Claims
- 1. A process for repairing surface imperfections of metal parts comprising the steps of
- (I) providing a curable polyester composition comprising
- (A) from about 25% to about 50% by weight of at least one unsaturated polyester resin;
- (B) from about 10% to about 20% by weight of at least one monomer solvent which is copolymerizable with the polyester;
- (C) from about 1% to about 8% by weight of at least one aryl sulfonamide-aldehyde condensation resin; and
- (D) from about 40% to about 65% by weight of at least one inorganic filler material;
- (II) preparing a mixture of the curable polyester composition and a free-radical initiating organic peroxide;
- (III) applying said mixture to the surface of the metal to be repaired; and
- (IV) allowing the mixture to cure and harden on the metal.
- 2. The process of claim 1 wherein the metal is galvanized steel.
- 3. The metal parts treated in accordance with the process of claim 1.
- 4. The process of claim 1 wherein the unsaturated polyester resin (A) comprises the condensation reaction product of at least one ethylenically unsaturated dicarboxylic acid and at least one polyhydric alcohol.
- 5. The process of claim 1 wherein the monomer solvent (B) is at least one liquid monomer containing a >C.dbd.CH.sub.2 group.
- 6. The process of claim 5 wherein the monomer is a styrene monomer.
- 7. The process of claim 1 wherein the condensation resin (C) is a aryl sulfonamide-formaldehyde resin.
- 8. The process of claim 1 wherein the condensation resin (C) is a toluene sulfonamide-formaldehyde resin.
- 9. The process of claim 1 wherein (D) is a mixture of inorganic powders and inorganic hollow microspheres.
- 10. The process of claim 1 wherein the inorganic hollow microspheres are glass microspheres.
- 11. The process of claim 1 containing from about 1% to about 5% of a toluene sulfonamide-formaldehyde resin.
- 12. The process of claim 1 containing (D) from about 40% to about 50% by weight of at least one inorganic powder and from about 3% to about 15% by weight of glass microspheres.
- 13. The process of claim 1 containing from about 30% to about 35% by weight of the unsaturated polyester resin (A).
- 14. The process of claim 1 wherein the curable polyester composition comprises
- (A) from about 30% to about 35% by weight of at least one unsaturated polyester resin;
- (B) from about 11% to about 15% by weight of at least one liquid styrene monomer solvent;
- (C) from about 1% to about 5% by weight of at least one toluene sulfonamide-formaldehyde condensation resin; and
- (D) from about 40% to about 60% by weight of at least one inorganic filler material.
- 15. The process of claim 14 containing (D) about 40% to about 50% of inorganic powders and from about 3% to about 15% by weight of glass microspheres.
- 16. A process for repairing surface imperfections of metal parts comprising the steps of
- (I) providing a curable polyester composition comprising
- (A) at least one unsaturated polyester resin;
- (B) at least one hydrocarbon monomer copolymerizable with the polyester; and
- (C) at least one aryl sulfonamide-aldehyde resin;
- (II) preparing a mixture of the curable polyester composition and a free-radical initiating organic peroxide;
- (III) applying said mixture to the surface of the metal to be repaired; and
- (IV) allowing the mixture to cure and harden on the metal.
- 17. The process of claim 16 wherein the unsaturated polyester resin (A) comprises the condensation reaction product of at least one ethylenically unsaturated dicarboxylic acid and at least one polyhydric alcohol.
- 18. The process of claim 16 wherein the hydrocarbon monomer (B) is at least one liquid monomer containing a >C.dbd.CH.sub.2 group.
- 19. The process of claim 18 wherein the monomer is a styrene.
- 20. The process of claim 16 wherein the resin (C) is an aryl sulfonamide-formaldehyde resin.
- 21. The process of claim 20 wherein the aryl sulfonamide-formaldehyde resin is a toluene sulfonamide-formaldehyde resin.
- 22. The process of claim 16 also containing (D) at least one inorganic filler.
- 23. The process of claim 22 wherein the inorganic filler (D) comprises a mixture of inorganic powders and inorganic hollow microspheres.
- 24. The process of claim 23 wherein the inorganic hollow microspheres are glass microspheres.
Parent Case Info
This is a division of application Ser. No. 07,334,678, filed Apr. 6, 1989, now U.S. Pat. No. 4,980,414.
US Referenced Citations (14)
Divisions (1)
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Number |
Date |
Country |
Parent |
334678 |
Apr 1989 |
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