Patent Application
20060158075
1. Field of the Invention
The present invention relates to the field of flat-panel displays, particularly plasma display panels (“PDP”) technology, along with associated methods of heat dissipation and thermal management.
2. Related Art
Traditionally, various electronic devices have utilized heat sink devices either integrally configured or attached to dissipate heat in thermally deleterious heat generating components in such devices. The same is true with flat-panel display modules, such as liquid crystal display (“LCD”) and PDP technologies, which generate enormous heat quantities. Heat sinks have been utilized to quickly but relatively inefficiently dissipate the heat generated in integrated circuits (“IC”).
However, methods associated with heat sinks have several disadvantages. Heat sinks in flat-panel devices increase device costs, weight and dimensional thickness. All of these characteristics inevitably limit the application of heat sink configurations.
Various ICs can operationally endure temperatures as high as 70-85° C. However, high temperatures can adversely impact display performance characteristics of a flat-panel display. Therefore, there is present need to reduce the operational working temperature of ICs, without increasing costs, to reach the appropriate thermal balance in a display panel.
A conventional PDP display apparatus is depicted in
As illustrated in
One of the most significant threats to the operational performance and lifetime of a conventional PDP lies in deleterious thermal environments caused by generated heat. As explained above, a dramatic temperature differential between the display and non-display portions of a PDP can result in a degraded, fractured or inoperable PDP panel. Thus, there is a present need for an apparatus and method that prevents the compromised or operational failure of a PDP panel by reducing the temperature difference between those portions.
There is also a present need to reduce the ever-increasing temperature differentials over the operational and non-operational display portion, which lead to thermal expansion mis-match and structural fatigue performance of the displays.
Accordingly, the present invention provides such a robust, versatile and cost-effective solution to both heat dissipation and thermal equilibration of associated PDP structures and assemblies.
The present invention has been made to solve the problems associated with the inability of a conventional PDP to provide a high level of efficiency in dissipating heat generated by associated ICs as described above.
The present invention is directed toward enhancing the thermal management characteristics of a PDP by utilizing an apparatus and method for conducting heat away from an IC and equilibrating temperature differentials within the PDP.
The present invention is directed toward permitting the efficient dissipation of deleterious heat that is generated during PDP operation of associated ICs.
At least one of the above features and advantages may be achieved by providing an apparatus including a circuit framework structure, a chassis structure coupled to the circuit framework structure, at least one thermal pad structure coupled to the chassis structure, a panel structure coupled to the at least one thermal pad structure and including a display portion and a non-display portion, an integrated circuit disposed behind said non-display portion of said panel structure, and at least one attachment fastener structure, which couples the circuit framework structure, chassis structure, panel structure, integrated circuit and the at least one thermal pad structure.
It is another feature of an embodiment of the present invention to utilize the heat generated by the ICs to achieve a thermally equilibrated state for the entire PDP, thus preventing the reduction in PDP panel operational life. This feature may be achieved by the thermal pad and/or chassis structure being disposed in the non-display portion of the plasma display panel. Thus, the present invention reduces the thermal imbalance between the display portion and the non-display portion in the PDP panel.
As can be indicated from above, another feature of an embodiment of the present invention is to reduce the operational temperature of the IC without increasing cost or dimensional thickness.
More specifically, it is a feature of an embodiment of the present invention to provide a more efficient plasma display panel thermal dissipation and equilibration apparatus compared to the conventional art. The apparatus is preferably configured such that a circuit framework structure, chassis structure and a panel structure, which has a display and non-display portion, that conducts heat away from an integrated circuit. The integrated circuit is preferably disposed behind said non-display portion of said panel structure, while a thermal pad structure provides the conduit of the IC generated heat. The thermal pad structure may be directly or indirectly thermally coupled to the integrated circuit. The integrated circuit is preferably disposed between the circuit framework structure and at least one thermal pad structure.
It is another feature of an embodiment of the present invention to provide a plasma display panel thermal dissipation and equilibration system. The system is configured such a circuit framework means, chassis means and a panel means, which has a display and non-display portion, conducts heat away from an integrated circuit. The integrated circuit is preferably disposed behind the non-display portion of the panel means, while a thermal pad means provides the conduit of the integrated circuit generated heat. The thermal pad means may be directly or indirectly thermally coupled to the integrated circuit. The integrated circuit is preferably disposed between the circuit framework means and at least one thermal pad means.
It is another feature of an embodiment of the present invention to a plasma display panel thermal dissipation and equilibration method. The method involves providing a circuit framework structure, chassis structure and a panel structure, which has a display and non-display portion, that conducts heat away from an integrated circuit. The method may further include disposing the integrated circuit behind the non-display portion of the panel structure, while providing a thermal pad structure as a conduit for the heat generated by the circuit. Alternately, a thermal pad structure is directly or indirectly thermally coupled to the integrated circuit. Finally, the integrated circuit is preferably disposed between the circuit framework structure and at least one thermal pad structure.
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
The following section describes various embodiments of the present invention based on drawings, while exemplifying the PDP thermal dissipation and equilibration apparatus, system and method of the present invention.
Accordingly,
More specifically, the thermal pad structure 307, in the non-display portion 303, is attached to the IC 306. The circuit framework structure 304 is attached and thermally coupled to the chassis structure 301. Therefore, the above-mentioned features are provided. The heat in the non-display portion 303 is dissipated and transferred through the thermal pad structure 307 toward the PDP panel structure 308 to achieve a thermally equilibrated state. Similarly, heat in the IC 306 is also transmitted to the chassis structure 301 by means of the thermal pad structure 307. Therefore, the configuration prevents the PDP 300 from operationally breaking down, at least due to extreme thermal stresses, without increasing the device cost.
The present invention is applicable to flat-panel display module packages, such as PDPs and flip-chip module packages, such as chip-on-glass (“COG”), chip-on-film (“COF”), and chip-on-board (“COB”).
In addition, as shown in
Those skilled in the art will recognize that the device and methods of the present invention has many applications, and that the present invention is not limited to the representative examples disclosed herein. Although illustrative, the embodiments disclosed herein have a wide range of modification, change and substitution that is intended and in some instances some features of the present invention may be employed without a corresponding use of the other features.
Moreover, the scope of the present invention covers conventionally known variations and modifications to the system components described herein, as would be known by those skilled in the art. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.
