Patent Application
20250116025
The present invention relates to plating apparatuses.
For formation of an external electrode of an electronic component, what is called a jet flow-type plating apparatus is widely used. Japanese Patent Laid-Open No. 2021-138999 discloses a jet flow-type plating apparatus.
The plating apparatus disclosed in Japanese Patent Laid-Open No. 2021-138999 includes a plating bath. A metal pipe (a cathode) defining and functioning as the first electrode, a mesh pipe (a partition wall) made of an insulating material, and the second electrode (an anode) are accommodated in the plating bath.
A metal pipe is disposed inside the mesh pipe, and a plating forming portion is formed between the inside of the mesh pipe and the outside of the metal pipe. The plating forming portion is a region (a space) in which plating is performed on a plating target which is an object to be plated. The second electrode is disposed outside the mesh pipe.
An injection unit is provided below the metal pipe. The injection unit serves to generate an upward flow of the plating solution inside the metal pipe. In other words, in the apparatus disclosed in Japanese Patent Laid-Open No. 2021-138999, the injection unit serves as a source that generates a jet flow in the plating solution.
In the plating apparatus disclosed in Japanese Patent Laid-Open No. 2021-138999, a plating solution, plating targets (for example, an element body of an electronic component), and electrically conductive media are accommodated in the plating bath. Further, insulating balls are accommodated, as required, in order to enhance the fluidity of each plating target.
The plating targets, the media, and the insulating balls are moved with the upward flow of the plating solution, the upward flow being generated inside the metal pipe, upward through the metal pipe, then jetted to the outside from an upper end of the metal pipe, and stirred.
The plating targets, the media, and the insulating balls that have been stirred are then deposited on the upper side of the plating forming portion. At this time, the plating forming portion is already filled with other plating targets, media, and insulating balls (deposited therein). The plating targets, the media, and the insulating balls deposited on the upper side of the plating forming portion gradually fall downward through the plating forming portion. At this time, a current is applied between the metal pipe defining and functioning as the first electrode and the second electrode to form a plated film on a plated area (a region in which a base electrode and the like are formed) on the surface of each plating target.
The plating targets each having the plated film formed thereon, the media, and the insulating balls are extruded from a lower end of the plating forming portion, and moved again with the upward flow of the plating solution, the upward flow being generated inside the metal pipe, upward through the metal pipe, then jetted to the outside from the upper end of the metal pipe, and stirred. The plating targets circulate several times to several thousand times through the plating apparatus until the plated film formed on each plating target has an intended thickness.
While the plating targets each are plated in the plating forming portion, the media act to establish an electrical connection between the metal pipe defining and functioning as the first electrode and the plated area on the surface of each plating target.
In the plating step, the number and amount (volume) and the dimensions of the media are adjusted as appropriate according to the state of the desired plated film.
When the number and amount of media is small, when the diameter of each medium is small, or when the plated area on the surface of each plating target is small, the electrical connection between the metal pipe defining and functioning as the first electrode and the plated area of each plating target may not be sufficiently established. If the electrical connection between the metal pipe defining and functioning as the first electrode and the plated area of each plating target is not sufficiently established, it may take a long time to form a plated film having an intended thickness, or the thickness of the formed plated film may be uneven among the plating targets.
Thus, it is considered to increase the number and amount of media. If the number and amount of media is increased, however, the electric field may be shielded by the media. Such shielding of the electric field by the media may result in longer time required for film formation or may result in a variation in thickness of plating.
Example embodiments of the present invention provide plating apparatuses by each of which the time required for plating is reduced and a thickness variation in a formed plated film is reduced or prevented.
A plating apparatus according to an example embodiment of the present invention includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an electrically insulating material, and a second electrode. The metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe. Plating targets are moved upward with the upward flow of the plating solution through the hollow portion of the metal pipe, the plating targets are discharged to an outside of the metal pipe and stirred, and the plating targets subsequently fall downward through the plating forming portion. While the plating targets fall downward, the plating targets each are plated by application of a current between the metal pipe defining and functioning as the first electrode and the second electrode. An auxiliary electrode electrically connected to the metal pipe defining and functioning as the first electrode is provided inside the plating forming portion.
