1. Field of the Invention
The invention relates to a reactor and, more particularly, to a planar reactor capable of reducing coil loss effectively.
2. Description of the Related Art
In electronic equipment, it is necessary to use a magnetic component to achieve filtering or energy storage for circuit design. For example, a reactor is applied to a variable-frequency drive or an inverter. To enhance operating efficiency or rotational speed (torque) of a motor, it tends to use the variable-frequency drive or the inverter to drive the motor. As technology advances and develops, the existing products are requested to be light, thin, short and small. Accordingly, a reactor with large current design, which is applied to the variable-frequency drive or the inverter, also has to be flatted. However, after flatting the reactor with a core, the thickness of upper/lower board of the reactor will decrease. Under magnetic flux conservation scheme, the width of the pillar of the core will also decrease. To satisfy the requirement of saturation current for the core, the pillar of the core must have a specific cross-sectional area. Therefore, the length of the pillar of the core will increase, such that the ratio of the length to the width of the pillar of the core will increase. If the ratio of the length to the width of the pillar of the core increases, the winding circumference of the coil will also increase, such that the cost and loss of the coil will increase correspondingly.
The invention provides a planar reactor capable of reducing coil loss effectively, so as to solve the aforesaid problems.
According to an embodiment of the invention, a planar reactor comprises a core and a coil. The core comprises an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor, and the pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor, and a second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor, wherein the first end is opposite to the second end.
As mentioned in the above, since the pillar and at least one of the upper board and the lower board are coplanar at the first side of the planar reactor and the pillar is sunk into the winding space from the second side of the planar reactor, the width of the pillar can be increased and the length of the pillar can be decreased while the cross-sectional area of the pillar is constant. Accordingly, the ratio of the length to the width of the pillar will decrease. Therefore, the invention can flat the planar reactor and satisfy the requirement of saturation current for the core. Furthermore, since the ratio of the length to the width of the pillar decreases, the winding circumference of the coil will also decrease, so as to reduce the amount and loss of coil. Moreover, since one end of the coil can be hidden in the winding space partially or wholly, the invention can prevent the coil from protruding out of the core to occupy outside space.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Referring to
As shown in
As shown in
Since the pillar 12, the lower board 10a and the upper board 10b are coplanar at the first side S1 of the planar reactor 1, and the pillar 12 is sunk into the winding space 16 from a second side S2 of the planar reactor 1, the width W of the pillar 12 can be increased and the length L of the pillar 12 can be decreased while the cross-sectional area of the pillar 12 is constant. Accordingly, the ratio of the length to the width L/W of the pillar 12 will decrease. Therefore, the invention may selectively make a vertical thickness T1 of the lower board 10a be smaller than a horizontal thickness T3 of the first side wall 13a or a horizontal thickness T4 of the second side wall 13b, or make a vertical thickness T2 of the upper board 10b be smaller than the horizontal thickness T3 of the first side wall 13a or the horizontal thickness T4 of the second side wall 13b, so as to reduce the total height of the planar reactor 1. Accordingly, the invention can flat the planar reactor 1 and satisfy the requirement of saturation current for the core. As shown in
Referring to Table 1 below, Table 1 records the relationship between the width W of the pillar 12, the direct-current resistance Rdc of the planar reactor 1 and the ratio of the length L to the width W of the pillar 12. As shown in Table 1, when the width W of the pillar 12 is between 8 mm and 150 mm, the direct-current resistance Rdc of the planar reactor 1 may be reduced to be smaller than or equal to 20.1 m Ohm (Ω) and the requirement of saturation current can be satisfied. Accordingly, the width W of the pillar 12 may be preferably between 8 mm and 150 mm. When the width W of the pillar 12 is between 8 mm and 150 mm, the ratio of the length L to the width W of the pillar 12 (i.e. L/W) is about between 68.438 and 0.195. Furthermore, when the width W of the pillar 12 is between 20 mm and 150 mm, the direct-current resistance Rdc of the planar reactor 1 may be reduced to be smaller than or equal to 9.5 m Ohm. Accordingly, the width W of the pillar 12 may be preferably between 20 mm and 150 mm. When the width W of the pillar 12 is between 20 mm and 150 mm, the ratio of the length L to the width W of the pillar 12 (i.e. L/W) is about between 10.950 and 0.195. Moreover, a half of the width W of the pillar 12 (i.e. W/2) may be smaller than or equal to the vertical thickness T1 of the lower board 10a or the vertical thickness T2 of the upper board 10b (W/2≤T1 or W/2≤T2), or a half of the width W of the pillar 12 (i.e. W/2) may be smaller than or equal to the horizontal thickness T3 of the first side wall 13a or the horizontal thickness T4 of the second side wall 13b (W/2≤T3 or W/2≤T4)
Referring to
Referring to
Referring to
Referring to
Referring to
The arrangement and principle of the lower board 10a, the upper board 10b, the coil 14 and the air gap sheet 30 are mentioned in the above, so those will not be depicted herein again.
