Claims
- 1. A polyamide adhesive composition comprising 100 parts by weight of a polymer component and 0.1 to 5 parts by weight of an aminosilane compound, said polymer component comprising 50 to 99.5% by weight of a polyamide and 0.5 to 50% by weight of a modified polyolefin formed by grafting a polyolefin with an unsaturated compound having a polar group in the molecule.
- 2. A polyamide adhesive composition according to claim 1, wherein when the composition is melt-blended, the polyamide forms a matrix and the modified polyolefin is dispersed in the form of particles in the matrix.
- 3. A polyamide adhesive composition according to claim 1, wherein the polyolefin is more pliable than the polyamide and has a tensile modulus lower than that of the polyamide.
- 4. A polyamide adhesive composition according to claim 1, wherein the unsaturated compound having a polar group in the molecule is selected from the group consisting of .alpha.,.beta.-unsaturated carboxylic acids, alicyclic carboxylic acid, alkenylcarboxylic acid anhydrides, and derivatives thereof.
- 5. A polyamide adhesive composition according to claim 1, wherein the unsaturated compound having a polar group in the molecule is selected from the group consisting of the compound represented by the formula:
- CR.sub.1 .dbd.CR.sub.2 --CO--R.sub.3
- wherein
- R.sub.1 and R.sub.2 are H or an alkyl group, and R.sub.3 is a residue formed by removing H from 1,2,3-benzotriazole, phthalimide, orthosulfobenzimide, 1,8-naphthalimide, succinimide, a lactam or a derivative thereof.
- 6. A polyamide adhesive composition according to claim 1, wherein grafting of the polyolefin with the unsaturated compound is effected in the presence of 0.01 to 5.0 parts by weight of a peroxide based on 100 parts by weight of the polyolefin.
- 7. A polyamide adhesive composition according to claim 1, which is in the form of a sheet or film having a thickness of 0.05 to 1.5 mm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
59-273973 |
Dec 1984 |
JPX |
|
RELATED APPLICATION
This is a division of our U.S. application Ser. No. 813,596, filed 12/26/85, now U.S. Pat. No. 4,690,856.
US Referenced Citations (4)
Foreign Referenced Citations (6)
Number |
Date |
Country |
48-90334 |
Nov 1973 |
JPX |
49-33930 |
Mar 1974 |
JPX |
50-98937 |
Aug 1975 |
JPX |
50-159525 |
Dec 1975 |
JPX |
59-11355 |
Jan 1984 |
JPX |
0136369 |
Aug 1984 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
813596 |
Dec 1985 |
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