POLISHING DEVICES

TECHNICAL FIELD

The present disclosure relates to a polishing device, and in particular to a polishing device applied to a small-sized workpiece.

BACKGROUND

A ring polishing machine is a common polishing device applied to process optical or electronic elements. However, if ring polishing is performed on a small-sized workpiece using the existing ring polishing machine, due to the large size (about 7-10 mm) of a liquid guide tank disposed on a polishing disc, safety accidents such as the small-sized workpiece overturning on a processing station or getting stuck between an assistant polishing disc and the polishing disc may occur. Therefore, it is desirable to propose an efficient and safe polishing device applied to the small-sized workpiece.

SUMMARY

One of the embodiments of the present disclosure provides a polishing device. The polishing device may comprise a frame, and a polishing disc, an assistant polishing disc, and a fixture that are disposed on the frame. At least one polishing position may be disposed on the assistant polishing disc and configured to place a workpiece to be polished. The assistant polishing disc may be clamped by the fixture. The fixture may include a plurality of claws. The plurality of claws may include at least a first claw extending from above the at least one polishing position to an edge of the assistant polishing disc. A pre-tightening part may be disposed on a position, corresponding to the at least one polishing position, of the first claw. The pre-tightening part may include a scale and a pre-tightening member. A scale value representing a polishing removal efficiency may be preset on the scale. The pre-tightening member may adjust a polishing efficiency of the workpiece to be polished based on the scale value. During a polishing process, the polishing disc may rotate, and the assistant polishing disc may rotate and/or swing to achieve polishing of the workpiece to be polished.

In some embodiments, the polishing device may further comprise a flatness detection mechanism and a pressure adjustment mechanism. The flatness detection mechanism may be configured to detect whether a flatness of the polishing disc meets a preset requirement during the polishing process. The pressure adjustment mechanism may be configured to adjust a pressure applied to the polishing disc by the assistant polishing disc according to a detection result of the flatness detection mechanism.

In some embodiments, the polishing device may further comprise a driving mechanism. The driving mechanism may be connected with the fixture through a stylus and configured to drive the assistant polishing disc to rotate and/or swing.

In some embodiments, the pressure adjustment mechanism may be disposed on the driving mechanism; and the pressure adjustment mechanism may control the stylus to apply an adjustable pressure to the assistant polishing disc. Or the pressure adjustment mechanism may be disposed on the fixture; and the pressure adjustment mechanism may control the fixture to apply an adjustable pressure in a direction of gravity to the assistant polishing disc.

In some embodiments, a liquid guide tank may be disposed on a polishing surface of the polishing disc, a width of the liquid guide tank being in a range of 1 mm-5 mm.

In some embodiments, the width of the liquid guide tank may be 3%-20% of a diameter of the workpiece to be polished.

In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the width of the liquid guide tank may be in a range of 1 mm-3 mm.

In some embodiments, when the diameter of the workpiece to be polished is in a range of 25.4 mm-50.8 mm, the width of the liquid guide tank may be in a range of 2 mm-5 mm.

In some embodiments, a diameter-to-thickness ratio of the assistant polishing disc may be less than 8:1.

In some embodiments, a diameter of the assistant polishing disc may be 60%-80% of a diameter of the polishing disc.

In some embodiments, the diameter of the assistant polishing disc may not be less than 100 mm.

In some embodiments, a material density of the assistant polishing disc may be in a range of 5 g/cm²-20 g/cm².

In some embodiments, a diameter of the at least one polishing position may be in a range of 8 mm-45 mm.

In some embodiments, a total area of the at least one polishing position may be less than 50% of an area of the assistant polishing disc.

In some embodiments, a diameter of any one of the at least one polishing position may account for 12%-60% of the diameter of the assistant polishing disc.

In some embodiments, the at least one polishing position may be evenly disposed on the assistant polishing disc.

In some embodiments, a distance between two adjacent polishing positions of the at least one polishing position may be in a range of 10 mm-15 mm.

In some embodiments, a ratio of the diameter of the at least one polishing position to the diameter of the workpiece to be polished may be in a range of 1.2-1.5.

In some embodiments, a counterweight block may be disposed in the at least one polishing position. The counterweight block may apply the adjustable pressure in a direction of gravity to the workpiece to be polished.

In some embodiments, the counterweight block may be connected with the workpiece to be polished in the at least one polishing position through an elastic member.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be further illustrated by way of exemplary embodiments, which will be described in detail by means of the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same numbering indicates the same structure, where:

FIG. 1 is a schematic structural diagram illustrating an exemplary polishing device according to some embodiments of the present disclosure;

FIG. 2 is a schematic diagram illustrating a partial structure of an exemplary polishing device according to some embodiments of the present disclosure;

FIG. 3 is a schematic structural diagram illustrating an exemplary polishing device according to some embodiments of the present disclosure;

FIG. 4 is a schematic structural diagram illustrating an exemplary driving mechanism according to some embodiments of the present disclosure;

FIG. 5 is a schematic diagram illustrating a partial structure of an exemplary driving mechanism according to some embodiments of the present disclosure;

FIG. 6 is a schematic structural diagram illustrating an exemplary assistant polishing disc according to some embodiments of the present disclosure; and

FIG. 7 is a schematic structural diagram illustrating another exemplary polishing device according to other embodiments of the present disclosure.

Reference signs: 1. frame; 2. polishing disc; 21. liquid guide tank; 22. first motor; 3. assistant polishing disc; 4. polishing position; 5. fixture; 51. fixture base; 511. concave hole; 52. claw; 53. locking mechanism; 6. driving mechanism; 61. stylus; 611. stylus ball head; 62. swing arm structure; 621. swing rod; 622. swing frame; 623. fixed disc; 63. swing arm driving structure; 631. driving turntable; 632. driving rod; 633. sliding groove; 634. bolt; 635. connecting bolt; 636. transmission block; 64. first support; 65. second support; 7. liquid collection tank.

DETAILED DESCRIPTION

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the accompanying drawings required to be used in the description of the embodiments are briefly described below. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present disclosure, and it is possible for a person of ordinary skill in the art to apply the present disclosure to other similar scenarios in accordance with these drawings without creative labor. Unless obviously obtained from the context or the context illustrates otherwise, the same numeral in the drawings refers to the same structure or operation.

It should be understood that the terms “installing,” “connecting,” “connection,” and “coupling” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or an internal connection of two elements. However, the terms may be replaced by other expressions if other words accomplish the same purpose.

