Claims
- 1. A platinum electroforming bath consisting of a hexahydroxyplatinate of hydrogen or an alkali metal, present in an amount of 2-100 g/l; an alkali metal hydroxide, present in an amount of 20-100 g/l; and an alkali metal carboxylate, present, in an amount of 20-100 g/l.
- 2. The platinum electroforming bath of claim 1 consisting of H.sub.2 Pt(OH).sub.6, KOH and K.sub.2 C.sub.2 O.sub.4.H.sub.2 O.
Priority Claims (5)
Number |
Date |
Country |
Kind |
2-170064 |
Jun 1990 |
JPX |
|
2-185241 |
Jul 1990 |
JPX |
|
3-124577 |
Apr 1991 |
JPX |
|
3-124578 |
Apr 1991 |
JPX |
|
3-124579 |
Apr 1991 |
JPX |
|
RELATED APPLICATIONS
This application is a continuation of application Ser. No. 07/718,767, filed Jun. 21, 1991, now U.S. Pat. No. 5,310,475, to be issued May 10, 1994.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
1901531 |
Powell et al. |
Mar 1933 |
|
Non-Patent Literature Citations (2)
Entry |
Davies et al, "Platinum Plating from Alkaline Solutions", Intern. Electrodep. Conf., 1937, advance copy. |
Indira et al, "Addition Agent for Platinum Plating", Metal Finishing, May 1969, pp. 44-49. |
Continuations (1)
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Number |
Date |
Country |
Parent |
718767 |
Jun 1991 |
|