The wire ends 14a, 14b of the coil 14 may be led out from the wire holes 500a, 500b of the first side board 50a, respectively. The heat conducting members 58a, 58b, 58c may be formed with one of the first side board 50a, the second side board 50b and the third side board 50c integrally. The heat conducting members 58a, 58b, 58c may also be fixed on one of the first side board 50a, the second side board 50b and the third side board 50c (e.g. fixed by screws). To enhance insulation and voltage withstanding characteristics (e.g. larger than 2.5 k V), the coil does not contact the heat conducting members 58a, 58b, 58c directly and selectively, and the pouring sealant 56 is located between the coil 14 and the heat conducting members 58a, 58b, 58c. There is a safety distance between the coil 14 and the heat conducting members 58a, 58b, 58c and the pouring sealant 56 may be made of a material with better insulation characteristic. The heat generated by the coil 14 in the winding space 16 can be conducted to a package casing (not shown) or outside through the pouring sealant 56, any or all of the heat conducting members 58a, 58b, 58c, the first side board 50a, the second side board 50b and the third side board 50c in order. The heat conducting members 58a, 58b, 58c may be rectangular or other suitable shapes according to practical applications. The two heat sinks 52 may be disposed at opposite sides of the core consisting of the lower board 10a, the upper board 10b and the pillar 12. In other words, the two heat sinks 52 may be disposed outside the planar reactor 5. The invention may form a plurality of screw holes on the two heat sinks 52, the first side board 50a, the second side board 50b, the third side board 50c and the fourth side board 50d, such that the screws 54 can fix and join the first side board 50a, the second side board 50b, the third side board 50c and the fourth side board 50d with the two heat sinks 52 by the screw holes and at least one surface of the two heat sinks 52 contacts the first side wall 13a or the second side wall 13b, so as to complete the assembly of the planar reactor 5 shown in
In general, the coil 14 is a main heat source of the planar reactor 5. Since a thermal conductivity of the core consisting of the lower board 10a, the upper board 10b and the pillar 12 (larger than about 10 W/mk) is larger than a thermal conductivity of the pouring sealant 56 (about 0.2 W/mk to 3 W/mk), the pouring sealant 56 will increase heat transfer impedance. The invention may dispose the heat conducting members 58a, 58b, 58c at the first end 140 of the coil 14, so as to reduce heat transfer impedance effectively, wherein the heat conducting member 58a may be disposed at one side of the first end 140 of the coil 14 and the heat conducting members 58b, 58c may be disposed at the other side of the first end 140 of the coil 14. Preferably, the thermal conductivity of the heat conducting members 58a, 58b, 58c may be between 100 W/mk and 400 W/mk. Furthermore, the heat conducting members 58a, 58b, 58c may be made of, but not limited to, thermal conductive plastic, aluminum, ceramic or graphite. It should be noted that the heat conducting members 58b, 58c may also be formed integrally, so the heat conducting members 58b, 58c are not limited to two single pieces. Moreover, the invention may only dispose the heat conducting member 58a at one side of the first end 140 of the coil 14 without disposing the heat conducting members 58b, 58c at the other side of the first end 140 of the coil 14. The thermal conductivity of the heat conducting members 58a, 58b, 58c is larger than the thermal conductivity of the pouring sealant 56.
Referring to Table 2 below, Table 2 shows temperature simulation results of different embodiments of the invention. The simulation conditions of Table 2 are set as follows: (1) analysis type: steady state; (2) convection velocity: 3 m/s; (3) coil loss: 102 W; core loss: 4.44 W; and (5) environmental temperature: 50° C.
As shown in Table 2, when the heat conducting member is disposed at the first end 140 of the coil 14, thermal diffusivity and temperature uniformity of the planar reactor 5 can be enhanced effectively.
