Claims
- 1. A thermoplastically processable polyamide molding coposition obtained by melt blending 95.5 to 97% by weight of a polyamide with 0.5 to 3% by weight of at least one organic monoisocyanate of the formula where R is (i) a hydrocarbon radical containing at least six carbon atoms selected form an aliphatic radical, a cycloaliphatic radical, an araliphatic radical or an aromatic radical, (ii) a substituted hydrocarbon radical containing at least six carbon atoms selected from a substituted aliphatic radical, a substituted cycloaliphatic radical, a substituted araliphatic radical or a substituted aromatic radical or (iii) an organic radical comprised of a hydrocarbon radical (i), (ii) or a mixture thereof and bridging members selected from sulfur, oxygen or amide groups where the R does not include any additional NCO groups.
- 2. A thermoplastically processable polyamide molding composition obtained by melt blending 95.5 to 97% by weight of a polyamide with 0.5 to 3% by weight of at least one organic monoisocyanate of the formula
- R--NCO
- formed by reacting 1 mole of (i) a monocarboxylic acid containing six carbon atoms selected from an aliphatic carboxylic acid, a cycloaliphatic carboxylic acid, an araliphatic carboxylic acid or an aromatic carboxylic acid or (ii) a substituted monocarboxylic acid containing at least six carbon atoms substituted with halogen in one or more positions selected from a substituted aliphatic carboxylic acid, a substituted cycloaliphatic carboxylic acid, a substituted araliphatic carboxylic acid or a substituted aromatic carboxylic acid with 1 mole of an isocyanate selected from toluylene diisocyanates, diphenylmethane diisocyanates or hexamethylene diisocyanates.
- 3. A thermoplastically processable polyamide molding composition in accordance with claim 1, wherein the substitution is halogen substitution.
- 4. A thermoplastically processable polyamide molding composition in accordance withh claim 2, wherein the substitution is halogen substitution.
- 5. A thermoplastically processable polyamide molding composition in accordance with claim 1, wherein R contains at least ten carbon atoms.
- 6. A thermoplastically processable polyamide molding composition in accordance with claim 2, wherein the substituted or unsubstituted hydrocarbon radical contains at least ten carbon atoms.
- 7. A thermoplastically processable polyamide molding composition in accordance with claim 1, wherein R is a substituted or unsubstituted aliphatic or cycloaliphatic radical containing from 6 to 50 carbon atoms.
- 8. A thermoplastically processable polyamide molding composition in accordance with claim 2, wherein R is a substituted or unsubstituted aliphatic or cycloaliphatic radical containing from 6 to 50 carbon atoms.
- 9. A thermoplastically processable polyamide molding composition in accordance with claim 1, wherein R is a substituted or unsubstituted araliphaic radical containing from 7 to 50 carbon atoms.
- 10. A thermoplastically processable polyamide molding composition in accordance with claim 2, wherein R is a substituted or unsubstituted araliphatic radical containing from 7 to 50 carbon atoms.
- 11. A thermoplastically processable polyamide molding composition in accordance with claim 2, wherein the monoisocyanate is selected from hexylisocyanate, 6-chlorohexyl isocyanate, n-octyl isocyanate, cyclohexyl isocyanate, 2-ethylhexyl isocyanate, 2,3,4-methylcyclohexyl isocyanate, 3,3,5-trimethylcyclohexyl isocyanate, 2-norbornyl-methyl isocyanate, decyl isocyanate, dodecyl isocyanate, tetradecyl isocyanate, hexadecyl isocyanate, octadecyl isocyanate, technical stearyl isocyanate (mixture of C.sub.12 -C.sub.18 -alkyl isocyanates), 3-butoxypropyl isocyanate, 3-(2-ethylhexyloxy)-propyl isocyanate, phenyl isocyanate, tolyl isocyanates, chlorophenyl isocyanates (2,3,5-isomers), dichlorophenyl isocyanates, 4-nitrophenyl isocyanate, 3-trifluoromethylphenyl isocyanate, benzyl isocyanate, dimethylphenyl isocyanates (technical mixture and individual isomers), nonyl-phenylisocyanate, dodecyl-phenyl isocyanates, 4-cyclohexylphenyl isocyanate, 1-naphthyl isocyanate, (6-isocyanatohexyl)-stearic acid amide, (3-isocyanatotolyl)-stearic acid amide, (6-isocyanatohexyl)-benzamide, (3-isocyanatophenyl) stearic amide or 4-monoisocyanate-4'(stearylamido)-diphenyl-methane.
- 12. A thermoplastically processable polyamide molding composition in accordance with claim 11 wherein the monoisocyanate is selected from dodecyl isocyanate, tetradecyl isocyanate, octadecyl isocyanate, technical stearyl isocyanate (mixture of C.sub.12-18 -alkyl isocyanates), (3-isocyanatotolyl)-stearylamide, chlorophenyl isocyanate, nonyl phenyl isocyanate, dodecylphenyl isocyanate or 4-isocyanate-4'-(stearyl amido)-diphenylmethane.
- 13. A thermoplastically processable polyamide molding composition in accordance with claim 1, wherein the polyamide is polyamide -6, -6,6, -6,9, -6,10, -6,12, -11 or -12, corresponding copolyamides or mixtures thereof.
- 14. A pharmaceutically processable polyamide molding composition in accordance with claim 2, wherein the polyamide is polyamide -6, -6,6, -6,9, -6,10, -6,12, -11 or -12, corresponding copolyamides or mixtures thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3516089 |
May 1985 |
DEX |
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Parent Case Info
This is a continuation-in-part of application Ser. No. 854,086 filed Apr. 21, 1986, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0013697 |
Feb 1975 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
854086 |
Apr 1986 |
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