Claims
- 1. A hot melt adhesive composition comprising:a poly-1-butene polymer, a tackifying resin, and from about 3 wt. % to about 16 wt. % of a hydrogenated styrene isoprene diblock copolymer having a molecular weight from 4,000 to 30,000, and a polystyrene content of 5 to 15 percent by weight, wherein isoprene blocks are at least 75 percent hydrogenated.
- 2. The adhesive composition of claim 1 wherein the diblock copolymer is present in an amount of about 7 wt. % to about 16 wt. %, and has a molecular weight of 6,000 to 15,000, a polystyrene content of 8 to 12 percent by weight, and the isoprene blocks are at least 85 percent hydrogenated.
- 3. A hot melt adhesive composition comprising:a poly-1-butene polymer, a tackifying resin, and from about 3 wt. % to about 25 wt. % of a hydrogenated polydiene polymer having a molecular weight of 500 to 20,000, wherein the polymer is at least 75 percent hydrogenated and has one diene block of either isoprene or butadiene or is a diblock polymer wherein one block is of isoprene and the other block is of butadiene, and wherein the polymer optionally has a terminal hydroxy group.
- 4. The adhesive composition of claim 3 wherein the polydiene polymer has the formula(HO)x—A—Sz—B—(OH)y wherein A and B are polymer blocks which may be hompolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers, or copolymer blocks of diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, and the A blocks have a number average molecular weight of 100 to 6,000, and the B blocks have a number average molecular weight of 1,000 to 15,000, S is a vinyl aromatic hydrocarbon block which may have a number average molecular weight of from 100 to 10,000, x and y are 0 or 1, either x or y may be 1 but not both, and z is 0 or 1.
- 5. The adhesive composition of claim 4 wherein the polydiene polymer has the formulaI—EB—OH where I represents isoprene, and EB represents hydrogenated butadiene.
- 6. A hot melt adhesive composition consisting essentially of:a poly-1-butene polymer, a tackifying resin, and from about 3 wt % to about 25 wt. % of a polyisoprene homopolymer having a molecular weight of 15,000 to 40,000 wherein the homopolymer is at least 75 percent hydrogenated.
- 7. The adhesive composition of claim 6 wherein the polyisoprene homopolymer has a molecular weight of about 20,000 to 30,000 and is at least 85 percent hydrogenated.
Parent Case Info
This application claims benefit of Provisional Appl. 06/078,459, filed Mar. 18, 1998.
US Referenced Citations (6)
Provisional Applications (1)
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Number |
Date |
Country |
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60/078459 |
Mar 1998 |
US |