In plating apparatuses according to example embodiments of the present invention, the auxiliary electrode assists the electrical connection between the metal pipe defining and functioning as the first electrode and the plated area of each plating target, with the result that the time taken to achieve a desired plating thickness is reduced.
Further, in plating apparatuses according to example embodiments of the present invention, the auxiliary electrode assists the electrical connection between the metal pipe defining and functioning as the first electrode and the plated area of each plating target, and a uniform current is supplied to the plated area, with the result that the thickness variation in the formed plated film is reduced or prevented.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the example embodiments with reference to the attached drawings.
Hereinafter, example embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Each example embodiment of the present invention is not limited to contents of the specifically depicted example embodiment. Contents described in different example embodiments can also be implemented in combination, and the contents implemented in that case are also encompassed in the present invention. The accompanying drawings serve to help understanding of the specification and may schematically be drawn. A ratio of the dimensions of a drawn component or components may not be equal to a ratio of the dimensions described in the specification. Components described in the specification may be omitted in the drawings or may be drawn in reduced number.
Plating apparatus 100 includes a plating bath 1. An upper side of plating bath 1 is open. Plating bath 1 defines and functions to accommodate a mixture 16 of a plating solution, plating targets, and media, which will be described later. If necessary, insulating balls may be added to mixture 16 to increase the fluidity of each plating target.
Plating apparatus 100 includes cylindrical metal pipe 2 provided inside plating bath 1. Metal pipe 2 includes a hollow portion 2a. Metal pipe 2 defining and functioning as the first electrode is preferably a cathode electrode in the present example embodiment. In the present example embodiment, metal pipe 2 has a cylindrical shape. Metal pipe 2 may alternatively have a polygonal cylindrical shape. Metal pipe 2 may be made of any material and can be made using various metals. Metal pipe 2 may have any dimensions such as an outer diameter, an inner diameter, and a length, each of which can be set as appropriate.
In the present example embodiment, as shown in
Plating apparatus 100 preferably includes a mesh pipe 3 made of an electrically insulating material and provided inside plating bath 1. Mesh pipe 3 includes a hollow portion 3a. In the present example embodiment, mesh pipe 3 has a cylindrical shape. Mesh pipe 3 may have a polygonal cylindrical shape. Mesh pipe 3 is configured in a mesh (e.g., net) shape through which the plating solution passes but through which the plating targets, the media, and the insulating balls do not pass. Mesh pipe 3 may be made of any material and can be made, for example, using various resins. Mesh pipe 3 may have any dimensions such as an outer diameter, an inner diameter, and a length, each of which can be set as appropriate.
The inner diameter of mesh pipe 3 is larger than the outer diameter of metal pipe 2. Metal pipe 2 is located inside hollow portion 3a of mesh pipe 3. A plating forming portion 4 is preferably provided between the inside of mesh pipe 3 and the outside of metal pipe 2. Plating forming portion 4 is a region (e.g., a space) in which the plating targets each are plated. In
The plating targets, the media, and the insulating balls are deposited inside plating forming portion 4 and gradually fall downward. At some point during this falling, the surface of each plating target is plated.
Plating apparatus 100 preferably includes a second electrode 5 provided inside plating bath 1. In the present example embodiment, second electrode 5 is an anode electrode. In the present example embodiment, second electrode 5 is made of metal having a cylindrical shape. Second electrode 5 is located outside mesh pipe 3. Second electrode 5 may be made of any material and can be made using various metals.
As shown in
Plating apparatus 100 includes an injector 6 below metal pipe 2. Injector 6 includes an injection port 6a. Injection port 6a injects the plating solution toward hollow portion 2a of metal pipe 2 to generate an upward flow of the plating solution inside hollow portion 2a.
Plating apparatus 100 preferably includes a circulation line 7 defined by a pipe. Circulation line 7 preferably includes one end connected to a liquid suction port 8 provided in plating bath 1, and another end connected to injection port 6a of injector 6. A pump 9 and a filter 10 are provided at points in circulation line 7. When pump 9 is driven, circulation line 7 suctions the plating solution from liquid suction port 8 and injects the plating solution from injection port 6a.