As shown in the present disclosure and the claims, unless the context clearly suggests an exception, the words “one,” “a,” “an,” “one kind,” and/or “the” do not refer specifically to the singular, but may also include the plural. Generally, the terms “including” and “comprising” suggest only the inclusion of clearly identified steps and elements, however, the steps and elements that do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

In order to complete a polishing process of a small-sized workpiece safely and efficiently, the embodiments of the present disclosure provide a polishing device for polishing the small-sized workpiece on a driving mechanism (e.g., a single-axis machine or a multi-axis machine). At least one polishing position for placing a workpiece to be polished is disposed on an assistant polishing disc. The assistant polishing disc is clamped by a fixture (e.g., clamped at a stylus of the single-axis machine or the multi-axis machine) and in contact with a polishing disc. Then polishing of the workpiece to be polished disposed in the at least one polishing position is implemented by rotation and/or swing. The size of the assistant polishing disc, and the count, size, and distribution of the at least one polishing position disposed on the assistant polishing disc are set based on the polishing requirement of the small-sized workpiece. In addition, a polishing pressure can be adjusted during the polishing process, such that the safe and efficient polishing of the small-sized workpiece can be achieved accordingly.

The polishing device provided by the embodiments of the present disclosure will be described in detail below with reference to FIGS. 1-7. It should be noted that the following embodiments are only intended to explain the present disclosure and do not constitute a limitation to the present disclosure.

FIG. 1 is a schematic structural diagram illustrating an exemplary polishing device according to some embodiments of the present disclosure. As shown in FIG. 1, a polishing device 100 may include a frame 1, and a polishing disc 2, an assistant polishing disc 3, and a fixture 5 that are that are disposed on the frame 1. The fixture 5 is configured to clamp the assistant polishing disc 3.

In some embodiments, the axes of the polishing disc 2 and the assistant polishing disc 3 are arranged along a direction of gravity (e.g., a vertical direction) of a workpiece to be polished. A side of the assistant polishing disc 3 close to the polishing disc 2 is provided with a relatively flat assistant polishing surface. A side of the polishing disc 2 close to the assistant polishing disc 3 is provided with a polishing surface. The assistant polishing surface of the assistant polishing disc 3 and the polishing surface of the polishing disc 2 are arranged to fit each other along the direction of gravity of the workpiece to be polished.

In some embodiments, the polishing disc 2 may include a crystal polishing disc, a wool polishing disc, a flannel polishing disc, etc.

In some embodiments, different polishing discs 2 may be selected according to different polishing requirements of the workpiece to be polished. In some embodiments, the polishing disc 2 with a suitable size, a suitable material of the polishing surface, a suitable hardness, etc., may be selected according to different polishing requirements of the workpiece to be polished. More descriptions regarding the polishing disc 2 may be found in FIG. 2, which are not repeated here.

In some embodiments, the assistant polishing disc 3 may have a certain weight, which can accordingly play a role in leveling the polishing disc 2 during the polishing process.

In order to make the assistant polishing disc 3 have a good function of leveling the polishing disc 3, a diameter of the assistant polishing disc 3 is not less than 100 mm. In some embodiments, the assistant polishing disc 3 may include a quartz disc, a microcrystalline disc, a granite disc, a glass disc, etc. In some embodiments, a material density of the assistant polishing disc 3 may be in a range of 5 g/cm²-20 g/cm². In some embodiments, the material density of the assistant polishing disc 3 may be in a range of 8 g/cm²-16 g/cm². In some embodiments, the material density of the assistant polishing disc 3 may be in a range of 11 g/cm²-14 g/cm². In some embodiments, the material density of the assistant polishing disc 3 may be 13 g/cm². Specifically, an assistant polishing specification (including a diameter and/or a material of the assistant polishing disc 3) may be set according to an assistant polishing requirement of the workpiece to be polished.

In some embodiments, at least one polishing position 4 is disposed on the assistant polishing disc 3 and configured to place the workpiece to be polished.

In some embodiments, the polishing position 4 may be a slot that penetrates through the assistant polishing disc 3. In some embodiments, a shape of the polishing position 4 may be a circle, a square, a triangle, or any regular or irregular shape, and may be set according to the actual needs of the workpiece to be polished. More descriptions regarding the polishing position 4 may be found in FIG. 6, which are not be repeated here.

During the polishing process, the workpiece to be polished may be placed in the polishing position 4. Due to the effect of the gravity, a surface to be polished of the workpiece to be polished contacts a polishing surface of the polishing disc 2. Further, the polishing disc 2 may rotate, and the assistant polishing disc 3 may rotate and/or swing (e.g., rotate and/or swing along a horizontal plane perpendicular to the direction of gravity of the workpiece to be polished) to drive the workpiece to be polished to rotate/or swing to achieve polishing of the workpiece to be polished. In some embodiments, a swing range of the assistant polishing disc 3 is within a polishing surface range of the polishing disc 2.

FIG. 2 is a schematic diagram illustrating a partial structure of an exemplary polishing device according to some embodiments of the present disclosure.

In some embodiments, as shown in FIG. 2, the assistant polishing disc 3 is clamped by the fixture 5 and disposed above the polishing disc 2. The “above” and “below” described in the embodiments of the present disclosure refer that a direction opposite to the direction of gravity is above (or up), and a direction in the same direction as the direction of gravity is below. The fixture 5 includes a plurality of claws 52. The plurality of claws 52 include at least a first claw extending from above the at least one polishing position 4 to an edge of the assistant polishing disc 3. A pre-tightening part is disposed at a position, corresponding to the at least one polishing position 4, of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value (which can represent a polishing removal efficiency) is preset on the scale. The pre-tightening member adjusts a pre-tightening force to the workpiece to be polished based on the scale value to adjust the polishing efficiency when the workpiece to be polished is polished. In some embodiments, the claw 52 may correspond one-to-one with the polishing position 4, that is, each polishing position 4 is disposed with a first claw above it. In some embodiments, a count of the plurality of claws 52 may also be greater than a count of the at least one polishing position 4, each polishing position 4 is disposed with a first claw above it, and the rest claws may be second claws.

In some embodiments, the adjustment of the pre-tightening force on the workpiece to be polished by the pre-tightening member may be achieved by adjusting a displacement of the pre-tightening member to adjust a pressure of the pre-tightening member on the workpiece to be polished in the direction of gravity. The scale may quantify a relationship between the displacement of the pre-tightening member and the polishing efficiency, i.e., characterize the polishing efficiency.

