POLISHING MECHANISM, POLISHING DEVICE, AND POLISHING METHOD

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Chinese Patent Application No. 202011027679.5 filed on Sep. 25, 2020, the contents of which are incorporated by reference herein.

FIELD

The subject matter herein generally relates to manufacturing processes, and particularly to a polishing mechanism, a polishing device, and a polishing method.

BACKGROUND

In the field of manufacturing and processing, some workpieces need to be polished by a polishing device, so that a surface accuracy of the workpiece can meet the predetermined requirements.

In traditional polishing process, pressure information of workpieces are not be quantified, thus polishing positions and polishing tracks of a polishing head may cause defects at incorrect pressures, such as different color, uneven lines, uneven depth on the workpieces. Additionally, the polisher may get stuck during a chamfering process, such as chamfering a R-angle of a 3C workpiece (mobile phone for example), which may cause a damage to the workpiece and affect usage of the workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 illustrates a schematic diagram of at least one embodiment of a polishing system.

FIG. 2 illustrates a state diagrammatic view of at least one embodiment of the polishing system.

FIG. 3 illustrates a diagrammatic view of at least one embodiment of an operating track.

FIG. 4 illustrates a flowchart of at least one embodiment of a polishing method.

FIG. 5 illustrates a flowchart of at least one embodiment of a polishing method.

FIG. 6 illustrates a flowchart of at least one embodiment of a polishing method.

FIG. 7 illustrates an isometric view of at least one embodiment of an assistant polishing device.

FIG. 8 illustrates a section view of at least one embodiment of the assistant polishing device.

FIG. 9 illustrates a schematic diagram of at least one embodiment of an assistant polishing system.

FIG. 10 illustrates a flowchart of at least one embodiment of an assistant polishing method.

DETAILED DESCRIPTION

Implementations of the disclosure will now be described, by way of embodiments only, with reference to the drawings. The disclosure is illustrative only, and changes may be made in the detail within the principles of the present disclosure. It will, therefore, be appreciated that the embodiments may be modified within the scope of the claims.

Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The technical terms used herein are to provide a thorough understanding of the embodiments described herein but are not to be considered as limiting the scope of the embodiments.

Several definitions that apply throughout this disclosure will now be presented.

The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The term “substantially” is defined to be essentially conforming to the particular dimension, shape or other word that the term modifies, such that the component need not be exact. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.

FIG. 1 illustrates a schematic diagram of at least one embodiment of a polishing system 700. The polishing system 700 is configured to polish a workpiece 12 (shown in FIG. 2). The polishing system 700 includes a sensor group 30 and a first processor 720.

The sensor group 30 is configured to detect pressure information of the workpiece 12 and generate a pressure sequence.

The first processor 720 is electrically connected to the sensor group 30. The first processor 720 is configured to obtain the pressure sequence and generate indication information. The indication information is configured to indicate a polishing head 10 (shown in FIG. 2) to polish the workpiece 12 in a predetermined track. The first processor 720 is further configured to generate a deviation sequence of the pressure sequence according to the pressure sequence and the indication information, and generate an adjustment instruction, according to the deviation sequence, to adjust a position of the polishing head 10.

In other embodiments, the sensor group 30 includes a six-axis force sensor or a single-axis force sensor, which can detect the pressure on the workpiece 12. The sensor group 30 can be a force sensor with a protection level above IP65 to meet a safe requirement of polishing the workpiece 12.

Referring to FIG. 2, the sensor group 30 is arranged on a holder 80 for detecting pressure information on the workpiece 12. The holder 80 may support the workpiece 12. The pressure information includes pressures of several points of a polish portion of the workpiece 12. The pressures at the several points form the pressure sequence.

The sensor group 30 transmits the pressure sequence to the first processor 720. The first processor 720 receives the pressure sequence and generates the indication information. The indication information is configured to indicate an operating track of the polishing head 10 polishing the workpiece 12. The operating track is corresponding to a shape of a polish part of the workpiece 12, for instance, a circular, a square or a ring. Or the operating track is a recombination operating track of the polish head 10 along a direction vertical to a ring operating direction when operating along a circular, a square or a ring.

The first processor 720 is configured to, based on the operating track and the pressure information of the workpiece 12 (the pressure sequence received), adjust or preset pressure information to the workpiece 12 during the operating process of the polishing head 10, that is generating a deviation sequence.

The first processor 720 is configure to, based on the deviation sequence, generate the adjustment instruction to adjust different positions of the polish head 10 corresponding to different polish parts of the workpiece 12, thus to make pressures on the points of the polish parts of the workpiece 12 match to the preset pressure sequence, and thereby quantitative controlling pressures of the polish head 10 put on the polish parts of the workpiece 12.

In at least one embodiment, an adjustment value can be generated by the deviation sequence, the preset operating track can be adjusted by adding the adjustment value or by other way of calculating. Then an adjusted operating track is generated, which can be converted to a pressure control sequence for polishing the workpiece 12 by a conversion relationship. The pressure control sequence is the adjustment instruction, according to the adjustment instruction, a polishing process of the polish head 10 to the workpiece 12 can meet a polishing precision and apply in a present working condition, which polishes the workpiece 12 with the required polishing precision.

Additionally, the indication information includes a preset position and the conversion relationship. The preset position is a calculable position of the polish head 10 to polish the workpiece 12, that is position information of the polish head 10 at different polish points of the workpiece 12. The conversion relationship is a conversion formula of the pressure of the polish head 10 and deformation information of polish material of the polish head 10. The first processor 720 is further configured to determine the conversion relationship according to a rigid parameter of the polish material of the polish head 10.

Based on the pressure sequence and the conversion relationship, generating deformation information corresponding to the pressure sequence.

Based on the pressure sequence and the preset position, generating the deviation sequence.

