Claims
- 1. A planar monolithic self-oscillating mixer for millimeter wave applications comprising:
- a gallium arsenide substrate having a bottom surface and a top surface;
- a via hole extending from said bottom surface to said top surface of said substrate;
- a metal plating on said bottom surface of said substrate and in said via hole;
- a first N.sup.+ gallium arsenide layer disposed above said via hole at said top surface of said substrate;
- a N gallium arsenide layer disposed on said first N.sup.+ gallium arsenide layer;
- a second N.sup.+ gallium arsenide layer disposed on said N gallium arsenide layer;
- said first and second N.sup.+ gallium arsenide layers and said N gallium arsenide layer forming a plateau having an upper surface;
- a radio frequency transmission line disposed on said upper surface of said substrate having one end adjacent to but spaced from said plateau and extending to one edge of said substrate;
- an intermediate frequency transmission line having one end connected to the upper surface of said plateau and extending to an edge of said substrate opposite to said one edge;
- a portion of said intermediate frequency transmission line being disposed on said upper surface of said substrate; and
- a bias line connected to said intermediate frequency transmission line and extending to an edge of said substrate.
- 2. A planar monolithic self-oscillating mixer for millimeter wave applications in accordance with claim 1 further including:
- a low pass filter in said intermediate frequency transmission line, whereby radio frequency will not propagate past said low pass filter.
- 3. A planar monolithic self-oscillating mixer for millimeter wave applications in accordance with claim 1 further including:
- a capacitor in said intermediate frequency transmission line disposed between said connection of said bias line to said intermediate frequency transmission line and said edge of said substrate opposite to said one edge.
- 4. A planar monolithic self-oscillating mixer for millimeter wave applications in accordance with claim 3 wherein:
- said capacitor is a beam lead capacitor.
- 5. A planar monolithic self-oscillating mixer for millimeter wave applications comprising:
- a gallium arsenide substrate having a bottom surface and a top surface;
- a via hole extending from said bottom surface to , said top surface of said substrate;
- a metal plating on said bottom surface of said substrate and in said via hole;
- a first N+ gallium arsenide layer disposed above said via hole at said top surface of said substrate;
- a N gallium arsenide layer disposed on said first N+ gallium arsenide layer;
- a second N+ gallium arsenide layer disposed on said N gallium arsenide layer;
- said first and said second N+ gallium arsenide layers and said N gallium arsenide layer forming a plateau having an upper surface;
- a radio frequency transmission line disposed on said upper surface of said substrate having one end adjacent to but spaced from said plateau and extending to one edge of said substrate;
- an intermediate frequency transmission line having one end connected to the upper surface of said plateau and extending to an edge of said substrate opposite to said one edge;
- a low pass filter in said intermediate frequency transmission line;
- a portion of said intermediate frequency transmission line being disposed on said upper surface of said substrate;
- a bias line connected to said intermediate frequency transmission line and extending to an edge of said substrate; and
- a beam lead capacitor in said intermediate frequency transmission line disposed between said connection of said bias line to said intermediate frequency transmission line and said edge of said substrate opposite to said one edge.
- 6. A method of fabricating a planar monolithic self-oscillating mixer on a semi-insulating gallium arsenide substrate having a bottom surface and a top surface comprising the steps of:
- forming a via hole in said substrate extending from said bottom surface to said top surface;
- plating metal on said bottom surface of said substrate and in said via hole to form a heat sink;
- epitaxially depositing a first N.sup.+ gallium arsenide layer on said top surface of said substrate;
- epitaxially depositing a N gallium arsenide layer on said first N.sup.+ gallium arsenide layer;
- epitaxially depositing a second N.sup.+ gallium arsenide layer on said N layer;
- mesa etching away said N.sup.+ and N layers in areas not above said heat sink to form a plateau;
- plating ohmic metal on said second N.sup.+ layer to form a contact;
- disposing a microstrip radio frequency transmission line on said top surface of said substrate with one end adjacent to but spaced from said plateau and extending to one edge of said substrate;
- connecting one end of a microstrip intermediate frequency line having a low pass filter and a beam lead capacitor therein to said contact and disposing a portion of said intermediate frequency line on said top surface of said substrate extending to an edge of said substrate opposite said one edge;
- connecting a bias line to said intermediate frequency transmission line between said low pass filter and said beam lead capacitor and extending said bias line to an edge of said substrate.
Government Interests
The invention described herein may be manufactured, used and licensed by or for the Government for Governmental purposes without the payment to me of any royalties thereon.