The polishing removal efficiency refers to a removal amount per unit time of the workpiece to be polished during the polishing process. The scale value representing the polishing removal efficiency being preset on the scale means that a plurality of scale values are preset on the scale to represent different polishing removal efficiencies when the pre-tightening member applies different pre-tightening forces to the workpiece to be polished. For example, a first scale represents that the polishing removal efficiency is 0.5 μm/h at a first pressure applied by the pre-tightening member, that is, during the polishing process, when the first pre-tightening force is adjusted by the pre-tightening member based on a first scale value, the removal amount of polishing of the workpiece to be polished per hour is 0.5 μm. As another example, a second scale represents that the polishing removal efficiency is 1 μm/h at a second pressure applied by the pre-tightening member, that is, during the polishing process, when the second pre-tightening force is adjusted by the pre-tightening member based on a second scale value, the removal amount of polishing of the workpiece to be polished per hour is 1 μm. The numerical examples here are only used to explain the scale values on the scale that represent the polishing efficiencies. The specific setting of the scale values is not limited. For example, the scale values may also be levels of polishing removal efficiencies (e.g., level 1, level 2, etc.), and the polishing removal efficiency represented by each scale value may also be a percentage of thickness of the workpiece polished per hour, etc.

The scale value on the scale that characterizes the polishing efficiency may be calculated according to the different polishing requirements of the workpiece to be polished, and the size, material, hardness, etc., of the polishing disc 2. A calculation method of the scale value may be determined according to an actual operation condition, which is not repeated here. In some embodiments, the scale values on the scale may also characterize different polishing removal efficiencies corresponding to different rotation speeds of the polishing disc and swing amplitudes of the assistant polishing disc. In some embodiments, a correspondence between the polishing removal efficiency represented by each scale value and the rotation speed of the polishing disc or the swing amplitude of the assistant polishing disc may be pre-calculated and stored. During the polishing process, different scale values may be selected according to the actual operation condition (e.g., the rotation speed of the polishing disc, the swing amplitude of the assistant polishing disc, etc.) to adjust the polishing removal efficiency of the workpiece to be polished.

In some embodiments, the pre-tightening member may include a pre-tightening spring. The pre-tightening part penetrates through the first claw upward along the direction of gravity and is mounted on the first claw. The pre-tightening part is also provided with a pre-tightening force adjustment button and a scale. An upper end of the pre-tightening spring connects with the pre-tightening force adjustment button, and a lower end of the pre-tightening spring directly or indirectly abuts against the workpiece to be polished. The pre-tightening force adjustment button and the scale may be located above the first claw. During the polishing process, a displacement (i.e., a deformation) of the pre-tightening spring is adjusted by adjusting a displacement of the pre-tightening force adjustment button based on the scale according to different polishing requirements, so as to adjust the pre-tightening force of the pre-tightening spring, thereby adjusting the pressure applied to the workpiece to be polished in the direction of gravity.

The pre-tightening part disposed on the polishing device enables the polishing device to predict and monitor the polishing efficiency when the small-sized workpiece is polished. During the polishing process, the pre-tightening force of the pre-tightening member to the workpiece to be polished may be adjusted according to different polishing requirements. For example, the pre-tightening force is first adjusted to the first scale for polishing 1 h at a first polishing efficiency corresponding to the first scale, then the pre-tightening force is adjusted to a second scale according to a polishing progress for polishing 1 h at a second polishing efficiency corresponding to the second scale, and then the pre-tightening force is adjusted continuously. During the polishing process, the polishing efficiency of the small-sized workpiece can be effectively improved by adjusting the pre-tightening part, so as to achieve the purpose of mass production of small-sized polished workpieces.

In some embodiments, a diameter range that can be clamped by the fixture 5 is adjustable. For example, the diameter range that can be clamped by the fixture 5 may be adjusted according to an outer diameter of the assistant polishing disc 3.

In some embodiments, the fixture 5 may include a fixture base 51 and the plurality of claws 52 to clamp the assistant polishing disc 3. In some embodiments, the plurality of claws 52 may be adjustably connected to the fixture base 51. In some embodiments, inner sides of lower sides of the plurality of claws 52 form a certain clamping range for clamping the assistant polishing disc 3. In some embodiments, a diameter range clamped by the plurality of claws 52 may be adjusted by adjusting positions and/or distances of the plurality of claws 52 relative to the fixture base 51. For example, the diameter clamped by the plurality of claws 52 of the fixture 5 may be adjusted to be a certain size (e.g., 10-15 mm) greater than the outer diameter of the assistant polishing disc 3 according to the outer diameter of the assistant polishing disc 3.

In some embodiments, the fixture 5 may further include a locking mechanism 53 for clamping and fixing the assistant polishing disc 3. In some embodiments, the locking mechanism 53 may include a locking screw. In some embodiments, a rubber gasket may be attached to a front end (e.g., a contact position between an outer periphery of the assistant polishing disc 3 and the locking screw) of the locking screw and the locking screw may be tightened.

In some embodiments, a concave hole 511 may be disposed at a center of an upper end surface of the fixture base 51 for transmission connection with a stylus ball head 611 of a driving mechanism 6. More descriptions regarding the driving mechanism 6 may be found in FIG. 4 and FIG. 5. In some embodiments, the concave hole 511 may be hemispherical, arc-shaped, etc., which is not limited in the present disclosure.

Merely by way of example, as shown in FIG. 3, the fixture 5 includes the fixture base 51 and four claws 52. The fixture base 51 includes two cylinders arranged in a stepped manner, and the four claws 52 are evenly distributed and connected on the step along a circumferential direction. The four claws 52 may be L-shaped. One end of each claw 52 is adjustably connected to the fixture base 51, and the other end of each claw 52 faces the polishing surface of the polishing disc 2. A space enclosed below the four claws 52 is used to clamp the assistant polishing disc 3. By adjusting the positions of the four claws 52 relative to the fixture base 51, the size of the space enclosed below the four claws 52 is adjusted to clamp the assistant polishing disc 3. A locking screw is mounted on each claw 52, and the locking screw penetrates the claw 52 and abuts against a side wall of the assistant polishing disc 3 to clamp the assistant polishing disc 3. A central axis of the assistant polishing disc 3 after being clamped remains on the same axis as a central axis of the fixture base 51. The count of the polishing positions 4 disposed on the assistant polishing disc 3 corresponds one-to-one with the count of the claws 52. In this embodiment, four polishing positions 4 are correspondingly arranged below the four claws 52, and four pre-tightening parts are arranged at the positions of the four claws 52 corresponding to the four polishing positions 4. In this embodiment, the count of the claws 52 and the polishing positions 4 is only used as an example and is not limited here.