Plating apparatus 100 includes a mixer 11 below metal pipe 2 and mesh pipe 3 and above injector 6. Mixer 11 is a region in which the plating solution injected from injection port 6a of injector 6 is mixed with the plating targets, the media, and the insulating balls that have fallen downward through plating forming portion 4. In the present example embodiment, mixer 11 is preferably made of an electrically insulating material and includes an upper surface including a recess formed in the shape of an inverted truncated cone. The inverted truncated cone means a truncated cone shaped such that an upper bottom surface is larger than a lower bottom surface. The recess may have any shape and may have a bowl shape or the like in place of the shape of an inverted truncated cone. Injector 6 is provided on the bottom surface of the recess of mixer 11.
Plating apparatus 100 preferably includes a guide portion 12 above metal pipe 2 and mesh pipe 3. In guide portion 12, the plating targets, the media, and the insulating balls that have been moved upward with the upward flow of the plating solution and discharged (e.g., jetted) from an upper opening of hollow portion 2a of metal pipe 2 are stirred and subsequently guided to plating forming portion 4. In this case, the upward flow of the plating solution has been provided inside hollow portion 2a of metal pipe 2 by the injection from injection port 6a of injector 6. Guide portion 12 is preferably made of an electrically insulating material and has a shape of an inverted truncated cone. Guide portion 12 preferably includes a bottom surface through which an upper end of metal pipe 2 protrudes. An upper end of hollow portion 2a of metal pipe 2 is opened in the bottom surface of guide portion 12. The bottom surface of guide portion 12 is connected to mesh pipe 3.
Plating apparatus 100 includes an insulative reflection plate 13 above the opening of plating bath 1. Reflection plate 13 may be referred to as a deflector. Reflection plate 13 acts to reduce or prevent scattering of the plating solution. Further, reflection plate 13 preferably includes a lower surface to which support portion 2b of metal pipe 2 is attached. A cylindrical suppression plate 13a is preferably provided on the lower surface of reflection plate 13. Suppression plate 13a is located inside guide portion 12. While the plating solution may overflow to the outside beyond an upper edge of guide portion 12, suppression plate 13a allows only the plating solution to overflow from guide portion 12 but prevents overflowing of the plating targets, the media, and the insulating balls.
Plating apparatus 100 includes a power supply 14. Power supply 14 preferably includes one line connected to support portion 2b of metal pipe 2 defining and functioning as the first electrode, and another line connected to second electrode 5. Power supply 14 applies an electrical current between metal pipe 2 defining and functioning as the first electrode and second electrode 5.
In plating apparatus 100, auxiliary electrode 15 that is a component in the present invention of the subject application is provided inside plating forming portion 4. Auxiliary electrode 15 is electrically connected to metal pipe 2 defining and functioning as the first electrode. Auxiliary electrode 15 acts to assist metal pipe 2 defining and functioning as the first electrode when the plating targets each are plated in plating forming portion 4. More specifically, when the plating targets each are plated in plating forming portion 4, metal pipe 2 defining and functioning as the first electrode and a plated area of each plating target are electrically connected through an electrically conductive path formed by the plurality of media. In plating apparatus 100, auxiliary electrode 15 electrically connected to metal pipe 2 defining and functioning as the first electrode is provided, and thus, the number of power feeding points is increased, which allows a more reliable electrical connection between metal pipe 2 defining and functioning as the first electrode and the plated area of each plating target.
In the present example embodiment, auxiliary electrode 15 preferably has a plate shape. However, the shape of auxiliary electrode 15 may be any shape and is not limited to a plate shape. Auxiliary electrode 15 may have, for example, a rod shape, a block shape, or the like.
In the present example embodiment, auxiliary electrode 15 has a triangular or substantially triangular plate shape. However, the shape of auxiliary electrode 15 is not limited to a triangular or substantially triangular plate shape and may be, for example, a rectangular or substantially rectangular plate shape or the like.
