Patent Application
20090016079
The present invention relates to a side-light-type planar lighting apparatus and particularly to a planar lighting apparatus used as illuminating means of a liquid crystal display device.
A liquid crystal display device is widely used in display means or the like of electronic equipment at present but since the liquid crystal display device is not self-luminous, illuminating means for ensuring visibility at night and in dark places is needed. A planar lighting apparatus has been used as such illuminating means.
As a type of the planar lighting apparatus, a side-light-type planar lighting apparatus is widely used. The side-light-type planar lighting apparatus comprises a light guide plate with light transmittance, a rod-state light source arranged on a side end face of the light guide plate or one or more point-like light sources as basic elements. As a recent trend, in accordance with an increase in applications of planar lighting apparatuses to small-sized electronic equipment such as personal digital assistants, a planar lighting apparatus of the type provided with a point-like light source capable of simplification of a driving circuit is used, and a white LED (hereinafter also referred to simply as an LED) is frequently used as a point-like light source.
In the above side-light-type planar lighting apparatus, in order to promote higher brightness, it is important to realize close contact between a light-emitting face of the LED and a side end face (hereinafter referred to as light-incoming face) of a light guide plate on which the LED is arranged and to maintain high bonding efficiency between the LED and the light guide plate. Therefore, when the LED is arranged on the light-incoming face of the light guide plate, a circuit board such as a flexible print circuit board (hereinafter also referred to as FPC) on which the LED is mounted is affixed to the light guide plate using a double-sided adhesive tape, for example, by which a position and attitude of the LED with respect to the light-incoming face of the light guide plate is stably maintained in conventional practice.
On the other hand, there is a problem with this type of maintaining means in that close contact between the LED and the light guide plate may decrease due to displacement occurring at affixation between the FPC and the light guide plate, inclination when mounting the LED on the FPC and the like. Thus, in order to increase the bonding efficiency between the LED and the light guide plate, a planar lighting apparatus of the type that the LED is accommodated in a recess portion or the like formed on the light guide plate is proposed (See Patent Document 1 and Patent Document 2, for example).
Patent Document 1: Japanese Examined Utility Model Publication No. 4-14943 (FIG. 1)
Patent Document 2: Japanese Unexamined Patent Application Publication No. 2004-213943 (claim 1, claim 2, FIG. 1, FIG. 3)
However, with the planar lighting apparatus described in Patent Document 1, for example, as shown in a perspective view in
Also, in general, planar lighting apparatuses are requested to promote thinning while higher and more uniform brightness is achieved all the time, and since taking-out efficiency of light from an LED chip is improved and thickness for a sheath member portion is not needed any more, it is preferable to use an LED on which a translucent resin sealing the LED chip is formed so as to be exposed. However, in arrangement configuration of a planar lighting apparatus 200 shown in
The present invention was made in view of the above problems and has an object to provide a planar lighting apparatus which promotes thinning while higher and more uniform brightness is achieved by maintaining an LED on a light-incoming face of a light guide plate easily and stably.
In order to solve the above problems, in a planar lighting apparatus according to the present invention provided with a light guide plate and an LED arranged on a light-incoming face of the light guide plate, the light guide plate has a pressing portion integrally formed with the light guide plate and opposite the light-incoming face with a predetermined gap, and the LED is held between the pressing portion and the light-incoming face and pressed into contact with the light-incoming face by elastic action of the pressing portion.
According to the present invention, by integrally forming the pressing portion with the light guide plate and arranging the LED in pressure contact with the light-incoming face of the light guide plate by the elastic action of the pressing portion, the LED is held in a proper attitude without having an inclination or the like with respect to the light-incoming face of the light guide plate and close contact between the light-emitting face and the light-incoming face of the light guide plate can be increased. And thus, the bonding efficiency between the LED and the light guide plate can be increased, which contributes to higher brightness of the planar lighting apparatus.
Moreover, in the present invention, the LED and the light guide plate preferably have mutually complementary convexoconcave structure at a contact portion between the LED and the light guide plate, by which when the LED is arranged on the light-incoming face of the light guide plate, the above convexoconcave structure is fitted to each other and the LED can be surely positioned at a predetermined position of the light-incoming face.
As above, in the planar lighting apparatus according to the present invention, by using a member such as a double-sided adhesive tape, an adhesive and the like, without requiring a process to fix a circuit board on which the LED is mounted or the LED itself to the light guide plate, the position and attitude of the LED to the light-incoming face of the light guide plate can be maintained properly and stably, by which higher brightness can be achieved without increasing the manufacturing costs of the planar lighting apparatus.