In some embodiments, the polishing device 100 may further include a flatness detection mechanism and a pressure adjustment mechanism. The flatness detection mechanism is configured to detect the flatness of the polishing surface of the polishing disc 2. The pressure adjustment mechanism is configured to adjust the pressure applied to the polishing disc 2 by the assistant polishing disc 3 according to a detection result of the flatness detection mechanism. During the polishing process, the flatness detection mechanism detects the flatness of the polishing surface of the polishing disc 2 in real time, and the pressure adjustment mechanism adjusts the pressure applied to the polishing disc 2 by the assistant polishing disc 3 in real time. In this way, the assistant polishing disc 3 can level the polishing disc 2 during the polishing process, which can not only improve the polishing effect, but also effectively increase the service life of the polishing disc 2.

In some embodiments, the flatness detection mechanism may be a laser flatness detection mechanism. The laser flatness detection mechanism realizes the flatness detection of the polishing surface of the polishing disc 2 based on the optical principle. For example, the laser flatness detection mechanism may emit a vertical linear laser to illuminate the polishing surface (a portion of the polishing surface that is not blocked by the assistant polishing disc 3 during the polishing process) of the polishing disc 2 and receive a reflected laser, obtain a distance between a laser emitting part of the laser flatness detection mechanism and the polishing surface based on the reflection of the laser, and calculate an offset of a detected point based on the distance between the laser emitting part and the polishing surface relative to a preset reference distance. A microprocessor of the laser flatness detection mechanism is configured to set a flatness preset condition, and compare the offset with the flatness preset condition to obtain a flatness error value. The microprocessor may be further configured to determine whether the flatness error value meets a flatness requirement, and finally send a flatness detection result (e.g., a flatness error value that does not meet a preset condition) to the pressure adjustment mechanism. The flatness detection mechanism may also be any other flatness detection mechanism, such as a leveling instrument, etc., which is not limited here.

The pressure adjustment mechanism adjusts the pressure applied to the polishing disc 2 by the assistant polishing disc 3 according to the received flatness detection result. For example, the greater the flatness error value, the greater the pressure applied to the polishing disc 2 by the assistant polishing disc 3 adjusted by the pressure adjustment mechanism. In some embodiments, the pressure adjusted by the pressure adjustment mechanism is calculated according to the polishing requirement of the workpiece to be polished, the material of the polishing surface of the polishing disc 2, and other different conditions.

In some embodiments, the pressure adjustment mechanism is disposed on the fixture 5. The pressure adjustment mechanism controls the fixture 5 to apply an adjustable pressure in the direction of gravity to the assistant polishing disc 3, thereby enabling the assistant polishing disc 3 to apply the adjustable pressure in the direction of gravity to the polishing disc 2.

In some embodiments, the pressure adjustment mechanism may be an air pressure adjustment mechanism. The fixture 5 may be connected with the air pressure adjustment mechanism (not shown in the figure). The air pressure adjustment mechanism may be configured to apply the adjustable pressure in the direction of gravity. In some embodiments, the air pressure adjustment mechanism may include a controller, an electrical pressure component, a pressure detection component, etc. The electrical pressure component may be fixedly connected above the fixture 5 to apply a pressure in the direction of gravity to the fixture 5. The controller may receive the flatness detection result detected by the flatness detection mechanism, and control the electrical pressure component to adjust the pressure after further calculation. The electrical pressure component is configured to apply the pressure in the direction of gravity. The pressure detection component is configured to detect a magnitude of the applied pressure. The controller adjusts the pressure in the direction of gravity applied to the fixture 5 by the electrical pressure component in real time according to the magnitude of the pressure detected by the pressure detection component to realize that the assistant polishing disc 3 applies the pressure in the direction of gravity to the polishing disc 2. In some embodiments, the magnitude of the pressure applied to the polishing disc 2 by the assistant polishing disc 3 via the fixture 5 may be adjusted according to the material of the polishing surface of the polishing disc 2, so as to realize better leveling of the polishing disc 2.

In some embodiments, the polishing device 100 may further include the driving mechanism 6. The driving mechanism 6 may be connected with the fixture 5 via the stylus ball head 611, and configured to drive the assistant polishing disc 3 to rotate and/or swing. More descriptions regarding the driving mechanism 6 may be found in FIG. 4 and FIG. 5, which are not repeated here.

In some embodiments, the polishing device 100 may further include a liquid collection tank 7 for collecting a polishing liquid overflowing from the polishing disc 2 (e.g., the liquid guide tank 21 shown in FIG. 3). In some embodiments, the liquid collection tank 7 may be bowl-shaped with an upper opening, and the polishing disc 2 locates in a cavity of the liquid collection tank 7. In some embodiments, the liquid collection tank 7 may be connected with a flow guide device, and the polishing liquid collected by the liquid collection tank 7 can be transported to the liquid guide tank 21 again through the flow guide device, such that the polishing liquid can be recycled.

FIG. 3 is a schematic structural diagram illustrating an exemplary polishing disc according to some embodiments of the present disclosure.

In some embodiments, as shown in FIG. 3, the liquid guide tank 21 may be disposed on a polishing surface of the polishing disc 2 to guide the polishing liquid. The polishing liquid overflowing from the liquid guide tank 21 may flow into the liquid collection tank 7.

In some embodiments, in order to adapt to the polishing of a small-sized workpiece, the size of the liquid guide tank 21 needs to meet a preset requirement. The small-sized liquid guide tank 21 may be disposed on the polishing disc 2, which can effectively avoid safety accidents such as the small-sized workpiece overturning or getting stuck between the assistant polishing disc and the polishing disc during the polishing process, ensuring the efficiency and safety of the small-sized workpieces during the polishing process. In some embodiments, a width of the liquid guide tank 21 may be in a range of 1 mm-5 mm.

