Claims
- 1. A plastic molding device for plastic molding a semiconductor element on a lead frame comprising:
- an upper platen, a lower platen, and a movable platen which are all interconnected by at least one tie bar;
- an upper metal mold and a lower metal mold provided on the upper platen and the movable platen, respectively;
- a motor for outputting a rotation force;
- a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force to enable reciprocation of said movable platen toward said upper platen; and
- a spring for urging the movable platen toward said upper platen, said spring being provided between the lower platen and the movable platen.
Priority Claims (11)
Number |
Date |
Country |
Kind |
60-26841 |
Feb 1985 |
JPX |
|
60-26842 |
Feb 1985 |
JPX |
|
60-26844 |
Feb 1985 |
JPX |
|
60-26845 |
Feb 1985 |
JPX |
|
60-26847 |
Feb 1985 |
JPX |
|
60-26848 |
Feb 1985 |
JPX |
|
60-26850 |
Feb 1985 |
JPX |
|
60-26851 |
Feb 1985 |
JPX |
|
60-26852 |
Feb 1985 |
JPX |
|
60-218611 |
Sep 1985 |
JPX |
|
60-218612 |
Sep 1985 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/371,845 filed on Jun. 27, 1989, now abandoned, which is a Rule 60 continuation of Ser. No. 07/174,816 filed on Mar. 29, 1988, now U.S. Pat. No. 4,904,173, which is a Rule 60 continuation of Ser. No. 06/829,087 filed on Feb. 13, 1986, now U.S. Pat. No. 4,755,124.
US Referenced Citations (21)
Foreign Referenced Citations (4)
Number |
Date |
Country |
1231883 |
Jan 1967 |
DEX |
59-9538 |
Jan 1984 |
JPX |
59-187862 |
Oct 1984 |
JPX |
60-139421 |
Jul 1985 |
JPX |
Continuations (3)
|
Number |
Date |
Country |
Parent |
371845 |
Jun 1989 |
|
Parent |
174816 |
Mar 1988 |
|
Parent |
829087 |
Feb 1986 |
|