The first processor 720 is configured to determine the conversion relationship based on the rigid parameter of the polish material of the polish head 10. The rigid parameter mainly determines a hardness (similar to an elastic coefficient) of an indentation object material (such as abrasive paper), which provides a conversion relationship of controlling calculation medium force/position. The first processor 720 is configured to generate deformation information corresponding to the pressure sequence according to the conversion relationship and the pressure sequence. The deformation information is set a material coefficient s (determining a hardness of the stress material, similar to the elastic coefficient, with a unit of mm/N) of a force control parameter.

For instance, the polish head 10 being surrounded by abrasive paper, when polishing into the workpiece 12 with 0.1 mm, a pressure is increased with 5 N, then a material coefficient s=0.02 of the abrasive paper is obtained. Therefore, the deformation information is the value of pressure*s. The first processor 720, based on the deformation information and the preset position of the polish head 10, generates the deviation sequence. The deviation sequence is adjustment information of the polish head 10 based on the deformation information and the preset position. For instance, the polish head 10 puts on a predetermined pressure 10 N, a deformation value generated is 0.2 mm, thus, the s is 0.02, meaning the polish head 10 needs to move 0.2 mm based on the preset position and the deformation direction.

The first processor 72 is further configured to:

Generate adjusted pressure sequence through a filter according to the pressure sequence;

Determine the deviation sequence according to the adjusted pressure sequence and the indication information.

Therefore, adjusting the pressure sequence through the filter to eliminate high frequency affection, such as affection caused by a wild mill vibration. The filter can be a virtual filter or a real filter. For example, a virtual filter for removing noise can be based on LabVIEW Express program.

The indication information includes a first operating track, the first processor 720 is further configured to:

Generate the indication information, including:

Select an apparatus to polish the workpiece 12 including a machine assembly and the polish head 10;

Generate the first operating track based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, the first operating track is an operating track of the polish head 10;

The first processor 720 is further configured to generate the deviation sequence based on the pressure sequence and the first operating track.

In at least one embodiment, the generating the indication information includes: selecting the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10. The machine assembly can be a machine arm connected to the polish head 10 configured to drive the polish head 10 according to control instruction. The machine assembly can also be other driving assembly that can drive the polish head 10.

A track on which the machine assembly drives the polish head 10 is the first operating track, which is a polish track corresponding to a product of the workpiece 12. After polishing the workpiece 12 along the first operating track, the workpiece 12 may meet the precision requirement.

The first processor 720, based on the pressure sequence and the first operating track, generates the deviation sequence. For instance, when the polish head 10 polishes a straight edge of a frame-shaped workpiece 12, the workpiece 12 is fixed by the holder 80, the machine assembly drives the polish head 10 to polish the workpiece 12.

In detail, referring to FIG. 2, two coordinate systems are shown, which are a work coordinate system and a tool coordinate system. The work coordinate system is a three-dimensional coordinate system based on the sensor module 30 or the holder 80. The tool coordinate system is a three-dimensional coordinate system based on the polish head 10.

A first direction is an X-axis direction of the work coordinate system, a second direction is a Z-axis direction of the work coordinate system, a third direction is a Y-axis direction of the work coordinate system (FIG. 2 is a two-dimensional view, the Y-axis direction is not shown in the FIG. 2 but can be a direction vertical to the paper).

A base track is an operating track (such as a translation track) of the polish head 10 in an XY planar in the work coordinate system. For description, any composite motion of the polish head 10 in the tool coordinate system can be disassembled as movements of the workpiece 12 in an XY planar, a ZY planar, and an XZ planar. As shown in FIG. 2, the tool coordinate system follows the polish head 10, the polish head 10 in different operating positions (such as a first state and a second state) are shown in the figure. The tool coordinate system may match to the first state and the second state to form a tool 1 coordinate system and a tool 2 coordinate system.

The first processor 720 is further configured to:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generate the base track and a first adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by the second direction and the third direction. The first, second, and third direction are perpendicular to each other. The first direction is a direction of the polish head 10 towards the workpiece 12;

Based on the base track and the first adjustment value, generate the first operating track;

The polish head 10 is operated according to the first adjustment value, such as at least one of a line, a circular, an ellipse, a rhombus, in the XY planar of the tool coordinate system, or according to an operating track preset by polish surface requirements of the polish head 10. Thus, according to the operating track of the polish head 10 adjusted by the first adjustment value, the workpiece 12 can be polished into different shapes.

The first processor 720 is further configured to:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generate the base track and a second adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The second adjustment value is a carrier signal loaded on the base track in the second direction. The first, second, and third direction are perpendicular to each other. The first direction is a direction of the polish head 10 towards the workpiece 12;

Based on the base track and the second adjustment value, generate the first operating track.

In detail, referring to FIG. 2, the second adjustment value is a carrier signal, which can be a sine wave or a square wave, with a frequency and an amplitude loaded to the Y-axis direction of the tool coordinate system, or an operating track preset by polish surface requirements of the polish head 10. Thus, the polish head 10 can achieve axial wobble. Thus, according to the second adjustment value, the polishing of the workpiece 12 can be customized. For example, a shape or a surface perfection of the polished workpiece 12 can be controlled to improve a general performance or aesthetic quality of the workpiece 12.

The first processor 720 is further configured to:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generate the base track and a third adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The third adjustment value is a fixed value loaded on the base track in the first direction. The first direction is perpendicular to the third direction. The first direction is a direction of the polish head 10 towards the workpiece 12.

Based on the base track and the third adjustment value, generate the first operating track.

In detail, referring to FIG. 2, the third adjustment value is an increment of the polish head 10 presses to the workpiece 12 along the Z-axis direction of the tool coordinate system. Thus, by the increment, the polish head 10 along a polish direction, which is towards the workpiece 12 along the Z-axis direction of the tool coordinate system, controls a quality of polishing the workpiece 12.