Since the conditions for overturning of workpieces of different sizes are different, different widths of liquid guide tanks 21 may be set for workpieces to be polished of different sizes. In some embodiments, the width of the liquid guide tank 21 may be 3%-20% of a diameter of the workpiece to be polished. In some embodiments, the width of the liquid guide tank 21 may be 3%-15% of the diameter of the workpiece to be polished. In some embodiments, the width of the liquid guide tank 21 may be 3%-12% of the diameter of the workpiece to be polished.

In order to make the liquid guide tank 21 adapt to more sizes of workpieces to be polished, the width of the liquid guide tank 21 needs to be set as small as possible to avoid overturning of the small-sized workpiece to be polished. However, the liquid guide tank 21 with too small width is easily blocked by impurities generated during the polishing process, which is not conducive to the discharge of the polishing liquid. In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide tank 21 may be in a range of 1 mm-3 mm. In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide tank 21 may be in a range of 1.5 mm-2.5 mm. In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide tank 21 may be in a range of 1 mm-2 mm.

For a relatively large workpiece to be polished, the width of the liquid guide tank 21 may be set slightly larger to facilitate the discharge of the polishing liquid. In some embodiments, when the diameter of the workpiece to be polished is in a range of 25.4 mm-50.8 mm, the diameter of the liquid guide tank 21 may be in a range of 2 mm-5 mm. In some embodiments, when the diameter of the workpiece to be polished is in a range of 25.4 mm-50.8 mm, the diameter of the liquid guide tank 21 may be in a range of 2 mm-4 mm. In some embodiments, when the diameter of the workpiece to be polished is in a range of 25.4 mm-50.8 mm, the diameter of the liquid guide tank 21 may be in a range of 3 mm-4 mm.

In some embodiments, the diameter of the liquid guide tank 21 may be in a range of 1.5 mm-2.5 mm. In some embodiments, the diameter of the liquid guide tank 21 may be in a range of 1.6 mm-2.4 mm. In some embodiments, the diameter of the liquid guide tank 21 may be in a range of 1.7 mm-2.3 mm. In some embodiments, the diameter of the liquid guide tank 21 may be in a range of 1.8 mm-2.2 mm. In some embodiments, the diameter of the liquid guide tank 21 may be in a range of 1.9 mm-2.1 mm. In some embodiments, the diameter of the liquid guide tank 21 may be 2.0 mm.

In some embodiments, the polishing disc 2 may be driven to rotate by a power source. In some embodiments, as shown in FIG. 3, a first motor 22 may be provided below the polishing disc 2 to drive the polishing disc 2 to rotate. In some embodiments, an output shaft of the first motor 22 may be in transmission connection with the polishing disc 2 and coaxially arranged with the polishing disc 2. Since an assistant polishing surface of the assistant polishing disc 3 contacts with the polishing surface of the polishing disc 2 along the direction of gravity of the workpiece to be polished, the first motor 22 below may also drive the assistant polishing disc 3 to rotate when driving the polishing disc 2 to rotate.

In some embodiments, the polishing disc 2 may be driven to rotate by other power sources, which are not limited in the present disclosure.

FIG. 4 is a schematic structural diagram illustrating an exemplary driving mechanism according to some embodiments of the present disclosure. FIG. 5 is a schematic diagram illustrating a partial structure of an exemplary driving mechanism according to some embodiments of the present disclosure.

In some embodiments, the driving mechanism 6 may be configured to drive the assistant polishing disc 3 to rotate and/or swing. In some embodiments, the driving mechanism 6 may be a single-axis machine or a multi-axis machine. The following description takes the single-axis machine as an example.

In some embodiments, as shown in FIG. 4, the driving mechanism 6 may include the stylus 61, a swing arm structure 62, and a swing arm driving structure 63.

In some embodiments, the stylus 61 may swing. For example, the stylus 61 may swing along a horizontal direction to drive the fixture 5 and the assistant polishing disc 3 to swing together.

In some embodiments, a lower end of the stylus 61 may be disposed with the stylus ball head 611 for connecting with the fixture 5. For example, the stylus ball head 611 contacts with the concave hole 511 disposed on an upper end surface of the fixture base to achieve a sliding connection between the stylus 61 and the fixture 5. In some embodiments, a shape of the stylus ball head 611 may be any shape that matches a shape of the concave hole 511, such as a hemispherical shape or an arc shape, etc.

In some embodiments, a height of the stylus 61 relative to the fixture 5 (or the polishing disc 2) in the direction of gravity may be adjusted to meet the polishing requirements of different workpieces to be polished.

In some embodiments, the swing arm structure 62 may drive the stylus 61 to swing. The swing arm driving structure 63 may provide a driving force for the swing arm structure 62 to swing.

In some embodiments, the swing arm structure 62 may include a swing rod 621, a swing frame 622, and a fixed disc 623. One end of the swing rod 621 is rotatably connected to the frame 1 (e.g., fixedly connected to the frame 1 through a first support 64), and the other end of the swing rod 621 is connected to the swing arm driving structure 63. The swing frame 622 slidably sleeves the swing rod 621. The fixed disc 623 is connected to the swing frame 622 to fix the stylus 61.

In some embodiments, the swing arm driving structure 63 includes a driving turntable 631, a driving rod 632, and a second motor (not shown in the figure). An upper end surface of the driving turntable 631 may be provided with a sliding groove 633 (e.g., an inverted T-shaped sliding groove). One end of the driving rod 632 is in transmission connection with the sliding groove 633 by a bolt 634 (e.g., an inverted T-shaped bolt). The driving rod 632 rotatably connects with the bolt 634 and can rotate around a central axis of the bolt 634. The other end of the driving rod 632 rotatably connects with the other end of the swing rod 621 by a connecting bolt 635. The second motor may be mounted in the frame 1 and located below the driving turntable 631. An output shaft of the second motor is in transmission connection with the driving turntable 631. A driving force of the second motor is transmitted to the driving turntable 631, then to the driving rod 632, and then to the swing rod 621, such that the swing rod 621 can repeatedly and horizontally swing around the first support 64 to drive the swing frame 622, and then drive the stylus 61 to swing repeatedly and horizontally.

In some embodiments, the sliding groove 633 may be disposed along a radial direction of the driving turntable 631. In some embodiments, a length of the sliding groove 633 is less than a diameter of the driving turntable 631. For example, the length of the sliding groove 633 is ½-⅔ of the diameter of the driving turntable 631. In some embodiments, the bolt 634 matches the size of the sliding groove 633, and the bolt 634 and the sliding groove 633 slidably match.

