Patent Application
20060061277
This application claims priority to and the benefit of Korean Patent Application No. 10-2004-0075410 filed in the Korean Intellectual Property Office on Sep. 21, 2004, the entire content of which is incorporated herein by reference.
(a) Field of the Invention
The present invention relates to a technology for fabricating a plurality of substrates using one mother glass, and more particularly, to a technology for uniformly applying a dielectric layer on each of a plurality of substrates fabricated from one mother glass.
(b) Description of the Related Art
A plasma display panel (PDP) is a device for displaying images using a gas discharge phenomenon. PDP has excellent benefits in multiple display characteristics, such as brightness, contrast, after-image, and viewing angle, over other display device types. A PDP is formed by combining a front plate and a rear plate together. The front plate is created by forming a display electrode and a dielectric layer on a front substrate. The rear plate is created by forming an address electrode, a dielectric layer, barrier ribs partitioning discharge cells, and a phosphor layer on a rear substrate.
A pair of display electrodes are formed on the front substrate corresponding to each discharge cell. The display electrodes are covered with the dielectric layer that protects the display electrodes and induces charged particles. Similarly, an address electrode is formed on the rear substrate corresponding to each discharge cell. The address electrode is covered with the dielectric layer, thereby protecting the address electrode.
Such dielectric layers covering the display electrodes and the address electrode are formed through various methods such as a printing method, dry film method, or coating method, after forming the display electrodes and the address electrode respectively on the front substrate and the rear substrate. The printing method forms the dielectric layer using a printing device. The dry film method forms the dielectric layer by laminating a dry film resistor (DFR) and then baking it. The coating method forms the dielectric layer by directly spraying a dielectric material onto the electrodes using a coating device.
The coating method forms the dielectric layer by spraying dielectric material paste using a coating device, as a result, the thickness of the dielectric layer may be relatively thin, during an early stage of injection, because an amount of the sprayed dielectric material paste may be relatively small during that period due to the viscosity of the paste and the friction between the paste and an inner surface of a nozzle of the coating device. On the other hand, a thickness of the dielectric layer may be relatively thick, at a region where the injection ceases, because an amount of the sprayed dielectric material paste may be relatively great in that region. Consequently, it is difficult to form a dielectric layer having a uniform thickness on the substrate. Furthermore, such a problem becomes much more serious when a plurality of substrates are fabricated using one mother glass.
In the case where a dielectric layer is formed on one mother glass that will be divided into a plurality of substrates, the dielectric layers are formed by intermittently spraying dielectric material paste for respective substrates. That is, because spraying of dielectric material paste is stopped at a region between neighboring substrates, it is difficult to form a dielectric layer with a uniform thickness over the whole substrate.
The embodiments of the present invention provide a manufacturing method for a plasma display panel having the features of forming at least one substrate having a uniform thickness from one mother glass and a plasma display panel manufactured by this method.
An exemplary plasma display panel according to one embodiment of the present invention includes a first substrate and a second substrate, a barrier rib, address electrodes, a phosphor layer, display electrodes, and a first dielectric layer. The first and second substrates are disposed facing each other. The barrier rib is disposed between the first and second substrates and forms discharge cells. The address electrodes are formed running in one direction on the first substrate corresponding to the discharge cells. The phosphor layer is formed in each discharge cell. Display electrodes are formed running in a second direction on the second substrate crossing the address electrodes. A first dielectric layer covers the address electrodes. The first dielectric layer is formed, in the direction of the length of the address electrodes, continuing up to at least one of the edges of the first substrate.
The first substrate may include a display area and a non-display area surrounding the display area. The first dielectric layer may be formed starting from the non-display area positioned near one edge of the first substrate continuing up to an opposite edge of the first substrate.
The first dielectric layer may be formed with a first thickness in a first portion of the first dielectric layer on the non-display area positioned near the one edge of the first substrate and with a second thickness, which is different from the first thickness, in the remaining portion of the first dielectric layer.
The second thickness may be greater than the first thickness, and the second thickness may be uniform over the whole of the remaining portion.
In a further embodiment, the plasma display panel may further include a second dielectric layer covering the display electrodes. The second dielectric layer may be formed, in the direction of the length of the address electrodes, continuing up to at least one of the edges of the second substrate.