The first processor 720 is further configured to:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generate the base track and a fourth adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The fourth adjustment value is a variation loaded on the base track in the first direction. The first direction is perpendicular to the third direction. The first direction is a direction of the polish head 10 towards the workpiece 12;

Based on the base track and the fourth adjustment value, generate the first operating track.

In detail, referring to FIG. 2, the fourth adjustment value is a variation along the Z-axis direction of the tool coordinate system. During the polishing process, there are two ways of polishing, first, an overpressure value (such as the third adjustment value) of the polish head 10 presses to the workpiece 12. For example, a polish surface of the polish head 10 is covered by abrasive paper, when polishing the workpiece 12, the abrasive paper can be divided into two parts with a polished part and an unpolished part. The overpressure value being the fixed value means that overpressure values of the two parts are fixed values, such as 0.1 mm, which is configured to control polish relationship. Second, the overpressure value can be a variation value (such as the fourth adjustment value), when offsetting from the to the polished part to the unpolished part, the overpressure value becoming greater and greater, such as from 0.05 mm to 0.1 mm, which may cause a uniform polish, extend service life of the abrasive paper, and better control a polishing precision. In other embodiments, the polish head 10 can directly polish the workpiece 12.

Furthermore, the indication information includes a second operating track, the first processor 720 is further configured to: generate the indication information, further includes:

Determining the machine assembly further includes the holder 80 configured to hold, rotate, and move the workpiece 12;

Based on the machine assembly further includes the holder 80, generating the second operating track, which is a move track of the workpiece 12;

The first processor 720 is further configured to: based on the pressure sequence, the first operating track, and the second operating track, generate the deviation sequence.

In detail, referring to FIG. 2, the holder 80 can be a rotatable tool, which may hold and rotate the workpiece 12. The holder 80 can also be other tool that can rotate and drive the workpiece 12.

Furthermore, the indication information further includes rounding information, the first processor 720 is further configured to:

Based on the machine assembly further includes the holder 80, determine the rounding information;

Based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information;

Based on the rounding track, generate the second operating track.

Furthermore, the first processor 720 is further configured to:

Based on the second operating track and the rounding track, adjust the first operating track and the third operating track;

Based on the pressure sequence, the third operating track, and the second operating track, generate the deviation sequence.

In at least one embodiment, when the polish head 10 polishes the workpiece 12, the polish head 10 and the holder 80 holding the workpiece 12 cooperatively move, so as to maintain the polish head 10 in the Z direction of the tool coordinate system, which may control a polishing quality of the workpiece 12.

In detail, when the polish head 10 polishes a rounding of the workpiece 12, the polish head 10 operates along the first operating track, the holder 80 drives the workpiece 12 to move along the second operating track. For maintaining the polish head 10 in the Z direction of the tool coordinate system, adjusting the first operating track, a set of the adjustment value during the operating process is the deviation sequence. Through the deviation sequence, adjusting the first operating track (such as track A shown in FIG. 3) to the third operating track (such as track B shown in FIG. 3), to maintain the polish head 10 in the Z direction of the tool coordinate system, which may control a polishing quality of the workpiece 12.

In at least one embodiment, FIG. 3 illustrates at least one embodiment of operating tracks, wherein track A is a first track, and track B is a third track. The track A and the track B both are operating tracks of the polish head 10 and in a same moving direction. The second operating track is a moving track that the holder 80 drives the workpiece 12. The second operating track is in an opposite direction to the moving direction of the track A and the track B. According to the moving track that the holder 80 drives the workpiece 12 and the rounding track of the workpiece 12, adjusting the operating track of the polish head 10, to maintain the polish head 10 relatively rest to the holder in the Z direction of the tool coordinate system when the polish head 10 polishes the workpiece 12, which may control a polishing quality of the workpiece 12.

In detail, the rounding (such as an R-angle of a 3C product) is one of the corners of a frame shaped workpiece 12. The rounding information is an arc length of the R-angle. Dividing the R-angle into five arc length sections, and calculating rotation angles of the machine assembly along the Z direction of the tool coordinate system when the machine assembly moves along the five arc length sections. The five arc length sections can be in a same arc length or in different arc lengths, such as 0-10-30-55-80-90 degrees. Converting the angles into negative values, such as 0, −10, −30, −55, −80, −90, as track interpolating points of the holder 80, so as to control the holder 80 to rotate along the Z direction of the tool coordinate system. Thus, the holder 80 and the polish head 10 operates along different tracks, and maintain the polish head 10 in the Z direction of the tool coordinate system and translate in the XY planar of the tool coordinate system, which may prevent a dead angle occurring when the polish head 10 is polishing the workpiece 12, and prevent any sticking of the machine assembly, and also simplifying the process.

FIG. 4 illustrates a flowchart of at least one embodiment of a polishing method, which is configured to control the polish head 10 to polish the workpiece 12. The polishing method is applied in a polishing system. The polishing method includes:

At block 1002, receiving a pressure sequence.

In at least one embodiment, the pressure sequence is generated by a sensor group detecting pressure information of the workpiece 12.

At block 1004, generating indication information.

In at least one embodiment, the indication information is configured to indicate the polishing head 10 to polish the workpiece 12 in a predetermined track.

At block 1006, based on the pressure sequence and the indication information, generating a deviation sequence of the pressure sequence.

At block 1008, based on the deviation sequence, generating an adjustment instruction, to adjust a position of the polishing head 10.

Referring to FIG. 4, the sensor group 30 detects pressure information on the workpiece 12. The pressure information includes pressures of several points of a polish portion of the workpiece 12. The pressures of the several points form the pressure sequence.

Based on the received pressure sequence, generating the indication information. The indication information is configured to indicate an operating track of the polishing head 10 polishing the workpiece 12. The operating track is corresponding to a shape of a polish part of the workpiece 12, for instance, a circular, a square, a ring. Or the operating track is a recombination operating track of the polish head 10 along a direction vertical to a ring operating direction when operating along a circular, a square, a ring.