In some embodiments, the driving mechanism 6 may further include a second support 65. The second support 65 is fixedly connected to the frame 1. As shown in FIG. 5, a transmission block 636 may be fixedly provided above the second support 65. The transmission block 636 may be a strip having a certain width, and an extension direction of the transmission block 636 passes through an axis of the driving turntable 631. The connecting bolt 635 penetrates through the driving rod 632 and the swing rod 621. A lower end surface of the connecting bolt 635 fits with an upper end surface of the transmission block 636. The connecting bolt 635 may contact and slide on the transmission block 636. When the driving turntable 631 rotates, since one end of the swing rod 621 is hinged to the first support 64, the connecting bolt 635 performs an arc reciprocating movement on the transmission block 636, thereby realizing the repeated and horizontal swing of the swing rod 621.

In some embodiments, the movement of the swing arm structure 62 and/or the swing arm driving structure 63 may also be achieved through an electric slide, a linear module, a single-axis drive, etc., which is not limited in the present disclosure.

In some embodiments, the pressure adjustment mechanism may be provided on the driving mechanism 6. The pressure adjustment mechanism may control the stylus 61 to apply an adjustable pressure to the assistant polishing disc 3.

In some embodiments, the pressure adjustment mechanism may be disposed on the swing frame 622. The pressure adjustment mechanism may control the swing frame 622 to rotate around an axis of the swing rod 621, such that the swing frame 622 can control the stylus 61 to apply the adjustable pressure to the assistant polishing disc 3. For example, the greater the flatness error value detected by the flatness detection mechanism, the greater the counterclockwise rotation angle of the swing frame 622 around the axis of the swing rod 621 controlled by the pressure adjustment mechanism (e.g., FIG. 4), and the greater the pressure applied to the assistant polishing disc 3 by the stylus 61 driven by the swing frame 622.

In some embodiments, the pressure adjustment mechanism may include a controller, a rotation component, a pressure detection component, etc. The controller may receive a flatness detection result detected by the flatness detection mechanism, and control the rotation component to perform a pressure adjustment after further calculation. The rotation component is configured to control the swing frame 622 to rotate around the axis of the swing rod 621. For example, the rotation component may be a linear drive component such as a cylinder or a motor, which is disposed at a rear side (i.e., a side opposite to the stylus 61) of the swing frame 622. The rotation component provides a horizontal thrust to the swing frame 622 to realize the rotation of the swing frame 622 around the axis of the swing rod 621. As another example, the rotation component may be a driving motor disposed in a sleeve connecting the swing frame 622 and the swing rod 621, and configured to drive the sleeve to rotate relative to the swing rod 621 to realize the rotation of the swing frame 622 around the axis of the swing rod 621.

In some embodiments, the driving mechanism 6 may also be implemented by a multi-axis machine. The multi-axis machine includes a plurality of swingable styluses 61. Merely by way of example, as a multi-axis polishing device 200 shown in FIG. 7, the multi-axis machine is provided with two styluses 61. Accordingly, two polishing discs 2, two assistant polishing discs 3, and two fixtures 5 are provided. The multi-axis machine drives the two styluses 61 to swing, so as to drive the two fixtures 5 and the two polishing discs 3 to swing (e.g., swing along a horizontal direction). The multi-axis machine can realize the polishing of more workpieces to be polished simultaneously, thereby improving production efficiency.

FIG. 6 is a schematic structural diagram illustrating an exemplary assistant polishing disc according to some embodiments of the present disclosure.

In some embodiments, in order to ensure that the size and/or weight of the assistant polishing disc can be suitable for different application scenarios of small-sized polishing, and ensure that the assistant polishing disc does not easily deform during the polishing process, while comprehensively considering the cost and processing requirements, a diameter-to-thickness ratio of the assistant polishing disc needs to meet a certain requirement.

The diameter-to-thickness ratio of the assistant polishing disc 3 refers to a ratio of a diameter to an axial thickness of the assistant polishing disc 3. In some embodiments, the diameter-to-thickness ratio of the assistant polishing disc 3 may not be greater than 10:1. In some embodiments, the diameter-to-thickness ratio of the assistant polishing disc 3 may be less than 8:1. In some embodiments, the diameter-to-thickness ratio of the assistant polishing disc 3 may be less than 7:1. In some embodiments, the diameter-to-thickness ratio of the assistant polishing disc 3 may be less than 6:1. For example, the diameter-to-thickness ratio of the assistant polishing disc 3 may include 7.8:1, 7.5:1, 7:1, 6.5:1, 6:1, 5.6:1, 4.8:1, etc.

In order to ensure that the assistant polishing disc 3 has a certain rotation and/or swing stroke on a polishing surface of the polishing disc 2 to improve the polishing effect of a workpiece to be polished, in some embodiments, the diameter of the assistant polishing disc 3 may be 60%-80% of the diameter of the polishing disc 2. In some embodiments, the diameter of the assistant polishing disc 3 may be 65%-75% of the diameter of the polishing disc 2. In some embodiments, the diameter of the assistant polishing disc 3 may be approximately 70% of the diameter of the polishing disc 2. It should be noted that the “approximately” used in the embodiments of the present disclosure means that the value is allowed to float within the range of +5%.

In some embodiments, a total area of the polishing positions 4 disposed on the assistant polishing disc 3 may affect the overall strength and the assistant polishing effect of the assistant polishing disc 3. The total area of the polishing positions 4 is a sum of the areas of all the polishing positions 4. In order to ensure that the assistant polishing disc 3 has sufficient strength and does not easily deform during the polishing process, while comprehensively considering the assistant polishing efficiency of the assistant polishing disc 3 relative to the polishing disc 2, the area proportion of the polishing positions 4 to the assistant polishing disc 3 needs meet a certain requirement.

In some embodiments, the total area of the polishing positions 4 on the assistant polishing disc 3 may be less than 60% of the area of the assistant polishing disc 3. In some embodiments, the total area of the polishing positions 4 on the assistant polishing disc 3 may be less than 50% of the area of the assistant polishing disc 3. In some embodiments, the total area of the polishing positions 4 on the assistant polishing disc 3 may be less than 40% of the area of the assistant polishing disc 3.

