Claims
- 1. A polyamide molding resin consisting essentially of a polycondensate composed of units of
- (a) 60-90 mole percent isophthalic acid, based on total acids present;
- (b) 10-40 mole percent terephthalic acid, based on total acids present;
- (c) 98-92 mole percent hexamethylene diamine, based on total amines present; and
- (d) bis(p-aminocyclohexyl)methane in which the mole percent present is between a lower limit of 2 mole percent of the total amines present and an upper mole percent limit which is 1/11 of the mole percent of (a) present, and in which at least 59 percent by weight of the bis(p-aminocyclohexyl)methane is either the trans, trans isomer or the cis, trans isomer,
- provided the amount of acids (a) and (b) together comprise about 100 mole percent and provided the amount of amines (c) and (d) together comprise about 100 mole percent, said polyamide having a melt viscosity at 280.degree. C. of less than 30,000 poises.
- 2. A polyamide molding resin defined as in claim 1 in which the components are present in the following amounts
- (a) about 70 mole percent
- (b) about 30 mole percent
- (c) about 96.5 mole percent
- (d) about 3.5 mole percent.
CROSS REFERENCE TO RELATED CASES
This application is a continuation-in-part of application Ser. No. 208,648, filed Nov. 20, 1980, now abandoned.
US Referenced Citations (6)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
208648 |
Nov 1980 |
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