Based on the operating track and the pressure information of the workpiece 12 during the operating track (that is the pressure sequence), adjusting or presetting pressure information to the workpiece 12 during the operating process of the polishing head 10, that is generating a deviation sequence.

Based on the deviation sequence, generating the adjustment instruction to adjust different positions of the polish head 10 corresponding to different polish parts of the workpiece 12, thus to make pressures on the points of the polish parts of the workpiece 12 match to the preset pressure sequence, and thereby quantitative controlling pressures of the polish head 10 put on the polish parts of the workpiece 12.

In at least one embodiment, an adjustment value can be generated by the deviation sequence, the preset operating track can be adjusted by adding the adjustment value or other ways, then an adjusted operating track is generated, which can be converted to a pressure control sequence for polishing the workpiece 12 by a conversion relationship. The pressure control sequence is the adjustment instruction, according to the adjustment instruction, a polishing process of the polish head 10 to the workpiece 12 can meet a polishing precision and apply in a present working condition, which can make workpiece 12 with require polishing precision.

Additionally, the indication information includes a preset position and the conversion relationship. The preset position is a calculable position of the polish head 10 to polish the workpiece 12, that is position information of the polish head 10 at different polish points of the workpiece 12. The conversion relationship is a conversion formula of the pressure of the polish head 10 and deformation information of polish material of the polish head 10. Referring to FIG. 5, the polishing method further includes:

At block 1010, determining the conversion relationship according to a rigid parameter of the polish material of the polish head 10.

At block 1012, based on the pressure sequence and the conversion relationship, generating deformation information corresponding to the pressure sequence.

At block 1014, based on the pressure sequence and the preset position, generating the deviation sequence.

Thus, determining the conversion relationship based on the rigid parameter of the polish material of the polish head 10. The rigid parameter mainly determines a hardness (similar to an elastic coefficient) of an indentation object material (such as abrasive paper), which provides a conversion relationship of controlling calculation medium force/position. Generating deformation information corresponding to the pressure sequence according to the conversion relationship and the pressure sequence. The deformation information is set a material coefficient s (determining a hardness of the stress material, similar to the elastic coefficient, with a unit of mm/N) of a force control parameter.

Furthermore, the block 1006 of generating a deviation sequence of the pressure sequence includes:

Generating adjusted pressure sequence through a filter according to the pressure sequence;

Determining the deviation sequence according to the adjusted pressure sequence and the indication information.

Furthermore, the indication information includes a first operating track, referring to FIG. 6, the generating the indication information includes:

At block 1020, selecting an apparatus to polish the workpiece 12 including a machine assembly and the polish head 10;

At block 1022, generating the first operating track based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, the first operating track is an operating track of the polish head 10;

At block 1024, the generating the deviation sequence of the pressure sequence includes generating the deviation sequence based on the pressure sequence and the first operating track.

In at least one embodiment, selecting the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10. The machine assembly can be a machine arm connected to the polish head 10 configured to drive the polish head 10 according to control instruction. The machine assembly can also be other driving assembly that can drive the polish head 10.

A track that the machine assembly drives the polish head 10 is the first operating track, which is a polish track corresponding to a product of the workpiece 12. After polishing the workpiece 12 along the first operating track, the workpiece 12 may meet the precision requirement. Based on the pressure sequence and the first operating track, generating the deviation sequence. For instance, when the polish head 10 polishes a straight edge of a frame-shaped workpiece 12, the workpiece 12 is fixed by the holder 80, the machine assembly drives the polish head 10 to polish the workpiece 12.

A base track is an operating track (such as a translation track) of the polish head 10 in an XY planar in the work coordinate system. For description, any composite motion of the polish head 10 in the tool coordinate system can be disassembled as movements of the workpiece 12 in an XY planar, a ZY planar, and an XZ planar. As shown in FIG. 2, the tool coordinate system follows the polish head 10, different polish head 10 in different operating positions (such as a first state and a second state) are shown in the figure. The tool coordinate system may match to the first state and the second state to form a tool 1 coordinate system and a tool 2 coordinate system.

Furthermore, the block 1022 of generating the first operating track includes:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generating the base track and a first adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by the second direction and the third direction. The first, second, and third direction are perpendicular to each other. The first direction is a direction of the polish head 10 towards the workpiece 12;

Based on the base track and the first adjustment value, generating the first operating track;

Furthermore, the block 1022 of generating the first operating track includes:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generating the base track and a second adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The second adjustment value is a carrier signal loaded on the base track in the second direction. The first, second, and third direction are perpendicular to each other. The first direction is a direction of the polish head 10 towards the workpiece 12;

Based on the base track and the second adjustment value, generating the first operating track.

In detail, referring to FIG. 2, the second adjustment value is a carrier signal, which can be a sine wave or a square wave, with a frequency and an amplitude loaded to the Y-axis direction of the tool coordinate system, or an operating track preset by polish surface requirements of the polish head 10, thus, the polish head 10 can achieve axial wobble. Thus, according to the second adjustment value, the workpiece 12 can be polished in customization. For example, a shape or a surface perfection of the polished workpiece 12 can be controlled to improve a generalization performance of the workpiece 12.

Furthermore, the block 1022 of generating the first operating track includes:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generating the base track and a third adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The third adjustment value is a fixed value loaded on the base track in the first direction. The first direction is perpendicular to the third direction. The first direction is a direction of the polish head 10 towards the workpiece 12; based on the base track and the third adjustment value, generating the first operating track.

In detail, referring to FIG. 2, the third adjustment value is an increment of the polish head 10 presses to the workpiece 12 along the Z-axis direction of the tool coordinate system. Thus, by the increment, the polish head 10 along a polish direction, that is towards the workpiece 12 along the Z-axis direction of the tool coordinate system, controls a quality of polishing the workpiece 12.