In some embodiments, the diameter of one polishing position 4 may account for 12%-60% of the diameter of the assistant polishing disc 3. In some embodiments, the diameter of one polishing position 4 may account for 18%-53% of the diameter of the assistant polishing disc 3. In some embodiments, the diameter of one polishing position 4 may account for 20%-45% of the diameter of the assistant polishing disc 3. In some embodiments, the diameter of one polishing position 4 may account for 22%-40% of the diameter of the assistant polishing disc 3. In some embodiments, the diameter of one polishing position 4 may account for 24%-32% of the diameter of the assistant polishing disc 3. In some embodiments, the diameter of one polishing position 4 may approximately account for 25% of the diameter of the assistant polishing disc 3.

In some embodiments, in order to better meet the processing requirement of the small-sized workpiece, the size of the polishing position 4 needs to meet a certain requirement.

In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 8 mm-45 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 8 mm-44 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 9 mm-43 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 10 mm-42 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 11 mm-41 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 12 mm-40 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 13 mm-39 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 14 mm-38 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 15 mm-37 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 16 mm-36 mm. In some embodiments, the diameter of the at least one polishing position 4 may be in a range of 17 mm-35 mm. For example, the diameter of the at least one polishing position 4 may include 8.5 mm, 9.5 mm, 10.5 mm, 11.5 mm, 12.5 mm, 13.5 mm, 14.5 mm, 15.5 mm, 16.5 mm, 17.5 mm, 18 mm, 18.5 mm, 19 mm, 19.5 mm, . . . , 45 mm, etc.

In some embodiments, the diameter of the polishing position 4 needs to be larger than the diameter of the workpiece to be polished by a certain size, so as to ensure that when the workpiece to be polished is placed in the polishing position 4 for polishing, the polishing position 4 does not affect the irregular movement of the workpiece to be polished in the polishing position 4, and the workpiece to be polished does not slip out of the polishing position 4 due to the movement during the polishing process. In some embodiments, a ratio of the diameter of the polishing position 4 to the diameter of the workpiece to be polished may be in a range of 1.2-1.5. In some embodiments, the ratio of the diameter of the polishing position 4 to the diameter of the workpiece to be polished may be in a range of 1.3-1.4. In some embodiments, the ratio of the diameter of the polishing position 4 to the diameter of the workpiece to be polished may be about 1.35.

In some embodiments, the diameter of the polishing position 4 may be greater than the diameter of the workpiece to be polished by 5 mm-8 mm. In some embodiments, the diameter of the polishing position 4 may be greater than the diameter of the workpiece to be polished by 5 mm-7 mm. In some embodiments, the diameter of the polishing position 4 may be greater than the diameter of the workpiece to be polished by 6 mm-8 mm. In some embodiments, the diameter of the polishing position 4 may be greater than the diameter of the workpiece to be polished by 6 mm-7 mm. In some embodiments, the diameter of the polishing position 4 may be greater than the diameter of the workpiece to be polished by 6.5 mm.

In some embodiments, the polishing device 100 may be provided with a plurality of models of assistant polishing discs 3 simultaneously (e.g., different models include different sizes and/or weights of assistant polishing discs 3, different sizes and/or counts of polishing positions 4, etc.), and the assistant polishing disc 3 can be replaced according to the polishing requirement of the workpiece to be polished.

In some embodiments, the at least one polishing position 4 may be evenly arranged on the assistant polishing disc 3 to ensure that the entire assistant polishing disc 3 has even gravity in the direction of gravity, thereby ensuring that the workpiece to be polished is evenly polished when placed in the at least one polishing position 4 for polishing.

In some embodiments, a plurality of polishing positions are evenly arranged in a radial direction and/or a circumferential direction of the assistant polishing disc 3. For example, as shown in FIG. 6, six polishing positions 4 are provided on the assistant polishing disc 3, and the six polishing positions 4 are evenly arranged in the radial direction and the circumferential direction of the assistant polishing disc 3. Specifically, one polishing position 4 is provided at a center of the assistant polishing disc 3, and the other five polishing positions 4 are evenly arranged in the circumferential direction, a distance between centers of every two adjacent polishing positions 4 is equal.

It should be noted that the arrangement and count of the polishing positions shown in FIG. 6 are only examples, and three, four, five, or more polishing positions 4 may be provided, which may be set according to actual needs. The arrangement of the polishing positions may also be in other ways, which is not limited in the present disclosure.

In some embodiments, considering the polishing effect, the polishing efficiency, etc., a distance (e.g., a distance between center points of the adjacent polishing positions, a distance between edges of the adjacent polishing positions, etc.) between the adjacent polishing positions 4 needs to meet a certain requirement.

In some embodiments, the distance between the two adjacent polishing positions 4 may be in a range of 10 mm-15 mm. In some embodiments, the distance between the two adjacent polishing positions 4 may be in a range of 11 mm-14 mm. In some embodiments, the distance between the two adjacent polishing positions 4 may be in a range of 11 mm-13 mm. In some embodiments, the distance between the two adjacent polishing positions 4 may be 12 mm.

In some embodiments, a counterweight block (not shown in the figure) may be provided in the polishing position 4. The counterweight block may apply an adjustable pressure in the direction of gravity to the workpiece to be polished. During the polishing process, the counterweight block acts on the workpiece to be polished to apply the pressure toward the polishing disc 2 to the workpiece to be polished. Accordingly, a relative force between the workpiece to be polished and the polishing disc 2 increases, thereby improving the polishing effect.

In some embodiments, when the polishing requirement of the workpiece to be polished is low, the pre-tightening part may not be used, and the counterweight block may be disposed in the polishing position 4 of the polishing device. The polishing accuracy and the polishing efficiency of the polishing device of this embodiment are relatively low compared with that of using the pre-tightening part. By replacing the counterweight blocks of different models (e.g., different thicknesses and weights), the polishing device of this embodiment realizes that the pressure in the direction of gravity applied to the workpiece to be polished by the counterweight block can be adjusted.

In some embodiments, the counterweight block disposed in the polishing position 4 of the polishing device may also be used in cooperation with the pre-tightening part. The polishing accuracy and the polishing efficiency of the polishing device may be better. When the polishing requirement of the workpiece to be polished is high, the counterweight block may be used for applying the pressure and the pre-tightening part may be used for adjusting the pre-tightening force to achieve the optimal pressure value applied to the workpiece to be polished, so as to improve the polishing accuracy and the polishing efficiency. For example, an upper end surface of the counterweight block is connected to a lower end of the pre-tightening part, and a lower end surface of the counterweight block abuts against the workpiece to be processed. The counterweight block applies a certain pressure to the workpiece to be polished through the weight of the counterweight block, and the pre-tightening part applies an adjustable pre-tightening force in the direction of gravity to the workpiece to be polished through the counterweight block.

