Claims
- 1. A method for planarizing a substrate having surface irregularities, which comprises coating a planarizing material on a substrate having surface irregularities to form a film, followed by heating to fluidize and heat-cure the film, wherein the planarizing material comprises:
- a homopolymer or a copolymer polymerized from at least one monomer selected from the group consisting of a (meth) acrylic monomer, a styrene monomer and a vinyl alcohol monomer as the main component in a polymer;
- a heat-curing agent selected from the group consisting of a melamine heat-curing agent, an epoxy heat-curing agent and a mixture thereof; and
- a halation-preventive agent having a functional group reactive for an addition reaction with at least one of said homopolymer or copolymer, said heat-curing agent and the halation-preventive agent.
- 2. The planarizing method according to claim 1, wherein said monomer is a (meth) acrylic monomer comprising structural units of the following formula (1), and the heat-curing agent is a melamine heat-curing agent comprising structural units of the following formula (2) or an epoxy heat-curing agent: ##STR9## wherein each of R.sub.1, R.sub.2 and R.sub.3 is hydrogen or a methyl group, each of A.sub.1, A.sub.2 and A.sub.3 is OB.sub.1 or NB.sub.2 B.sub.3, wherein each of B.sub.1, B.sub.2 and B.sub.3 is hydrogen, a C.sub.1-6 alkyl, alkenyl or hydroxyalkyl group, a C.sub.2-12 epoxy group, a C.sub.6-12 aryl group or a C.sub.7-12 aralkyl group, and each of x, y and z is a positive number inclusive of 0 and they satisfy the following formulas:
- .ltoreq. x/(x+y+z).ltoreq.1
- 0.ltoreq.y/(x+y+z).ltoreq.1
- 0.ltoreq.z/(x+y+z).ltoreq.1 ##STR10## wherein Y is --NX.sub.5 X.sub.6 or a phenyl group, and each of X.sub.1 to X.sub.6 is hydrogen or --CH.sub.2 OZ, wherein Z is hydrogen or a C.sub.1-5 alkyl group.
- 3. The planarizing method according to claim 1, wherein said monomer is a (meth) acrylic monomer comprising structural units of the following formula (3) or (4), the heat-curing agent is a melamine heat-curing agent comprising structural units of the following formula (2) or an epoxy heat-curing agent, and the halation-preventive agent is a benzophenone compound comprising structural units of the following formula (5): ##STR11## wherein Y is -NX.sub.5 X.sub.6 or a phenyl group, and each of X.sub.1 to X.sub.6 is hydrogen or --CH.sub.2 OZ, wherein Z is hydrogen or a C.sub.1-5 alkyl group, ##STR12## wherein each of R.sub.4, R.sub.5 and R.sub.6 is hydrogen or a methyl group, and each of A.sub.4 and A.sub.5 is OB.sub.4 or NB.sub.5 B.sub.6, wherein each of B.sub.4, B.sub.5 and B.sub.6 is hydrogen, a C.sub.1-6 alkyl, alkenyl or hydroxyalkyl group, a C.sub.2-12 epoxy group, a C.sub.6-12 aryl group or a C.sub.7-12 aralkyl group, and each of x, y and z is a positive number inclusive of 0 and they satisfy the following formulas:
- .ltoreq. x/(x+y+z).ltoreq.1
- 0.ltoreq.y/(x+y+z).ltoreq.1
- 0.ltoreq.z/(x+y+z).ltoreq.1 ##STR13## wherein each of R.sub.7, R.sub.8 and R.sub.9 is hydrogen or a methyl group, each of A.sub.6 and A.sub.7 is OB.sub.7 or NB.sub.8 B.sub.9, wherein each of B.sub.7, B.sub.8 and B.sub.9 is hydrogen, a C.sub.1-6 alkyl, alkenyl or hydroxyalkyl group, a C.sub.2-12 epoxy group, a C.sub.6-12 aryl group or a C.sub.7-12 aralkyl group, and each of x, y and z is a positive number inclusive of 0 and they satisfy the following formulas:
- .ltoreq. x/(x+y+z).ltoreq.1
- 0.ltoreq.y/(x+y+z).ltoreq.1
- 0.ltoreq.z/(x+y+z).ltoreq.1 ##STR14## wherein each of R.sub.10 to R.sub.18 is hydrogen or --OW, wherein W is hydrogen or a C.sub.1-6 alkyl group, provided that at least one of R.sub.10 to R.sub.18 is --OH.