Also, in a mode of the present invention, the convexoconcave structure includes a projection portion formed on the light-emitting face of the LED and a cutaway portion formed on the light-incoming face of the light guide plate corresponding to the shape of the projection portion.
By this arrangement, the close contact between the light-emitting face of the LED and the light-incoming face of the light guide plate is further increased, and light emission distribution of the light incident to the light guide plate from the LED can be made equivalent to the light emission distribution of the single LED, which contributes to more uniform brightness of the planar lighting apparatus.
Also, in another mode of the present invention, the LED has a light-emitting portion in which a translucent resin sealing an LED chip is exposed, and the light-emitting portion is arranged without protruding in a direction crossing the light guide plate from the light-incoming face.
Since the translucent resin sealing the LED chip is exposed, the thickness for a sheath member portion is not increased but thinning of the planar lighting apparatus is promoted. Also, by arranging this type of LED without protruding its light-emitting portion in a direction crossing the light guide plate from the light-incoming face, generation of lost light can be restricted, and high taking-out efficiency of light provided at the LED with the sealing resin exposed can be effectively utilized so as to make brightness of the planar lighting apparatus higher.
Moreover, the LED is mounted on the circuit board and at the pressing portion of the light guide plate, a recess portion in which fixing means provided with an adhesive layer on both sides is accommodated may be formed so that the circuit board and the pressing means are fixed to each other by the fixing means.
By accommodating the fixing means such as the double-sided adhesive tape in the pressing portion with the recess portion formed and by fixing the circuit board on which the LED is mounted to the light guide plate by the fixing means, the LED is arranged without projecting the light-emitting portion in a direction crossing the light guide plate from the light-incoming face. At that time, since the light-emitting portion of the LED is not covered by the circuit board, generation of lost light due to absorption or the like into the circuit board and fixing means can be restricted, high taking-out efficiency of light provided at the LED with the sealing resin exposed is effectively utilized, and higher brightness of the planar lighting apparatus can be achieved. Also, by fixing the circuit board to the light guide plate, the position of the LED in a direction crossing the light guide plate can be accurately positioned.
Since the present invention is configured as above, by maintaining the LED on the light-incoming face of the light guide plate easily and stably, thinning of the planar lighting apparatus can be promoted while higher and more uniform brightness is achieved.
a) is a plan view illustrating the planar lighting apparatus shown in
An embodiment of the present invention will be described below on the basis of the attached drawings, in which
In the following explanation, a longitudinal direction of the light-incoming face 3 is set as an X direction, a direction perpendicular to the light-incoming face 3 as a Y direction, and a direction crossing the light guide plate 2 (thickness direction of the light guide plate 2) as a Z direction, and a direction of the planar lighting apparatus 10 and its components are referred to on the basis of this coordinate system when necessary.
The LED 11 comprises a substrate portion 12 on which an LED chip (not shown) is mounted and a light-emitting portion 13 in which a translucent resin sealing an LED chip is exposed. The light-emitting portion 13 has a base portion 13e forming an outline of a substantial rectangular solid with the substrate portion 12 and a projection portion 13a constituted by a cylindrical face projecting forward (in the Y direction) from the base portion 13e, and a front face 14 (hereinafter referred to as light-emitting face) including this cylindrical face is arranged opposite the light-incoming face 3 of the light guide plate 2.
In this embodiment, the LED 11 preferably emits pseudo-white light by mixture of blue light emitted from the LED chip and yellow light emitted from a fluorescent substance absorbing the blue light and converting it to a long wavelength, and in this case, the light-emitting portion 13 made of a translucent resin may have a structure consisting of a layer in which yttrium, aluminum, and garnet (YAG) particles activated by cerium, which is a yellow luminescent material, are mixed in a hard silicon resin, and a transparent hard silicon resin layer is added on its periphery.
The light guide plate 2 is a plate-state light guide body made preferably by injection molding of a translucent resin such as acrylic resin, polycarbonate resin, amorphous polyolefin resin and the like, and the pressing portion 5 is integrally molded during the injection molding of the light guide plate 2. The above-mentioned resin materials are suitable as a material of a light guide plate from the viewpoint that they are excellent in terms of optical and molding characteristics and have relatively favorable elastic characteristics. For example, the bending elastic modulus, according to ASTM D-790 of acrylic resin, of polycarbonate resin is approximately 2,000 to 3,000 MPa in general, and the pressing portion 5 integrally molded with the light guide plate 2 has a considerable spring characteristic against flexural deformation caused by expansion of the gap d. Since the projection portion 13a of the LED 11 is constructed so as to have a cylindrical face, the cutaway portion 3a formed on the light-incoming face 3 of the light guide plate 2 also has a cylindrical face formed in substantially the same shape as that of the projection portion 13a of the LED 11.
