Claims
- 1. A device for depositing a coating orthogonal to the surface of one or more wafers and onto a photoresist pattern that may be present upon the surface of the one or more wafers comprising:
one or more domes having a constant radius about a centerpoint, the one or more domes rotating about a first axis that runs through the centerpoint; a source material positioned at the centerpoint; one or more wafers positioned within each of the one or more domes, wherein each dome and the one or more wafers rotate about a second axis that runs through the centerpoint and through the center of each dome such that a wafer in the one or more wafer holders is rotating about both the first and second axis simultaneously and such that the coating is deposited upon the surface and photoresist pattern that may be present upon the one or more wafers.
- 2. The device of claim 1 wherein the coating deposited is substantially uniform and orthogonal to the surface and photoresist pattern of the one or more wafers without the use of a uniformity mask positioned between the source and the one or more wafers.
- 3. The device of claim 1 wherein the first axis is between the one or more domes and the second axis is between the one or more wafers of each dome.
- 4. The device of claim 1 further comprising a support structure that positions and rotates the domes about the first axis.
- 5. The device of claim 4 wherein the support structure positions the domes such that the arc of the domes is aligned with the circumference of a sphere having its center at the centerpoint.
- 6. The device of claim 4 wherein the support structure comprises a drive system that rotates the one or more domes about their respective second axis.
- 7. A vapor deposition device comprising:
a source of material to be vaporized; dome shaped wafer holders positioned such that each point of a first face of the wafer holders is equidistant from the source, each wafer holder having a dome axis that passes through the center of the wafer holder and the source, the dome shaped wafer holders rotating one or more wafers within the holders about the dome axis; and a rotating structure holding the dome shaped wafer holders and rotating the holders about a centerline axis of the source.
- 8. The vapor deposition device of claim 7 wherein the material vaporized travels along a trajectory normal to each point of the first face of the dome shaped wafer holders and deposits a coating on the wafers substantially normal to the surface of the wafers.
- 9. The vapor deposition device of claim 8 wherein the material vaporized produces a coating upon the surface of the wafer or a photoresist pattern on the surface of the wafer thereby allowing lift-off of the coating deposited on the photoresist pattern on the surface of the wafer.
- 10. The vapor deposition device of claim 7 wherein the rotating structure comprises one or more pulleys, gears, shafts, or motors for rotating the dome shaped wafer holders.
- 11. The vapor deposition device of claim 10 wherein the vapor deposition device further comprises a motor that rotates the rotating structure.
- 12. A method for producing a lift-off coating on a wafer comprising:
evaporating material from a source; rotating a wafer within a wafer holder about a first axis that passes through the center of the wafer holder and the source, the wafer holder positioned such that a center point of each wafer is equidistant from the source; and rotating the wafer holder about a second axis that passes through the source.
- 13. The method of claim 12 wherein the material vaporized travels along a trajectory normal to the center point of each wafer and deposits a coating on the wafers substantially normal to the surface of the wafers.
- 14. The method of claim 12 wherein the material vaporized produces a coating upon the surface of the wafer or a surface parallel to the surface to the wafer thereby allowing lift-off of the coating deposited on a surface parallel to the surface of the wafer.
- 15. The method of claim 12 wherein rotating the wafer and rotating the wafer holder occur simultaneously.
- 16. A vapor deposition device comprising:
a source of material to be vaporized; a means for positioning wafers such that the center of each wafer is equidistant from the source, the means for positioning the wafers rotating the wafers about a first axis that passes through the source; a means for rotating the means for positioning wafers about a second axis that passes through the source.
- 17. The vapor deposition device of claim 16 wherein the means for positioning and the means for rotating rotate the wafers about the first and second axes simultaneously thereby moving each wafer on a similar path through a vapor cloud.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to U.S. Pat. No. 6,342,103 to Ramsay, entitled “Multiple Pocket Electron Beam Source,” which is hereby incorporated by this reference in its entirety. This application is also related to U.S. Pat. No. 6,287,385 to Kroneberger, entitled “Spring clip for sensitive substrates,” which is hereby incorporated by this reference in its entirety.