- 4. The planarizing method according to claim 1, wherein the planarizing material further contains an acid-generating curing catalyst which exhibits a catalytic activity.
- 5. The planarizing method according to claim 4, wherein the curing catalyst is an onium salt compound.
- 6. The planarizing method according to claim 1, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 7. A method for planarizing a substrate having surface irregularities, which comprises coating a planarizing material on a substrate having surface irregularities to form a film, followed by heating to fluidize and heat-cure the film, wherein the planarizing material consists essentially of:
- a resin selected from the group consisting of an acrylic resin, a styrene resin and a polyvinyl alcohol;
- a heat-curing agent selected from the group consisting of a melamine heat-curing agent, an epoxy heat-curing agent and mixtures thereof; and a halation-preventive agent having a functional group reactive for an addition reaction with at least one of said resin and said heat-curing agent.
- 8. The planarizing method according to claim 2, 3, 1, or 7, wherein the planarizing material further contains a curing catalyst which exhibits a catalytic activity under heating and which has a functional group reactive for an addition reaction with at least one of said resin, said heat-curing agent, said halation-preventive agent and the curing catalyst.
- 9. The planarizing method according to claim 8, wherein the curing catalyst is an aromatic amine of the following formula (6) or an acid anhydride having at least one --COOH group or a mixture thereof: ##STR15## wherein each of R.sub.19 to R.sub.21 is hydrogen or a C.sub.1-5 alkyl group, provided that at least one of R.sub.19 to R.sub.21 is hydrogen, and D is a methylene group, a carbonyl group, a sulfide group, a sulfoxide group or a sulfone group.
- 10. The planarizing method of claim 7, said resin having a glass transition temperature of 65.degree. C. or lower.
- 11. The planarizing method according to claim 2, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 12. The planarizing method according to claim 1, wherein the planarizing material is in the form of a solution having the planarizing material didsolved in a solvent.
- 13. The planarizing method according to claim 3, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 14. The planarizing method according to claim 9, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 15. The planarizing method according to claim 4, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 16. The planarizing method according to claim 5, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 17. The planarizing method according to claim 8, wherein wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 18. The planarizing method according to claim 7, wherein the planarizing material is in the form of a solution having the planarizing material dissolved in a solvent.
- 19. The planarizing method according to claim 8, wherein the curing catalyst is an aromatic amine of the following formula (6) or an acid anhydride having at least one --COOH group or a mixture thereof: ##STR16## wherein each of R.sub.19 to R.sub.21 is hydrogen or a C.sub.1-5 alkyl group, provided that at least one of R.sub.19 to R.sub.21 is hydrogen, and D is a methylene group, a carbonyl group, a sulfide group, a sulfoxide group or a sulfone group.
- 20. The planarizing method of claim 7, wherein said resin has a property of being able to planarize the substrate at a temperature lower than 200.degree. C.
Priority Claims (2)
Number |
Date |
Country |
Kind |
3-199878 |
Jul 1991 |
JPX |
|
3-337977 |
Nov 1991 |
JPX |
|
Parent Case Info
This application is a Continuation of application Ser. No. 07/913,614, filed on Jul. 16, 1992, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3980602 |
Jakubauskas |
Sep 1976 |
|
4983545 |
Gokan et al. |
Jan 1991 |
|
5212046 |
Lamola et al. |
May 1993 |
|
Foreign Referenced Citations (9)
Number |
Date |
Country |
54014437 |
Feb 1979 |
JPX |
1-142606 |
Jun 1989 |
JPX |
3-8652 |
Feb 1991 |
JPX |
3-81122 |
Dec 1991 |
JPX |
4-12301 |
Jan 1992 |
JPX |
4-133002 |
May 1992 |
JPX |
4-132729 |
May 1992 |
JPX |
4-133001 |
May 1992 |
JPX |
5320579 |
Dec 1993 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
913614 |
Jul 1992 |
|