Claims
- 1. In a polishing composition comprising a slurry of silica particles in water wherein the silica particles are present in the slurry in a size and amount sufficient to render the composition effective in removing a metal from the surface of an integrated circuit by polishing, the improvement wherein the composition consists essentially of water, a sol or gel of silica and a persulfate compound as a polishing accelerator, said persulfate compound being included in the composition in an amount sufficient to increase the effectiveness of the composition in removing the metal by polishing without formation of orange peel on the surface of the integrated circuit.
- 2. A polishing composition according to claim 1, in which said persulfate compound is selected from the group consisting of ammonium persulfate, sodium persulfate and potassium persulfate.
- 3. In a polishing composition comprising a slurry of silica particles in water wherein the silica particles are present in the slurry in a size and amount sufficient to render the composition effective in removing a metal from the surface of an integrated circuit by polishing, the improvement wherein the metal to be removed from the surface of the integrated circuit is aluminum or tungsten and the composition comprises a polishing accelerator which consists essentially of hydrogen peroxide and a persulfate compound, said persulfate compound being included in the composition in an amount sufficient to increase the effectiveness of the composition in removing the aluminum or tungsten by polishing without formation of orange peel on the surface of the integrated circuit.
- 4. A polishing composition according to claim 3, in which said polishing accelerator is hydrogen peroxide and a persulfate compound selected from the group consisting of ammonium persulfate, sodium persulfate and potassium persulfate.
- 5. A polishing composition according to claim 1, wherein said metal to be removed from the surface of integrated circuit by polishing is selected from the group consisting of Al, Cu and W.
Priority Claims (2)
Number |
Date |
Country |
Kind |
5-103059 |
Apr 1993 |
JPX |
|
6-021197 |
Feb 1994 |
JPX |
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Parent Case Info
This application is a continuation of copending application Ser. No. 08/229,560 filed on Apr. 19, 1994, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (2)
Number |
Date |
Country |
5344273 |
Nov 1978 |
JPX |
55-48694 |
Dec 1980 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Derwent Abstract 600354: corresponding to JP 53-44 273 B, Nov. 28, 1978. |
Continuations (1)
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Number |
Date |
Country |
Parent |
229560 |
Apr 1994 |
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