The second substrate may include a display area and a non-display area surrounding the display area. The second dielectric layer may be formed starting from the non-display area, which is positioned near one edge of the second substrate, continuing up to an opposite edge of the second substrate.
The second dielectric layer may be formed with a first thickness in a first portion of the second dielectric layer on the non-display area positioned near the one edge and with a second thickness, which is different from the first thickness, in the remaining portion of the second dielectric layer.
The second thickness may be greater than the first thickness, and the second thickness may be uniform over the whole remaining portion of the second dielectric layer.
An exemplary manufacturing method for a plasma display panel according to one embodiment of the present invention includes fabricating a first plate by forming address electrodes and a first dielectric layer covering the address electrodes on a first substrate, fabricating a second plate by forming display electrodes and a second dielectric layer covering the display electrodes on a second substrate, combining the first and second plates together, evacuating a space between the first and second plates, and injecting a discharge gas into a discharge space between the first and second plates. In fabricating the first plate, the first dielectric layer is formed, in the direction of the length of the address electrodes, up to at least one of the edges of the first substrate.
A manufacturing method for a plasma display panel according to another embodiment of the present invention includes fabricating a plurality of first plates respectively provided with address electrodes and a first dielectric layer covering the address electrodes from a first mother glass, fabricating a plurality of second plates respectively provided with display electrodes and a second dielectric layer covering the display electrodes from a second mother glass, combining the first and second plates together, evacuating a space between the first and second plates, and injecting a discharge gas into a discharge space between the first and second plates.
Fabricating the first plate includes forming the first dielectric layer on the address electrodes formed on the first mother glass, and cutting the first mother glass into respective first plates in a direction crossing the length of the address electrodes.
A dielectric material paste may be continuously applied in a direction of the length of the address electrodes.
Each of the first plates may include a display area and a non-display area surrounding the display area. In the forming of the first dielectric layer, the first dielectric layer may be sprayed onto the first plate starting from the non-display area, which is positioned near one edge of the first plate, continuing up to an opposite edge of the first plate.
The first dielectric layer may be formed with a first thickness in a first portion of the first dielectric layer on the non-display area, which is positioned near one edge of the first plate, and with a second thickness, which is different from the first thickness, in the remaining portion of the first dielectric layer.
The second thickness may be greater than the first thickness, and the second thickness may be uniform over the whole remaining portion.
Each of the second plates may include a display area and a non-display area surrounding the display area. In the fabricating of the second plate, the second dielectric layer may be sprayed on the second plate starting from the non-display area, which is positioned near one edge of the second plate, continuing up to an opposite edge of the second plate.
The second dielectric layer may be formed having a first thickness in a first portion of the second dielectric layer on the non-display area, which is positioned near one edge of the second plate, and with a second thickness, which is different from the first thickness, in the remaining portion of the second dielectric layer.
Embodiments of the present invention will hereinafter be described in detail with reference to the accompanying drawings, wherein like reference characters indicate like reference elements in each view.
Referring to
In order to generate plasma discharge in the discharge cells 7 as mentioned above, the rear plate 100 includes an address electrodes 11 formed on the rear substrate 1 corresponding to the discharge cells 7, and the front plate 200 includes display electrodes 13 and 15 formed on the front substrate 3 corresponding to the discharge cells 7.
The address electrodes 11 are formed running in one direction (i.e., the y-axis direction in the drawing) on the rear substrate 1. The address electrodes 11 are disposed in parallel across the x-axis in the drawing each disposed below a gap in the barrier ribs 5 corresponding to the discharge cells 7. The display electrodes 13 and 15 are laid out in a second direction (i.e., the x-axis direction in the drawing) crossing the address electrodes 11. The display nodes 13 and 15 are laid out in parallel and are disposed across the y-axis, crossing the gap corresponding to the discharge cells 7. A pair of display electrodes 13 and 15 are disposed across each discharge cell 7.
The address electrodes 11 are covered with a first dielectric layer 17 for accumulating a wall charge and protecting the address electrodes 11. The display electrodes 13 and 15 are both covered with a second dielectric layer 19 and a protective layer 21.
Barrier ribs 5 are formed on the first dielectric layer 17. The phosphor layer 9 is formed on an inner surface of the barrier ribs 5 and on a portion of the surface of the first dielectric layer 17 within the discharge cells 7.
