 37, wherein said second bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 41. A method as recited in claim 40, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 42. A method as recited in claim 33, wherein said electrochemical device layer comprises a first electrode layer, a second electrode layer, and an electrolyte layer positioned between said electrode layers that is at least 90% dense.
- 43. A method as recited in claim 33, further comprising:
providing a gas duct; and sealably connecting said gas duct to said porous support layer.
- 44. A method as recited in claim 43, wherein said gas duct is sealably connected to said porous support layer using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 45. A method as recited in claim 37, further comprising:
providing a first gas duct; sealably connected said first gas duct to said first porous support layer; providing a second gas duct; and sealably connecting said second gas duct to said second porous support layer.
- 46. A method as recited in claim 45, wherein said gas ducts are sealably connected to said porous support layers using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 47. A method for fabricating an electrochemical device assembly, comprising:
providing a porous electrically conductive support plate; providing a plurality of edgewise separated prefabricated electrochemical devices; providing a bonding layer between said support plate and each said electrochemical device; and providing a sealant between edges of said electrochemical devices.
- 48. A method as recited in claim 47, wherein said support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 49. A method as recited in claim 48, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 50. A method as recited in claim 47, wherein said bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 51. A method as recited in claim 50, wherein said Ag compound comprises Ag0.6CU0.4Ti0.01.
- 52. A method as recited in claim 47, further comprising:
providing a second porous electrically conductive support layer; and bonding said second support layer to said electrochemical devices with a second bonding layer; wherein said electrochemical devices are positioned between said support layers.
- 53. A method as recited in claim 52, wherein said second support layer comprises a material selected from the group consisting essentially of a porous metal alloy, a wire mesh, a sintered porous metallic powder, and a perforated metallic sheet.
- 54. A method as recited in claim 53, wherein said porous metallic powder comprises a material selected from the group consisting essentially of powdered metal, metal-ceramic, and FeCr.
- 55. A method as recited in claim 52, wherein said second bonding layer comprises a material selected from the group consisting essentially of a metal alloy, a metal-ceramic material, a brazing material, and an Ag compound.
- 56. A method as recited in claim 55, wherein said Ag compound comprises Ag0.6Cu0.4Ti0.01.
- 57. A method as recited in claim 47, wherein said electrochemical device layer comprises a first electrode layer, a second electrode layer, and an electrolyte layer positioned between said electrode layers that is at least 90% dense.
- 58. A method as recited in claim 47, further comprising:
providing a gas duct; and sealably connecting said gas duct to said porous support layer.
- 59. A method as recited in claim 58, wherein said gas duct is sealably connected to said porous support layer using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
- 60. A method as recited in claim 52, further comprising:
providing a first gas duct; sealably connecting said first gas duct to said first porous support layer; providing a second gas duct; and sealably connecting said second gas duct to said second porous support layer.
- 61. A method as recited in claim 60, wherein said gas ducts are sealably connected to said porous support layers using a seal selected from the group consisting essentially of compression seals, crimp seals, welds and brazes.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority from U.S. provisional application serial No. 60/449,095 filed on Feb. 20, 2003, incorporated herein by reference, and from U.S. provisional application serial No. 60/375,515 filed on Apr. 24, 2002, incorporated herein by reference.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] This invention was made with government support under Grant (Contract) No. DE-AC03-76F00098 awarded by the United States Department of Energy. The government has certain rights to this invention.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60375515 |
Apr 2002 |
US |
|
60449095 |
Feb 2003 |
US |