In some embodiments, a weight of the counterweight block may be determined according to the size and/or the weight of the workpiece to be polished, the polishing effect to be achieved, etc.

In some embodiments, the weight of the counterweight may be in a range of 10 g-150 g. In some embodiments, the weight of the counterweight may be in a range of 30 g-120 g. In some embodiments, the weight of the counterweight may be in a range of 40 g-100 g. In some embodiments, the weight of the counterweight may be in a range of 50 g-80 g. In some embodiments, the weight of the counterweight may be 60 g.

In some embodiments, the counterweight block may be detachably connected in the polishing position 4. The polishing device 100 may be provided with counterweight blocks of various weight models simultaneously, and the counterweight block may be replaced according to the polishing requirement (e.g., the weight model of the counterweight block may include 10 g, 15 g, 20 g, 25 g, 30 g, 35 g, . . . , 150 g, etc.).

In some embodiments, the counterweight block may be connected to the workpiece to be polished in the polishing position 4 through an elastic member. The counterweight block and the elastic member are arranged along the gravity direction of the workpiece. The counterweight block and the elastic member cooperate to adapt to workpieces to be polished of different heights. During the polishing process, the counterweight block continues to apply the pressure to the workpiece to be polished to improve the polishing effect.

In some embodiments, the counterweight block may be connected to a bottom end surface of the fixture base 51 through an elastic member. The lower end surface of the counterweight block contacts with an upper end surface of the workpiece to be polished.

In some embodiments, in order to ensure that the counterweight block is stably attached to the upper end surface of the workpiece to be polished and maintain a stable pressure during the polishing process, the counterweight block may be a block with the same size and shape as a horizontal surface of the workpiece to be polished.

The present disclosure further provides a polishing method for a workpiece to be polished by the polishing device 100 described in any of the above embodiments. The polishing method may comprise part or all of the following operations.

- 001) The assistant polishing disc 3 (and/or the at least one polishing position 4 thereon) may be selected or set based on a polishing requirement of the workpiece to be polished. The polishing requirement of the workpiece to be polished may include a size, a weight, and/or a material of the workpiece to be polished, parameters of the assistant polishing disc 3 may include a material and/or a size, and parameters of the at least one polishing position 4 may include a material, a size, a count, and/or a position distribution.
- 002) The assistant polishing disc 3 may be placed on the polishing disc 2, an assistant polishing surface of the assistant polishing disc 3 may contact with a polishing surface of the polishing disc 2, and the workpiece to be polished may be placed in the at least one polishing position 4. Due to the gravity, a surface to be polished of the workpiece to be polished may contact with the polishing surface of the polishing disc.
- 003) A diameter clamped by the plurality of claws 52 of the fixture 5 may be adjusted to a certain size (e.g., 10-15 mm) greater than an outer diameter of the assistant polishing disc 3 based on the outer diameter of the assistant polishing disc 3, and the assistant polishing disc 3 may be clamped and fixed by the locking mechanism 53.
- 004) A height of the stylus ball head 611 relative to the fixture 5 may be adjusted through the fixed disc 623 based on a thickness of the assistant polishing disc 3, such that the stylus ball head 611 may be in transmission connection with the concave hole 511 of the fixture 5.
- 005) A pressure applied to the assistant polishing disc 3 (or the polishing disc 2) by the fixture 5 may be adjusted by an air pressure device based on a material of the polishing surface of the polishing disc 2.
- 006) A pressure applied to the workpiece to be polished in the direction of gravity by the counterweight block may be adjusted based on the size, the weight, and/or the material of the workpiece to be polished.
- 007) The first motor 22 and the driving mechanism 6 may be turned on. When the polishing disc 2 is driven by the first motor 22, the polishing disc 2 may rotate to drive the assistant polishing disc 3 to rotate, and the driving mechanism 6 may drive the assistant polishing disc 3 to rotate and/or swing through the stylus 61, thereby achieving polishing of the workpiece to be polished.

The beneficial effects that may be brought by the embodiments of the present disclosure include but are not limited to the following contents: 1) the assistant polishing disc and the at least one polishing position set based on the polishing requirements of the workpiece to be polished can adapt to the polishing process of the small-sized workpieces; 2) the polishing pressure (e.g., the pressure applied by the fixture, the pressure applied by the counterweight, etc.) can be adjusted during the polishing process, which can achieve safe and efficient polishing of the small-sized workpiece; 3) by replacing different polishing discs, the same polishing device can process workpieces of various sizes and/or requirements; and 4) the small-sized liquid guide tank on the polishing disc ensures the efficiency and safety of the small-sized workpiece during the polishing process.

Having thus described the basic concepts, it may be rather apparent to those skilled in the art after reading this detailed disclosure that the foregoing detailed disclosure is intended to be presented by way of example only and is not limiting. Various alterations, improvements, and modifications may occur and are intended for those skilled in the art, though not expressly stated herein. These alterations, improvements, and modifications are intended to be suggested by this disclosure and are within the spirit and scope of the exemplary embodiments of the present disclosure.

Moreover, certain terminology has been used to describe embodiments of the present disclosure. For example, the terms “one embodiment,” “an embodiment,” and “some embodiments” mean that a particular feature, structure, or feature described in connection with the embodiment is included in at least one embodiment of the present disclosure. Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment” or “one embodiment” or “an alternative embodiment” in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or features may be combined as suitable in one or more embodiments of the present disclosure.

Similarly, it should be appreciated that in the foregoing description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the various embodiments. This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed subject matter requires more features than are expressly recited in each claim. Rather, claimed subject matter may lie in less than all features of a single foregoing disclosed embodiment.

Finally, it should be understood that the embodiments described in the present disclosure are only used to illustrate the principles of the embodiments of the present disclosure. Other variations may also fall within the scope of the present disclosure. Therefore, as an example and not a limitation, alternative configurations of the embodiments of the present disclosure may be regarded as consistent with the teaching of the present disclosure. Accordingly, the embodiments of the present disclosure are not limited to the embodiments introduced and described in the present disclosure explicitly.

	Number	Date	Country
Parent	PCT/CN2023/093186	May 2023	WO
Child	18937064		US

POLISHING DEVICES

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