The first dielectric layer 17 and the second dielectric layer 19 may be formed through various methods. In one embodiment, they are formed with a uniform thickness in order to obtain a uniform wall charge accumulation and a uniform discharge voltage in the discharge cells 7.
The embodiments provide a manufacturing method capable of uniformly forming the dielectric layer. This method will be explained in greater detail referring to FIGS. 2 to 4B.
Referring to the drawings, in a PDP manufacturing method according to the exemplary embodiments, the rear plate 100 and the front plate 200 are formed in separate processes, and the rear and front plates 100 and 200 are then combined together. Subsequently, air is evacuated from the discharge cells 7, formed between the two plates 100 and 200, and a discharge gas is injected into the discharge cells 7. Subsequently, the discharge cells 7 are sealed, thereby completing manufacture of the PDP. Related manufacturing processes excepting the process for fabricating the rear plate 100 and the front plate 200 in the manufacturing method according to the embodiments of the present invention discussed herein can be done as is generally known in the art, so further detailed explanations for these related processes will be omitted for sake of clarity.
The process of fabricating the rear plate 100 may be performed as follows. First, the rear substrate 1 is inserted, then the address electrodes 11 are formed on the rear substrate 1, the first dielectric layer 17 is formed on the address electrodes 11 to cover the address electrodes 11, and the barrier ribs 5 and the phosphor layer 9 are consecutively formed on the first dielectric layer 17.
The process of fabricating the front plate 200 may be performed as follows. The front substrate 3 is inserted, the display electrodes 13 and 15 are formed on the front substrate 3, and the second dielectric layer 17 and the protective layer 19 are consecutively formed on the display electrodes 13 and 15.
In the exemplary embodiments, one rear plate can be fabricated from one mother glass. It is also possible that a plurality of rear plates are fabricated from one mother glass.
When a plurality of rear plates are fabricated from one mother glass, the processes for forming the address electrodes 11, the first dielectric layer 17, the barrier ribs 5 and the phosphor layer 9 may be separately performed depending on a number of rear plates to be created. The process for fabricating a rear plate further includes cutting one mother glass into a plurality of rear plates. That is, referring to
Similarly, one front plate can be fabricated from one mother glass, and it is also possible that a plurality of front plates are fabricated from one mother glass.
When a plurality of front plates are fabricated from one mother glass, the processes for forming the display electrodes 13 and 15, the second dielectric layer 19, and the protective layer 21 may be separately performed depending on a number of front plates to be created. The process for fabricating a front plate further includes cutting one mother glass into a plurality of front plates. That is, referring to
The processes for forming the address electrodes 11, the barrier ribs 5 and the phosphor layer 9 can be performed as is known in the art, and the processes for forming the display electrodes 13 and 15 and the protective layer 21 can be performed as is known in the art, so further detailed explanations for these processes will be omitted for sake of clarity.
In the manufacturing method according to the example embodiment, the first dielectric layer 17 is formed over the address electrodes 11 in the direction of the length of the address electrodes 11, covering the address electrodes and the surface of the rear substrate up to at least one of the opposing edges of the rear substrate 1 that are disposed along the length of the rear substrate running the same direction as the address electrodes 11.
To form the dielectric layer 17, a dielectric material paste is continuously applied using a coating device (not shown) in a direction ‘a’ (i.e., the y-axis direction in the drawing) of the arrow in
During the coating, a thickness of the first dielectric layer 17 may be varied depending on a viscosity of the dielectric material paste, friction between the dielectric material paste and an inner surface of a nozzle of the coating device, spraying time, and similar phenomena.
Each rear substrate may include a display area 1b (or 2b) and a non-display area 1a and 1c (or 2a and 2c) surrounding the display area. The first dielectric layer 17 may be formed with a first thickness t1 on a portion of the non-display area 1a positioned near one edge of the first substrate The first dielectric may be formed with a second thickness t2, which is different from the first thickness t1, on a remaining portion of the first substrate. Referring to
In particular, the first dielectric layer 17 is formed with a first thickness t1 on a portion on the non-display area 1a and with the second thickness t2 on a remaining portion of the substrate, i.e., a portion on the display area 1b, the non-display area 1c, the outside area 1d, the outside area 2d, the non-display area 2a, the display area 2b, and the non-display area 2c. During this process, the second thickness t2 may be greater than the first thickness t1. Further, the second thickness t2 may be uniform over the whole remaining portion of the substrate.