Furthermore, the block 1022 of generating the first operating track includes:

Based on the apparatus to polish the workpiece 12 including a machine assembly and the polish head 10, generating the base track and a fourth adjustment value. The base track is an operating track of the polish head 10 on a planar formed by the first direction and the third direction. The fourth adjustment value is a variation loaded on the base track in the first direction. The first direction is perpendicular to the third direction. The first direction is a direction of the polish head 10 towards the workpiece 12; based on the base track and the fourth adjustment value, generate the first operating track.

In detail, referring to FIG. 2, the fourth adjustment value is a variation along the Z-axis direction of the tool coordinate system. During the polishing process, there are two polish ways, first, an overpressure value (such as the third adjustment value) of the polish head 10 presses to the workpiece 12. For example, a polish surface of the polish head 10 is covered by abrasive paper, when polishing the workpiece 12, the abrasive paper can be divided into two parts with a polished part and an unpolished part. The overpressure value being the fixed value means that overpressure values of the two parts are fixed values, such as 0.1 mm, which is configured to control polish relationship. Second, the overpressure value is a variation (such as the fourth adjustment value), when offsetting from the to the polished part to the unpolished part, the overpressure value becomes greater and greater, such as from 0.05 mm to 0.1 mm, which may cause an even polish, extend an usage of the abrasive paper, and better control a polishing precision. In other embodiments, the polish head 10 can directly polish the workpiece 12.

Furthermore, the indication information includes a second operating track, the generating the deviation sequence, further includes:

Determining the machine assembly further includes the holder 80 configured to hold, rotate, and move the workpiece 12;

Based on the machine assembly further includes the holder 80, generating the second operating track, which is a move track of the workpiece 12;

Based on the pressure sequence, the first operating track, and the second operating track, generating the deviation sequence.

In detail, referring to FIG. 2, the holder 80 can be a rotatable tool, which may hold and rotate the workpiece 12. The holder 80 can also be other tool that can rotate and drive the workpiece 12.

Furthermore, the indication information further includes rounding information, the generating the second operating track includes:

Based on the machine assembly further includes the holder 80, determine the rounding information;

Based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information;

Based on the rounding track, generate the second operating track.

When the polish head 10 polishes a rounding of the workpiece 12, the polish head 10 operates along the first operating track, the holder 80 drives the workpiece 12 to move along the second operating track. For maintaining the polish head 10 in the Z direction of the tool coordinate system, adjusting the first operating track, a set of the adjustment value during the operating process is the deviation sequence. Through the deviation sequence, adjusting the first operating track to the third operating track, to maintain the polish head 10 in the Z direction of the tool coordinate system, which may control a polishing quality of the workpiece 12.

Furthermore, the generating the deviation sequence further includes:

Based on the second operating track and the rounding track, adjusting the first operating track and the third operating track;

Based on the pressure sequence, the third operating track, and the second operating track, generating the deviation sequence.

In at least one embodiment, when the polish head 10 polishes a rounding of the workpiece 12, the polish head 10 and the holder 80 holding the workpiece 12 cooperatively move, to maintain the polish head 10 in the Z direction of the tool coordinate system, which may control a polishing quality of the workpiece 12.

In at least one embodiment, FIG. 3 illustrates at least one embodiment of operating tracks, wherein track A is a first track, track B is a third track. The track A and the track B both are operating tracks of the polish head 10 and in a same moving direction. The second operating track is a moving track that the holder 80 drives the workpiece 12. The second operating track is in an opposite direction with the moving direction of the track A and the track B. According to the moving track that the holder 80 drives the workpiece 12 and the rounding track of the workpiece 12, adjusting the operating track of the polish head 10, to maintain the polish head 10 relatively rest to the holder in the Z direction of the tool coordinate system when the polish head 10 polishes the workpiece 12, which may control a polishing quality of the workpiece 12.

In detail, the rounding (such as a R-angle of a 3C product) is one of the corners of a frame shaped workpiece 12. The rounding information is an arc length of the R-angle. Dividing the R-angle into five arc length sections, calculating rotation angles of the machine assembly along the Z direction of the tool coordinate system when the machine assembly moves along the five arc length sections. The five arc length sections can be in a same arc length or in different arc lengths, such as 0-10-30-55-80-90 degrees. Converting the angles into negative values, such as 0, −10, −30, −55, −80, −90, as track interpolating points of the holder 80, so as to control the holder 80 to rotate along the Z direction of the tool coordinate system. Thus, the holder 80 and the polish head 10 operates along different tracks, and maintain the polish head 10 in the Z direction of the tool coordinate system and translate in the XY planar of the tool coordinate system, which may prevent dead angle occurred when the polish head 10 polish the workpiece 12, and prevent the machine assembly get stuck, and also simplify the process.

FIG. 7 illustrates at least one embodiment of an assistant polishing device configured to grip and detect the workpiece 12 polished. In at least one embodiment, the assistant polishing device is the holder 80.

In at least one embodiment, an assistant polishing device 800 includes a hold portion 810, a sensor group 30, and a base 830. The hold portion 810 is configured to grip the workpiece 12 and suffer at least one of a force and a torque of the workpiece 12. The sensor group 30 is connected to the hold portion 810 and coupled to a polishing device, and is configured to detect the force and the torque, generate a pressure value and output to the polishing device. The base 830 is connected to the sensor group 30 and configured to secure the sensor group 30.

Thus, the hold portion 810 grips the workpiece 12, the sensor group 30 detects the force and the torque of the hold portion 810. The force is an acting force between the polishing device and the workpiece 12, the acting force can be transmitted from the workpiece 12 to the hold portion 810 and the sensor group 30. The sensor group 30 transmits the pressure value to the polishing device to adjust a polish force and a polish angle according to the force and the torque that the workpiece 12 suffers, and thereby the assistant polishing device polishes the workpiece 12.