In the present example embodiment, auxiliary electrode 15 is attached to the outside of metal pipe 2 defining and functioning as the first electrode, and is electrically connected to metal pipe 2. Auxiliary electrode 15 having a triangular or substantially triangular plate shape is attached to the outside of metal pipe 2 such that one side of the triangular or substantially triangular shape is located on the upper side and a vertex opposing this one side is located on the lower side. Thus, auxiliary electrode 15 is less likely to hinder the plating targets, the media, and the insulating balls from passing through plating forming portion 4. In other words, in plating forming portion 4, the cross-sectional area of the space excluding the portion including auxiliary electrode 15 becomes larger from top to bottom, so that the plating targets, the media, and the insulating balls pass smoothly through plating forming portion 4. Note that auxiliary electrode 15 may not be attached to metal pipe 2 but, for example, may be hung independently from reflection plate 13 or the like.
In the present example embodiment, when viewed in a planar direction, four auxiliary electrodes 15 are arranged radially around metal pipe 2. Thus, auxiliary electrode 15 can uniformly supply a current into plating forming portion 4. The number of auxiliary electrodes 15 is not limited to four but may be less than four or may be more than four.
In plating apparatus 100 according to the first example embodiment having the above-described structure, auxiliary electrode 15 assists the electrical connection between metal pipe 2 defining and functioning as the first electrode and the plated area of each plating target, so that the time taken to achieve a desired plating thickness is reduced (improved).
Further, in plating apparatus 100 according to the first example embodiment, auxiliary electrode 15 assists the electrical connection between metal pipe 2 defining and functioning as the first electrode and the plated area of each plating target, and a uniform current is supplied to plating forming portion 4, so that the thickness variation in the formed plated film is reduced or prevented.
The following describes an example of a plating step performed using plating apparatus 100.
First, a desired plating solution is introduced into plating bath 1.
Then, the prescribed number of plating targets, media, and insulating balls are introduced into guide portion 12 inside plating bath 1. In this case, each of the plating targets, the media, and the insulating balls has a desired shape and desired dimensions. The introduction of the plating solution may be exchanged in order with the introduction of the plating targets, the media, and the insulating balls. The introduced plating targets, media, and insulating balls are deposited inside plating forming portion 4.
Then, pump 9 is driven to inject the plating solution from injection port 6a of injector 6. As a result, an upward flow of the plating solution is generated inside metal pipe 2. Then, the plating targets, the media, and the insulating balls deposited inside plating forming portion 4 are partially taken out from the lower end of plating forming portion 4, introduced into mixer 11, mixed with the injected plating solution, and then moved upward with the upward flow through metal pipe 2.
The plating targets, the media, and the insulating balls that have been moved upward through metal pipe 2 are jetted to the outside from the upper end of metal pipe 2 and then stirred.
The plating targets, the media, and the insulating balls that have been stirred are deposited on upper sides of other plating targets, media, and insulating balls that have already been deposited in plating forming portion 4.
As the plating targets, the media, and the insulating balls that have already been deposited in plating forming portion 4 are partially removed from the lower end of plating forming portion 4 and introduced into mixer 11, the plating targets, the media, and the insulating balls that have been newly deposited gradually fall downward. In this way, the plating targets, the media, and the insulating balls circulate through plating apparatus 100.
Then, power supply 14 is driven to apply a current between metal pipe 2 defining and functioning as the first electrode and second electrode 5. As a result, plating on each plating target is started in plating forming portion 4.
When a prescribed time period has elapsed and a plated film having a desired thickness is formed on each plating target, power supply 14 is stopped to stop plating on each plating target. Then, pump 9 is stopped to stop circulation of the plating targets, the media, and the insulating balls through plating apparatus 100. Then, the plating targets, the media, and the insulating balls are removed from plating bath 1, the plating targets are then sorted out, and the plating step ends.
In order to check the effectiveness of example embodiments of the present invention, the following Experiment 1 was performed.
Plating apparatus 100 as described above was prepared for Example 1.
Also, a plating apparatus 1100 was prepared for Comparative Example 1. As shown in
In each of plating apparatuses 100 and 1100, the length of plating forming portion 4 was, for example, about 220 mm.
A mixture of plating targets, media, and insulating balls was prepared for each of Example 1 and Comparative Example 1. The configuration and the mixing amount each were the same in the mixture for Example 1 and the mixture for Comparative Example 1.