Referring to
In this embodiment, the terminal base 72 comprises an upper base 720, a lower base 722, two first terminals 724a, 724b and two second terminals 726a, 726b. An end of the first terminal 724a may be jointed with a hole 7260a of the second terminal 726a, such that the first terminal 724a and the second terminal 726a form a first connecting terminal. An end of the first terminal 724b may be jointed with a hole 7260b of the second terminal 726b, such that the first terminal 724b and the second terminal 726b form a second connecting terminal. The jointing manner may be implemented by screw connection or welding. The first connecting terminal or the second connecting terminal may be an integral structure. The terminal base 72 is not limited to up-down structure consisting of the upper base 720 and the lower base 722 and may be left-right structure or front-rear structure according to practical applications. The hole 7260a of the second terminal 726a is disposed above a hole 7220a of the lower base 722 and the hole 7260b of the second terminal 726b is disposed above a hole 7220b of the lower base 722. The first terminal 724a passes through a hole 7200a of the upper base 720 to be located in an accommodating space 7202a and the first terminal 724b passes through a hole 7200b of the upper base 720 to be located in an accommodating space 7202b. An extending portion 7262a of the second terminal 726a extends downwardly from an edge of the accommodating space 7202a to be electrically connected to a wire end 740a of the connecting wire 74 and an extending portion 7262b of the second terminal 726b extends downwardly from an edge of the accommodating space 7202b to be electrically connected to a wire end 740b of the connecting wire 74. In this embodiment, the connecting wire 74 may be a multi-strand wire, which is covered by an insulation layer and flexible. The connecting wire 74 may be connected to the wire ends 14a, 14b of the coil 14 and the second terminals 726a, 726b by metal members. Furthermore, the invention may use two screws 76 to fix the upper base 720 and the lower base 722 on the package casing 70.
As shown in
In some embodiments, the first terminal (or the second terminal) may contact and slide with respect to an inclined surface (not shown) in the accommodating space, such that the first terminal and the second terminal can move in the accommodating space upwardly and downwardly. The outer diameter of the second terminals 726a, 726b is not limited to be larger than the diameter of the holes 7200a, 7200b of the upper base 720. For example, the second terminals 726a, 726b and the holes 7200a, 7200b of the upper base 720 may be dislocation structures (not shown). That is to say, the second terminals 726a, 726b and the holes 7200a, 7200b of the upper base 720 may be dislocated with respect to each other, such that the second terminals 726a, 726b will abut against the inner of the accommodating spaces 7202a, 7202b as the first terminal and the second terminal are moving upwardly and downwardly, so as to achieve stop function.
Referring to
When the first terminals 724a, 724b move in the accommodating spaces 7202a, 7202b upwardly to the lower surface of the circuit board 80, the first terminals 724a, 724b will drive the second terminals 726a, 726b and the connecting wire 74 to move upwardly. Since the extending portion 7262a of the second terminal 726a extends downwardly from the edge of the accommodating space 7202a to be electrically connected to the wire end 740a of the connecting wire 74 and the extending portion 7262b of the second terminal 726b extends downwardly from the edge of the accommodating space 7202b to be electrically connected to the wire end 740b of the connecting wire 74, the screws 78a, 78b will not contact the second terminals 726a, 726b or the connecting wire 74 while passing through the accommodating spaces 7202a, 7202b downwardly.
Since the first terminals 724a, 724b can move upwardly while the screws 78a, 78b are screwed downwardly, poor contact or stress concentration of the circuit board 80 will not occur even if two distances between the first terminals 724a, 724b and the circuit board 80 are different.
Referring to
Referring to
The main difference between the planar reactor 7′ and the aforesaid planar reactor 7 is that, in the planar reactor 7′, the first terminals 724a′, 724b′ are fixed on the terminal base 72 and screw end 7242a, 7242b of the first terminals 724a′, 724b′ extend out of the terminal base 72, as shown in
Referring to
As mentioned in the above, since the pillar and at least one of the upper board and the lower board are coplanar at the first side of the planar reactor and the pillar is sunk into the winding space from the second side of the planar reactor, a sunk space is located at one side of the pillar, such that the width of the pillar can be increased and the length of the pillar can be decreased while the cross-sectional area of the pillar is constant. Accordingly, the ratio of the length to the width of the pillar will decrease. Therefore, the invention can flat the planar reactor and satisfy the requirement of saturation current for the core. Furthermore, since the ratio of the length to the width of the pillar decreases, the winding circumference of the coil will also decrease, so as to reduce the amount and loss of coil. Moreover, since one end of the coil can be hidden in the winding space partially or wholly, the invention can prevent the coil from protruding out of the core to occupy outside space. The invention may dispose the air gap sheet in the air gap between the pillar and the board, so as to reduce noise. In addition, the invention may dispose the heat conducting member at the exposed coil by the pouring sealant, so as to enhance thermal diffusivity and temperature uniformity of the planar reactor.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
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