In at least one embodiment, the sensor group 30 transmits the pressure value to the polishing device in a wire or wireless way, such as BLUETOOTH transmission. However, by these transmission, the sensor group 30 and a metal housing of a connecting portion may shield the signal, a wireless transmission way with a higher penetrating power may be applied to overcome the difficult of signal transmission.

In at least one embodiment, the sensor group 30 includes at least one of a force sensor and a torsiometer, which are configured to respectively detect a force and a torque of the hold portion. Determining whether the polish along the predetermined track according to the force information. Determining whether a deflection occurred in a direction according to the torque information. When in a high polishing precision requirement, a high detection precision of the force and the torque is needed. Therefore, the force sensor and the torsiometer are both needed to reflect to the machine arm, so as to control a polishing precision of next polish by adjustment. Thereby, a benign iteration direct cycle is formed.

Alternatively, the sensor group 30 includes a six-axis force sensor, which is configured to detect a component of the X-axis, the Y-axis, and the Z-axis of the force in the work coordinate system, and a deflection angle of the X-axis, the Y-axis, and the Z-axis of the torque in the work coordinate system. Compared to the force sensor and the torsiometer, the six-axis force sensor is simpler and higher precision.

Further, the sensor group 30 is a force sensor with a protection level greater than IP65. Using the force sensor with this protection level, preventing any cutting fluid or polish dust dropping into the sensor group, which may cause damage.

Further, a pressure range of the hold portion 810 is 0˜100 N. Through calculation, a pressure of the hold portion 810 during a correcting process is 1 kg, that is about 9.8 N. During the polishing process, a peak value of the force can be 10 kg, that is about 98 N. A safe margin is added, which makes a determination of the pressure range of the hold portion 810, that is about 1˜100 N. The pressure range is configured to limit the acting force between the polish head 10 and the hold portion 810, preventing any damage caused by over pressure during the polishing process.

FIG. 8 illustrates a cross-sectional view of the assistant polishing device 800. The assistant polishing device 800 further includes a mounting portion 840 and a cable 850. The mounting portion 840 is arranged between the sensor group 30 and the base 830. The mounting portion 840 can be hollow by a first path 841.

The base 830 includes a first cavity 8321 communicated with the first path 841.

The cable 850 is connected to the sensor group 30 and configured to transmit, through the first cavity 8321 and the first path 841, a pressure value from the sensor group 30.

Thus, the cable 850 is received in the first cavity 8321 and the first path 841, and transmits the pressure value detected by the sensor group 30 to the polishing device, to improve a structural compactness of the assistant polishing device 800. A leak-proof of the cable 850 may extend a usage and decrease affection from the pressure transmission.

Further, the assistant polishing device 800 further includes a connecting portion 820 and an extract module 860. The connecting portion 820 is arranged between the hold portion 810 and the sensor group 30. The connecting portion 820 is hollow by a second path 821.

The hold portion 810 includes a first hole 811. The sensor group 30 includes a second cavity 31.

The extract module 860 includes an air tube 861 connected to the first hole 811 and communicated with at least one of the first cavity 8321, the first path 841, the second cavity 31, and the second path 821, so as to form and improve a binding force between the workpiece 12 and the hold portion 810. That is, the hold portion 810 secures the workpiece 12 through vacuum adsorbing.

Further, the base 830 includes a seal cover 831, an inner cavity 832, and a movable portion 833. The seal cover 831 is connected to the mounting portion 840 and includes a second hole 8311 (not shown). The inner cavity 832 includes the first cavity 8321. The second hole 8311 is arranged between the seal cover 831 and the first path 841. The movable portion 833 is connected to the inner cavity 832. The inner cavity 832 includes a seal portion 8322. The seal portion 8322 is arranged between the movable portion 833 and the first cavity 8321. Thus, the seal cover 831 and the movable portion 833 cooperatively seal dust and polishing solution from permeating into the first cavity 8321 via the movable portion 833.

Further, the assistant polishing device 800 further includes a motor 870, a synchronous belt 880, and a reduction gear 890. The synchronous belt 880 connects to the motor 870. The movable portion 833 includes a belt wheel 8311 (not shown) connects to the synchronous belt 880. The reduction gear 890 connects to the belt wheel 8311 and configured to transmit the torque from the motor 870, to control the base 830 to rotate. Thus, the motor 870 drives the synchronous belt 880, the synchronous belt 880 drives the belt wheel 8311, the belt wheel 8311 drives the reduction gear 890, so as to control the base 830 to rotate.

Further, the assistant polishing device 800 further includes a protection device 90 (not shown). The protection device 90 is connected to the connecting portion 820 and surrounds the sensor group 30. The protection device 90 is configured to seal dust and polishing solution from permeating into the sensor group 30.

FIG. 9 illustrates a schematic diagram of at least one embodiment of an assistant polishing system 900 configured to assist the polishing device to polish the workpiece 12. The assistant polishing system 900 includes a communicator 910 and a second processor 920. When the assistant polishing system 900 is cooperatively used with the polishing system 700, the second processor 920 and the first processor 720 can be a same processor and process same functions.

The communicator 910 is configured to obtain the first track and the second track. The second processor 920 is coupled to the communicator 910 and configured to: control the holder 80 to execute at least one of stopping, moving, and rotating along the first track; the holder 80 grips the workpiece 12; obtain a trigger signal, determine the trigger signal meets a trigger condition; based on the trigger signal meets a trigger condition, control the holder 80 to execute at least one of stopping, moving, and rotating along or change the second track.