The total amount of blending of the plating targets, the media, and the insulating balls was, for example, about 1720 cc. The blending ratios were set at, for example, about 1376 cc (about 80% by volume) for the plating targets, about 86 cc (about 5% by volume) for the media, and about 258 cc (about 15% by volume) for the insulating balls.
The same plating solution was prepared for both Example 1 and Comparative Example 1.
In Example 1, for example, the plating targets each were plated for about 210 minutes with the use of plating apparatus 100, the above-described mixture, and the above-described plating solution. The magnitude of the applied current was, for example, about 0.17 A/dm2. The injection flow rate of the plating solution was, for example, about 85 L/min. After an elapse of, for example, about 60 minutes, an elapse of, for example, about 90 minutes, an elapse of, for example, about 120 minutes, an elapse of, for example, about 150 minutes, an elapse of 180 minutes, and an elapse of, for example, about 210 minutes since the start of plating, plating apparatus 1100 was stopped, thirty plating targets were removed, and then, the thickness of each plated film that has been formed was measured.
Also in Comparative Example 1, the plating targets each were similarly plated for, for example, about 210 minutes with the use of plating apparatus 1100, the above-mentioned mixture, and the above-mentioned plating solution. The magnitude of the applied current was, for example, about 0.17 A/dm2. The injection flow rate of the plating solution was 85 L/min. Then, similarly, after an elapse of, for example, about 60 minutes, an elapse of, for example, about 90 minutes, an elapse of, for example, about 120 minutes, an elapse of, for example, about 150 minutes, an elapse of, for example, about 180 minutes, and an elapse of, for example, about 210 minutes since the start of plating, plating apparatus 1100 was stopped, thirty plating targets were removed, and then, the thickness of each plated film that has been formed was measured.
Table 1 shows details of Example 1 and Comparative Example 1.
As can be seen from the comparison between
Thus, in the case of plating apparatus 100, it could be confirmed that auxiliary electrode 15, which was attached to metal pipe 2, assisted the electrical connection between metal pipe 2 and the plated area of each plating target, so that the rate of formation of each plated film was improved.
As can be seen from
Thus, in the case of plating apparatus 100, it could be confirmed that auxiliary electrode 15, which was attached to metal pipe 2, assisted the electrical connection between metal pipe 2 and the plated area of each plating target, and a uniform current was supplied to the plated area, so that the thickness variation in the plated film that has been formed was reduced or prevented.
As described above, example embodiments of the present invention achieve specific excellent effect.
A plating apparatus 200 according to a second example embodiment of the present invention was manufactured. Plating apparatus 200 is obtained by partially modifying the configuration of plating apparatus 100 according to the first example embodiment.
Specifically, plating apparatus 100 had a configuration in which four triangular or substantially triangular auxiliary electrodes 15 were attached to the outside of metal pipe 2 defining and functioning as the first electrode. Plating apparatus 200 was obtained by modifying this configuration in such a manner that, as shown in
Auxiliary electrode 25 is electrically connected to metal pipe 2 defining and functioning as the first electrode via support portion 25b. Auxiliary electrode 25 acts to assist metal pipe 2 defining and functioning as the first electrode and increase the number of power feeding points.
Four auxiliary electrodes 25 were arranged in three ways as shown in
In plating apparatus 200A, four auxiliary electrodes 25 each are arranged on the side adjacent to metal pipe 2. Four auxiliary electrodes 25 are arranged radially around metal pipe 2. Note that each auxiliary electrode 25 may be in contact with metal pipe 2 or may be spaced apart from metal pipe 2 with a slight gap interposed therebetween.
In plating apparatus 200B, four auxiliary electrodes 25 are arranged at intermediate points between metal pipe 2 and mesh pipe 3. Four auxiliary electrodes 25 are arranged radially around metal pipe 2.
In plating apparatus 200C, four auxiliary electrodes 25 each are arranged on the side close to mesh pipe 3. Four auxiliary electrodes 25 are arranged so as to be parallel to a mesh surface of mesh pipe 3.