The dielectric material paste is continuously applied up to a portion on the non-display area 2c disposed near the edge of the second rear plate 102. At this point, the first dielectric layer 17 may be formed with a third thickness t3 on a portion of the non-display area 2c. The third thickness t3 may be greater than the second thickness t2.
In the case that two sheets of first and second rear plates 101 and 102 are formed using one mother glass 40, referring to
The first dielectric layer 17 is formed with the first thickness t1 at an early stage of applying the dielectric material, then the second thickness t2 while the dielectric material is continuously applied, and the third thickness t3 at a final stage of applying the dielectric material.
In the case where one rear substrate is fabricated from one mother glass or more than two rear substrates are fabricated from one mother glass, the first dielectric layer 17 may also be formed with three thicknesses t1, t2, and t3.
In the manufacturing method according to the exemplary embodiments, in the case that two rear plates are formed from one mother glass, the first dielectric layer 17 of each of the formed rear plates is formed starting with a portion near one edge of the rear plate continuing up to the opposite edge of the rear plate. Accordingly, in a portion of the rear substrate where the first dielectric layer 17 is not formed, the address electrodes are exposed to form a terminal.
In the process for manufacturing the front plate 200, the second dielectric layer 19 is formed on the display electrodes 13 and 15 in a similar way to the process for manufacturing the rear plate 100.
Referring to
The process for forming the second dielectric layer 19 is performed along a direction ‘b’ (i.e., in the direction that the address electrodes runs, or the y-axis in the drawings) in
In the process for forming the second dielectric layer 19, a dielectric material is continuously applied on the mother glass 40, starting from a portion near one edge of the front plate 200 continuing up to an opposite edge of the front plate 200.
The mother glass 40 may have a size corresponding to one front substrate, or it may have a size corresponding two front substrates, i.e., first and second front substrates, as shown in
A thickness of the second dielectric layer 19 may be varied depending on a viscosity of the dielectric material paste, friction between the dielectric material paste and an inner surface of a nozzle of the coating device, spraying time, and similar phenomena.
Each front substrate may include a display area 3b (or 4b) and a non-display area 3a and 3c (or 4a and 4c) surrounding the display area. The second dielectric layer 19 may be formed with a fourth thickness t4 on a portion of the substrate in the non-display area 3a, which is positioned near one edge of the second substrate. The remainder of the second dielectric layer may be formed with a fifth thickness t5, which is different from the fourth thickness t4. Referring to
The second dielectric layer 19 is formed with the fourth thickness t4 starting in a portion of the substrate in the non-display area 3a and continuing with the fifth thickness t5 in the remaining portion of the substrate, i.e., the display area 3b, the non-display area 3c, the outside area 3d, the outside area 4d, the non-display area 4a, the display area 4b, and the non-display area 4c. The fifth thickness t5 may be greater than the fourth thickness t4. Further, the fifth thickness t5 may be uniform over the whole remaining portion of the substrate.
The dielectric material paste is continuously applied up to a portion of the substrate in the non-display area 4c disposed near the edge of the second front plate 202. The second dielectric layer 19 may be formed with a sixth thickness t6 on a portion of the substrate in the non-display area 4c. The sixth thickness t6 may be greater than the fifth thickness t5.
In the case where two sheets of the first and second front plates 201 and 202 are formed using one mother glass 40, referring to
The second dielectric layer 19 is formed starting with the fourth thickness t4 at an early stage of applying the dielectric material, then continuing with the fifth thickness t5 and with the sixth thickness t6 at a final stage of applying the dielectric material.
In the case where one front substrate is fabricated from one mother glass or more than two front substrates are fabricated from one mother glass, the second dielectric layer 19 may also be formed with three thicknesses t4, t5, and t6.
Since according to the present invention, the dielectric layer is formed by continuously applying the dielectric material paste along all plates, the dielectric layer having uniform thickness can be formed even when a plurality of front or rear plates are formed from one mother glass.
While the invention has been described in connection with certain exemplary embodiments it is to be understood by those skilled in the art that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications included within the spirit and scope of the appended claims and equivalents thereof.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2004-0075410 | Sep 2004 | KR | national |