Referring to FIG. 7, the holder 80 grips the workpiece 12, the second processor 920 controls the holder 80 to execute at least one of stopping, moving, and rotating along the first track. That is, the second processor 920 is configured to control the movement of the holder 80. The second processor 920 receives the trigger signal, which is a signal indicating the polish head 10 is about to polish from a straight side to a rounding (or from a rounding to a straight side). When the polish head 10 polishes from a straight side to a rounding (or from a rounding to a straight side), a time, a speed, or a position of the polish head 10 will change, such as when the polish head 10 polishes a straight side along the first track, a speed can be 20 mm/s, when the polish head 10 is about to polish from a straight side to a rounding, such as 20 mm away from the rounding, the trigger signal is triggered. Due to polish speeds of polishing the rounding and the straight side are different, such as a speed of polishing the rounding can be 15 mm/s. When 20 mm away from the rounding, automatically adjusting the speed, such as from 20 mm/s to 15 mm/s, changing the polish track from the first track along the straight side to the second track along the rounding, thus to smoothly polish and decrease an adjusting time with better polishing quality.

In at least one embodiment, the trigger signal is a time period of polishing the workpiece 12 along the first track. The assistant polishing system 900 further includes a timer 930.

The timer 930 is coupled to the second processor 920 and configured to obtain the time period.

The second processor 920 is further configured to:

Determine the time period equal to a predetermined time period;

Based on the time period equal to a predetermined time period, control the holder 80 to change to the second track to execute at least one of stopping, moving, and rotating.

For instance, the time period is a time that the polish head 10 is about to polish from a straight side of the workpiece 12 to a rounding, when the time period is equal to the predetermined time period, such as the predetermined time period is 15 seconds, the holder 80 changes a polish track. Due to polish speeds of polishing the rounding and the straight side are different, such as a speed of polishing the rounding can be 15 mm/s and a speed of polishing the straight side can be 20 mm/s. When 15 seconds away from the rounding, or polishing the straight side for 15 seconds, by automatically adjusting the speed, such as from 20 mm/s to 15 mm/s, changing the polish track from the straight side to the rounding, thus to smoothly polish and decrease an adjusting time with better polishing quality.

In another embodiment, the trigger signal is a speed of polishing the workpiece 12 along the first track. The assistant polishing system 900 further includes a detector 940.

The detector 940 is coupled to the second processor 920 and configured to detect the speed.

The second processor 920 is further configured to:

Determine the speed smaller or equal to a predetermined speed;

Based on the speed smaller or equal to a predetermined speed, control the holder 80 to change to the second track to execute at least one of stopping, moving, and rotating.

For instance, the polish head 10 polishes the straight side and the rounding of the workpiece 12, the speed and the position of the polish head 10 changes, such as when the polish head 10 polishes the straight side along the first track, the speed along the polish track (in the Y direction of the tool coordinate system in at least one embodiment) increases from 0 to 20 mm/s. When the polish head 10 polishes from the straight side to the rounding, by automatically adjusting the speed, such as from 20 mm/s to 15 mm/s. The trigger signal is the speed of the polish head 10 smaller or equal to the predetermined speed, changing the polish track from the straight side along the first track to the rounding along the second track, thus to smoothly polish and decrease an adjusting time with better polishing quality.

FIG. 10 illustrates an assistant polishing method configured to control the assistant polishing system to cooperatively polish the workpiece 12. The assistant polishing method includes the follow blocks.

At block 1030, obtaining a first track and a second track.

At block 1032, controlling the holder 80 to execute at least one of stopping, moving, and rotating along the first track;

the holder 80 grips the workpiece 12;

At block 1034, obtaining a trigger signal, determining the trigger signal meets a trigger condition;

At block 1036, based on the trigger signal meets a trigger condition, controlling the holder 80 to execute at least one of stopping, moving, and rotating along or change the second track.

Thus, through setting the trigger signal of the machine assembly when switching the polish of the straight side and the rounding, through the trigger condition switches the polish speed and the polish track, from the first track to the second track, archiving smoothly polish and decrease an adjusting time with better polishing quality.

Furthermore, the trigger signal is a time period of polishing the workpiece 12 along the first track. The determining the trigger signal meets a trigger condition of block 1034 includes:

Obtaining the time period;

Determining the time period equal to a predetermined time period;

Based on the time period equal to a predetermined time period, controlling the holder 80 to change to the second track to execute at least one of stopping, moving, and rotating.

Furthermore, the trigger signal is a speed of polishing the workpiece 12 along the first track. The determining the trigger signal meets a trigger condition of block 1034 includes:

Detecting the speed;

Determining the speed smaller or equal to a predetermined speed;

Based on the speed smaller or equal to a predetermined speed, controlling the holder 80 to change to the second track to execute at least one of stopping, moving, and rotating.

While the present disclosure has been described with reference to particular embodiments, the description is illustrative of the disclosure and is not to be construed as limiting the disclosure. Therefore, those of ordinary skill in the art can make various modifications to the embodiments without departing from the scope of the disclosure as defined by the appended claims.