The following Experiment 2 was performed in order to compare plating apparatuses 200A, 200B, and 200C with one another in terms of the performance.
Plating apparatus 200A was used in Example 21. Plating apparatus 200B was used in Example 22. Plating apparatus 200C was used in Example 23.
For each of Examples 21, 22, and 23, the same mixture of the plating targets, the media, and the insulating balls as that used in Experiment 1 (Example 1 and Comparative Example 1) was prepared. The same blending ratio and the same blending amount were adopted in Examples 21, 22, and 23.
The same plating solution as that used in Experiment 1 was prepared for Examples 21, 22, and 23.
In each of Examples 21, 22, and 23, the plating targets each were plated for, for example, about 210 minutes with the use of the above-mentioned mixture and the above-mentioned plating solution. The magnitude of the applied current was, for example, about 0.17 A/dm2. The injection flow rate of the plating solution was, for example, about 85 L/min. Then, in the same manner as in Experiment 1, after an elapse of, for example, about 60 minutes, an elapse of, for example, about 90 minutes, an elapse of, for example, about 120 minutes, an elapse of, for example, about 150 minutes, an elapse of, for example, about 180 minutes, and an elapse of, for example, about 210 minutes since the start of plating, plating apparatus 1100 was stopped, thirty plating targets were taken out, and then, the thickness of each plated film that has been formed was measured.
Table 2 shows details of Examples 21, 22, and 23.
As can be seen from
From the above description, it was discovered that the thickness variation in the plated film could be reduced or prevented more when auxiliary electrode 25 located inside plating forming portion 4 was located on the side closest possible to metal pipe 2 defining and functioning as the first electrode than on the side close to mesh pipe 3.
As above, plating apparatuses 100 and 200 (plating apparatuses 200A, 200B, and 200C) according to the example embodiments have been described. However, the present invention is not limited to the above-described details, and can be variously modified in accordance with the gist of the present invention.
For example, in the above-described example embodiments, the number of each of auxiliary electrodes 15 and 25 is, for example, four but may be any number and may be less than four or may be more than four.
In the above-described example embodiments, auxiliary electrodes 15 and 25 each are a triangular or substantially triangular plate or a rectangular or substantially rectangular plate, but each may have any shape and may have other shapes.
The plating apparatus according to one example embodiment of the present invention is as described above.
In the present plating apparatus, it is also preferable that the first electrode is a cathode electrode and the second electrode is an anode electrode.
Further, it is also preferable that the auxiliary electrode is attached to an outside of the metal pipe and electrically connected to the metal pipe. In this case, the auxiliary electrode can be easily provided.
It is also preferable that the auxiliary electrode is hung inside the plating forming portion. In this case, the auxiliary electrode can be disposed at any position in the plating forming portion.
It is also preferable that the auxiliary electrode is more than one in number. In this case, a current can be more uniformly supplied to the plating forming portion.
It is also preferable that the auxiliary electrodes are four in number. In this case, a current can be more uniformly supplied to the plating forming portion.
It is also preferable that the auxiliary electrodes are arranged radially around the metal pipe when viewed in a planar direction. In this case, a current can be more uniformly supplied to the plating forming portion.
It is also preferable that the auxiliary electrode is a metal plate. In this case, it is possible to suppress the auxiliary electrode from hindering the passage of the plating targets, the media, the insulating balls or the like through the plating forming portion.
In this case, it is also preferable that the metal plate is a plate having a triangular shape and is located inside the plating forming portion such that one side of the triangular shape is located on an upper side and a vertex facing the one side is located on a lower side. In this case, it is possible to further suppress the auxiliary electrode from hindering the passage of the plating targets, the media, the insulating balls, or the like through the plating forming portion. However, the metal plate may have any shape and may be, for example, a rectangular plate.
While example embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-154285 | Sep 2022 | JP | national |
This application is a Continuation Application of PCT Application No. PCT/JP2023/028660, filed on Aug. 5, 2023, and claims the benefit of priority to Japanese Patent Application No. 2022-154285 filed on Sep. 27, 2022. The entire contents of each application are hereby incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2023/028660 | Aug 2023 | WO |
| Child | 18985368 | US |
