Claims
- 1. A thermoplastic polyamide moulding composition consisting essentially of (i) one polyamide and (ii) from 3 to 15% by weight, based on polyamide, an unsubstituted or substituted C.sub.10 -C.sub.22 sterically unhindered monophenolic compound, which when substituted is substituted in at most of one o-position by one or more C.sub.1 -C.sub.12 alkyl or C.sub.7 -C.sub.15 aralkyl groups, or hydroxy diphenyls or hydroxy triphenyls optionally substituted by one or more C.sub.1 -C.sub.6 alkyl group, the rings of which may optionally be attached through --O-- or C.sub.1 -C.sub.3 alkylene.
- 2. Polyamides as claimed in claim 1, wherein as phenolic compound a member of the group tetrahydronaphthol, 2-butylphenol (sec. and t), 4-t-butylphenol, thymol, 4-t-pentylphenol, octylphenol (mixtures), nonylphenol (mixtures), dodecylphenol (mixtures), 4-hydroxydiphenyl, 2-hydroxydiphenyl, an alkyl substituted hydroxy diphenyl, 1-naphthol, 2-naphthol, benzylphenol(s), benzylcresol(s), 2-phenyl-2-(4-hydroxyphenyl)-propane, 4-hydroxydiphenyl ether, 2- or 4-cyclohexylphenol and a mixture of these compounds is used.
- 3. Polyamides as claimed in claim 1 wherein as phenolic compound a nonylphenol, a dodecylphenol, 2-hydroxybiphenyl or 2-phenyl-2-(4-hydroxyphenyl)-propane is used.
- 4. Polyamides as claimed in claim 1, wherein as polyamide polyamide-6 or polyamide-6,6 is used.
- 5. Polyamides as claimed in claim 1, containing 10 to 60% by weight, based on the moulding composition of reinforcing material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3248329 |
Dec 1982 |
DEX |
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Parent Case Info
This is a continuation-in-part application of the application Ser. No. 561,301, filed Dec. 14, 1983, now abandoned.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
932066 |
Jul 1963 |
GBX |
Non-Patent Literature Citations (1)
Entry |
George Scott: Atmospheric Oxidation and Antioxidants (1968), pp. 330-339. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
561301 |
Dec 1983 |
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