1. Field of the Invention
The present invention relates to a plug connector, and more particularly to a SFP (Small Form factor Pluggable) connector having multi-board.
2. Description of Related Art
In communication applications, a cable end plug connector having two or more printed circuit boards for transmitting high rate signals is widely used. U.S. Pat. No. 7,883,341 issued to Lang on Feb. 8, 2011, discloses a plug connector for mating with a receptacle. The plug connector comprises an upper circuit board and a lower circuit board respectively connecting to a cable. The upper circuit board has a number of first soldering pads formed at the rear portion of the top surface and a number of second soldering pads formed at the rear portion of the bottom surface. The lower circuit board has a number of third soldering pads formed at the rear portion of the top surface and a number of fourth soldering pads formed at the rear portion of the bottom surface. The cable is soldered to the first through fourth soldering pads on the two circuit boards via soldering material. The upper circuit board and lower circuit board are separated from each other at a certain distance to avoid shorting between the soldering material at the second soldering pads and the soldering material at the third soldering pads. It is hard to reduce the height of the connector.
Hence, a plug connector having an improved structure of the multi-board is desired.
Accordingly, an object of the present invention is to provide a plug connector. The plug connector adapted for mating with a receptacle having a number of contacts. The plug connector comprises a shielding cover and a circuit board module mounted therein. The circuit board module comprising a first circuit board, a second circuit board and a third circuit board. The first circuit board has a rear soldering portion for soldering the cable, a top surface, a bottom surface and a plurality of mounting pads formed at both front portions of the top surface and bottom surface. The second circuit board has a plurality of mating pads formed at a front portion thereof for mating with the contacts and a plurality of soldering pads formed at a rear portion thereof for connecting to the mounting pads on the top surface of the first circuit board. The third circuit board has a plurality of mating pads formed at a front portion thereof for mating with the contacts and a plurality of soldering pads formed at a rear portion thereof for connecting to the mounting pads on the bottom surface of the first circuit board. The cable is soldered to the top surface and bottom surface of one circuit board. The height of the plug connector could be reduced.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made in detail to the preferred embodiment of the present invention.
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The mating pads 211, 212 include a plurality of first grounding pads 211 and a plurality of signal pads 212. The first grounding pads 211 extend beyond the signal pads 212 along the mating direction for grounding, and a pair of signal pads 212 formed between two first grounding pads 211 for transmitting differential signals.
The mating pads 203, 204, 205 include a plurality of second grounding pads 203, a plurality of power pads 204 and a plurality of control pads 205. The second grounding pads 203 extend beyond the power pads 204 along the mating direction and the power pads 204 further extend beyond the control pads 205 along the mating direction. The second grounding pads 203 contact the grounding before the power pads 204 providing a power to the chip 22. A pair of power pads 204 are formed at the middle of two second grounding pads 203, and a number of control pads 205 are formed between a second grounding pad 203 and a power pad 204 for transmitting control signals to the chip 22.
Referring to
The mating pads 311, 312 include a plurality of first grounding pads 311 and a plurality of signal pads 312. The first grounding pads 311 extend beyond the signal pads 312 along the mating direction for grounding, and a pair of signal pads 312 formed between two first grounding pads 311 for transmitting differential signals.
The mating pads 303, 304, 305 include a plurality of second grounding pads 303, a plurality of power pads 304 and a plurality of control pads 305. The second grounding pads 303 extend beyond the power pads 304 along the mating direction, and the power pads 304 further extend beyond the control pads 305 along the mating direction. The second grounding pads 303 contact the grounding before the power pads 304 providing power to the chip 32. A pair of power pads 304 are formed at the middle of two second grounding pads 303, and a number of control pads 305 are formed between a second grounding pad 303 and a power pad 304 for transmitting control signals to the chip 22.
A pair of differential signals are transmitted through a pair of the signal pads 212 on the bottom surface 21 of the second circuit board 2, and then transmitted through the mounting pads 102 of the first circuit board 1 to the cable 7. Another pair of differential signals are transmitted through a pair of the signal pads 312 on the top surface 31 of the third circuit board 3, and then transmitted through the mounting pads 112 of the first circuit board 1 to the cable 7.
Referring to
It is to be understood that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201010553003.X | Nov 2010 | CN | national |