In the light guide plate 2 shown in
As above, since the LED 11 is held between the pressing portion 5 and the light-incoming face 3 so that the light-emitting face 14 is brought into close contact with the light-incoming face 3, the LED 11 is not displaced in the Y direction, inclined in the azimuthal angle Φ direction shown in
In the present invention, the complementary convexoconcave structure at the contact portion between the LED 11 and the light guide plate 2 is not limited to a case of configuration by a cylindrical face such as the projection portion 13a and the cutaway portion 3a in this embodiment, but the projection portion of the LED may be constructed so as to have a cylindrical face and by adjusting a ratio between the projecting height and the radius as appropriate, the LED with a good balance between an amount of outgoing light forward and a wide-angle characteristic of the light emission distribution can be realized. Also, by accommodating and arranging this type of projection portion in the cutaway portion having a complementary shape with respect to the projection portion, the light emission distribution after light entrance into the light guide plate can be made equivalent to the light emission distribution of the single LED, which is advantageous for higher and more uniform brightness of the planar lighting apparatus 10.
Also, though not shown, the LED 11 is usually mounted on a circuit board such as a flexible print circuit board (FPC) and the like, and the circuit board is arranged along a major face 4 of the light guide plate 2, for example. However, according to the planar lighting apparatus of the present invention, since the LED 11 is positioned with respect to the light-incoming face 3 on the basis of the elastic action of the pressing portion 5 generated by holding the LED 11 by the pressing portion 5 and the light-incoming face 3 as mentioned above, without requiring a member and a process for fixing the circuit board on which the LED 11 is mounted to the light guide plate 2 or a member and a process for fixing the LED 11 itself to the light guide plate 2 as the conventional planar lighting apparatus, the LED 11 can be maintained on the light-incoming face 3 properly and stably.
Moreover, the LED 11 in this embodiment has a structure in which the light-emitting portion 13 is exposed as mentioned above, which contributes to thinning of the planar lighting apparatus. At the same time, by taking out the outgoing light from the LED chip from the entire light-emitting face 14 with high efficiency, higher brightness of the planar lighting apparatus can be promoted. In the planar lighting apparatus 10, as shown in
However, the planar lighting apparatus according to the present invention may have a structure in which the light guide plate and the circuit board on which the LED is mounted are fixed together using fixing means such as double-sided adhesive tape or the like, and such a preferred embodiment in that case will be described below referring to
As above, by fixing the FPC 16 to the light guide plate 21, the LED 11 can be positioned in the Z direction with respect to the light-incoming face 3 with more certainty. Also, in the planar lighting apparatus 20, the fixation between the FPC 16 and the light guide plate 21 is accomplished on the pressing portion 25 on the back face side of the LED 11, and no light is lost by absorption or the like of the fixing means 15. Moreover, since the fixing means 15 is accommodated in the recess portion 25a, the FPC 16 is arranged so that its mounting face 16a is substantially flush with the major face 4 of the light guide plate 21, and as mentioned above, the LED 11 is arranged without protruding the light-emitting portion 13 from the light-incoming face 3 of the light guide plate 21 in the Z direction.
Here, in the LED 11 in this embodiment, the outgoing light from the LED chip is taken out also from the side face other than the light-emitting face 14 of the light-emitting portion 13, and in order to effectively utilizes such outgoing light, a reflector may be laminated and arranged on either or both of an upper face 13c and a lower face 13d of the light-emitting portion 13. At that time, a mounting form of the LED 11 onto the FPC 16 is preferably such that, as shown in
As such a reflector, a reflector in which a metal thin film with high reflectivity such as aluminum, silver and the like is formed on a thin resin substrate is preferable in terms of slimness and reflection characteristics but a reflector formed by applying a white or milky white paint on a thin resin base, a white resin board made of a resin mixed with a white pigment, or a metal thin plate with high reflectivity such as aluminum, silver and the like may be used. This mounting form of the LED onto the FPC is preferable also for a case where the FPC is not fixed to the light guide plate.
In the planar lighting apparatus according to the present invention, the convexoconcave structure formed at the contact portion between the LED and the light guide plate may be formed on the back faces of the pressing portion and the LED.
The preferred embodiments of the planar lighting apparatus according to the present invention have been described above using the LED 11 having the light-emitting portion 13 in which the translucent resin sealing the LED chip is exposed, but the planar lighting apparatus according to the present invention is also applied to the LED provided with a sheath member made of a white resin or the like. Also, the LED to be used does not have to have a projection portion on the light-emitting face but as shown in
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-095061 | Mar 2005 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2005/021258 | 11/18/2005 | WO | 00 | 10/12/2007 |
