Claims
- 1. An adhesive comprising a polyamide and electrically conductive filler.
- 2. An adhesive in accordance with claim 1, wherein said polyamide is an alcohol-soluble polyamide.
- 3. An adhesive in accordance with claim 2, wherein said alcohol-soluble polyamide comprises pendant groups selected from the group consisting of methoxy, ethoxy and hydroxy pendant groups.
- 4. An adhesive in accordance with claim 3, wherein said pendant groups are methylene methoxy pendant groups.
- 5. An adhesive in accordance with claim 1, wherein said polyamide has the following general formula:
- 6. An adhesive in accordance with claim 5, wherein R is a methylene methoxy group.
- 7. An adhesive in accordance with claim 1, wherein said electrically conductive filler is a quaternary ammonium salt.
- 8. An adhesive in accordance with claim 1, wherein said electrically conductive filler is selected from the group consisting of carbon fillers, metal oxide fillers, polymer fillers, charge transporting molecules, and mixtures thereof.
- 9. An adhesive in accordance with claim 8, wherein said electrically conductive filler is a carbon filler selected from the group consisting of carbon black, graphite, fluorinated carbon, and mixtures thereof.
- 10. An adhesive in accordance with claim 9, wherein said carbon filler is a fluorinated carbon filler.
- 11. An adhesive in accordance with claim 8, wherein said electrically conductive filler is a metal oxide filler selected from the group consisting of titanium dioxide, tin oxide, indium tin oxide, iron oxide, aluminum oxide, and mixtures thereof.
- 12. An adhesive in accordance with claim 8, wherein said electrically conductive filler is a polymer filler selected from the group consisting of polypyrrole, polyacrylonitrile, polythiophene, polyaniline and mixtures thereof.
- 13. An adhesive in accordance with claim 12, wherein said polymer is pyrolyzed polyacrylonitrile.
- 14. An adhesive in accordance with claim 8, wherein said electrically conductive filler is a charge transporting molecule selected from the group consisting of bis(dihydroxy diethylamino) triphenyl methane, bis(diethylamino) triphenyl methane, dihydroxy tetraphenyl biphenylene diamine, and mixtures thereof.
- 15. An adhesive in accordance with claim 1, wherein said adhesive is crosslinked.
- 16. An adhesive in accordance with claim 15, wherein said adhesive is crosslinked using oxalic acid as a crosslinking agent.
- 17. An adhesive in accordance with claim 1, wherein said adhesive has a volume resistivity of from about 101 to about 1013 ohms-cm.
- 18. An adhesive in accordance with claim 15, wherein said adhesive has a volume resistivity of from about 109 to about 1011 ohm-cm.
- 19. An adhesive comprising an alcohol soluble polyamide and an electrically conductive filler.
- 20. An adhesive comprising a polyamide having the following general formula:
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] Attention is directed to U.S. patent application Ser. No. 09/493,445 (D/97525D), filed Jan. 28, 2000, entitled “Process and Apparatus for Producing an Endless Seamed Belt;” U.S. patent application Ser. No. 09/470,931 (D/99689) filed Dec. 22, 1999, entitled, “Continuous Process for Manufacturing Imageable Seamed Belts for Printers;” U.S. patent application Ser. No. 09/088,011, (D/97683), filed May 28, 1998, entitled, “Unsaturated Carbonate Adhesives for Component Seams;” U.S. patent application Ser. No. 09/615,444 (D/99598), filed Jul. 13, 2000, entitled, “Polyimide Adhesive For Polyimide Component Interlocking Seams;” U.S. patent application Ser. No. 09/615,426 (D/99598Q), filed Jul. 13, 2000, entitled, “Process For Seaming Interlocking Seams Of Polyimide Component Using Polyimide Adhesive”; U.S. patent application Ser. No. 09/660,248 (D/99610), filed Sep. 13, 2000, entitled, “Imageable Seamed Belts Having Fluoropolymer Adhesive Between Interlocking Seaming Members;” U.S. patent application Ser. No. 09/660,249 (D/99610Q), filed Sep. 13, 2000, entitled, “Imageable Seamed Belts Having Fluoropolymer Overcoat;” U.S. patent application Ser. No. ______ (A0895) filed ______, entitled, “Imageable Seamed Belts Having Hot Melt Processable, Thermosetting Resin and Conductive Carbon Filler Adhesive Between Interlocking Seaming Members;” U.S. patent application Ser. No. ______ (D/A0895Q), filed ______, entitled, “Conductive Carbon Filled Polyvinyl Butyral Adhesive;” U.S. patent application Ser. No. ______ (D/A0895Q1), filed ______, entitled, “Dual Curing Process for Producing a Puzzle Cut Seam;” and U.S. patent application Ser. No. ______ (A0584) filed ______, entitled “Imageable Seamed Belts Having Polyamide Adhesive Between Interlocking Seaming Members.” The disclosures of each of these references are hereby incorporated by reference in their entirety.