Claims

1. A polishing system configured to polish a workpiece, the polishing system comprising: a sensor group configured to detect pressure information of the workpiece and generate a pressure sequence;a processor coupled to the sensor group and configured to: receive the pressure sequence;generate indication information, wherein the indication information is configured to indicate a polishing head polishing the workpiece at a predetermined track;based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; andbased on the deviation sequence, generate an adjustment instruction, wherein the adjustment instruction is configured to adjust a position of the polishing head to polish the workpiece.
2. The polishing system according to claim 1, wherein the indication information further comprises a preset position and a conversion relationship, wherein the preset position is a calculable position of the polish head relative to polish the workpiece, and the conversion relationship is a conversion formula of a relationship between pressures generated by the polish head and deformation information of polish material of the polish head, the processor is further configured to: according to a rigid parameter of material of the polish head, determine the conversion relationship;based on the pressure sequence and the conversion relationship, generate deformation information, wherein the deformation information correspond to the pressure sequence; andbased on the pressure sequence and the preset position, generate the deviation sequence.
3. The polishing system according to claim 1, wherein the processor is further configured to: generate adjusted pressure sequence by a filter according to the pressure sequence; anddetermine the deviation sequence according to the adjusted pressure sequence and the indication information.
4. The polishing system according to claim 1, wherein the indication information further comprises a first operating track, the processor is further configured to: select an apparatus to polish the workpiece comprising a machine assembly and the polish head; andgenerate the first operating track based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, wherein the first operating track is an operating track of the polish head of the apparatus; andgenerate the deviation sequence based on the pressure sequence and the first operating track.
5. The polishing system according to claim 4, wherein the processor is further configured to: based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, generate a base track and a first adjustment value; wherein the base track is an operating track of the polish head and the base track is on a planar formed by a first direction and a third direction; the first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by a second direction and the third direction; the first, the second, and the third directions are perpendicular to each other; and the first direction is a direction of the polish head towards the workpiece;based on the base track and the first adjustment value, generate the first operating track.
6. The polishing system according to claim 4, wherein the processor is further configured to: based on the selected apparatus comprising the machine assembly and the polish head, generate a base track and a third adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the third adjustment value is a fixed value loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece; andbased on the base track and the third adjustment value, generate the first operating track.
7. The polishing system according to claim 4, wherein the processor is further configured to: based on the selected apparatus comprising the machine assembly and the polish head, generate a base track and a fourth adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the fourth adjustment value is a variation loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece;based on the base track and the fourth adjustment value, generate the first operating track.
8. The polishing system according to claim 7, wherein the indication information further comprises a second operating track, the processor is further configured to: determine the selected apparatus further comprises a holder, wherein the holder is configured to hold, rotate, and move the workpiece;based on the selected apparatus further comprises the holder, generate the second operating track, the second track is a move track of the workpiece;based on the pressure sequence, the first operating track, and the second operating track, generate the deviation sequence.
9. The polishing system according to claim 8, wherein the indication information further comprises rounding information, the processor is further configured to: based on the selected apparatus further comprises the holder, determine the rounding information;based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information; andbased on the rounding track, generate the second operating track.
10. The polishing system according to claim 9, wherein the processor is further configured to: based on the second operating track and the rounding track, adjust the first operating track and the third operating track; andbased on the pressure sequence, the third operating track, and the second operating track, generate the deviation sequence.
11. A polishing method configured to control a polish head of a machine assembly to polish a workpiece, the polishing method comprising: receiving a pressure sequence, the pressure sequence generated based on detecting pressure information of the workpiece by a sensor group;generating indication information, wherein the indication information is configured to indicate a polishing head polishing the workpiece;based on the pressure sequence and the indication information, generating a deviation sequence of the pressure sequence; andbased on the deviation sequence, generating an adjustment instruction, wherein the adjustment instruction is configured to adjust a position of the polishing head to polish the workpiece.
12. The polishing method according to claim 11, wherein the indication information further comprises a preset position and a conversion relationship, wherein the preset position is a calculable position of the polish head relative to polish the workpiece, and the conversion relationship is a conversion formula of a relationship between pressures generated by the polish head and deformation information of polish material of the polish head, the polishing method further comprises: according to a rigid parameter of the polish material of the polish head, determining the conversion relationship;based on the pressure sequence and the conversion relationship, generating deformation information, wherein the deformation information correspond to the pressure sequence; andbased on the pressure sequence and the preset position, generating the deviation sequence.
13. The polishing method according to claim 11, wherein the generating a deviation sequence of the pressure sequence comprising: generating adjusted pressure sequence by a filter according to the pressure sequence; anddetermining the deviation sequence according to the adjusted pressure sequence and the indication information.
14. The polishing method according to claim 11, wherein the indication information further comprises a first operating track, the generating the deviation sequence comprises: selecting an apparatus to polish the workpiece comprising a machine assembly and the polish head;generating the first operating track based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, wherein the first operating track is an operating track of the polish head of the apparatus; andgenerating the deviation sequence based on the pressure sequence and the first operating track.
15. The polishing method according to claim 14, wherein the generating the first operating track comprises: based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, generating a base track and a first adjustment value; wherein the base track is an operating track of the polish head and the base track is on a planar formed by a first direction and a third direction; the first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by a second direction and the third direction; the first, the second, and the third directions are perpendicular to each other; and the first direction is a direction of the polish head towards the workpiece;based on the base track and the first adjustment value, generating the first operating track.
16. The polishing method according to claim 14, wherein the generating the first operating track comprises: based on the selected apparatus comprising the machine assembly and the polish head, generating a base track and a third adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the third adjustment value is a fixed value loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece; andbased on the base track and the third adjustment value, generating the first operating track.
17. The polishing method according to claim 14, wherein the generating the first operating track comprises: based on the selected apparatus comprising the machine assembly and the polish head, generating a base track and a fourth adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the fourth adjustment value is a variation loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece;based on the base track and the fourth adjustment value, generating the first operating track.
18. The polishing method according to claim 17, wherein the indication information further comprises a second operating track, the generating a deviation sequence of the pressure sequence comprising: determining the selected apparatus further comprises a holder, wherein the holder is configured to hold, rotate, and move the workpiece;based on the selected apparatus further comprises the holder, generating the second operating track, the second track is a move track of the workpiece;based on the pressure sequence, the first operating track, and the second operating track, generating the deviation sequence.
19. The polishing method according to claim 18, wherein the indication information further comprises rounding information, the generating the second operating track comprises: based on the selected apparatus further comprises the holder, determine the rounding information;based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information; andbased on the rounding track, generate the second operating track.
20. The polishing method according to claim 19, wherein the generating a deviation sequence of the pressure sequence comprises: based on the second operating track and the rounding track, adjusting the first operating track and the third operating track; andbased on the pressure sequence, the third operating track, and the second operating track, generating the deviation sequence.

Priority Claims (1)

Number	Date	Country	Kind
202011027679.5	Sep 2020	CN	national

POLISHING MECHANISM, POLISHING DEVICE, AND POLISHING METHOD

Information

Publication Number

Date Filed

Date Published

Inventors

Original Assignees

CPC

International Classifications

Abstract

Description

Claims

Priority Claims (1)