Claims
- 1. A polyamide comprising at least one dicarboxylic acid and at least one diamine, said polyamide prepared by passing a pressurized, essentially liquid phase salt mixture containing said diamine and said dicarboxylic acid at a temperature no greater than the lesser of the decomposition temperature of the mixture or the decomposition temperature of said polyamide through an orifice into a zone of about 0-400 psig pressure to form a dispersion and heating said dispersion to a mean temperature in the range of about 350.degree. F. to about 750.degree. F.
- 2. The polyamide of claim 1 wherein said dicarboxylic acid is selected from the group consisting of adipic acid, terephthalic acid and isophthalic acid.
- 3. The polyamide of claim 1 wherein said diamine is an aliphatic diamine.
- 4. The polyamide of claim 1 wherein said mixture contains terephthalic acid and adipic acid.
- 5. The polyamide of claim 1 wherein said dispersion is passed to a finishing reactor and the polyamide is separated from the vapor phase.
- 6. A polyphthalamide comprising hexamethylene terephthalamide, said polyphthalamide prepared by passing an essentially liquid phase salt mixture containing hexamethylene diamine and terephthalic acid at a temperature no greater than the lesser of the decomposition temperature of the mixture or the decomposition temperature of said polyamide and at a pressure sufficient to avoid formation of a vapor phase through an orifice into a zone of about 0-400 psig pressure to form a dispersion and heating said dispersion to a mean temperature in the range of about 350.degree. F. to about 750.degree. F.
- 7. The polyphthalamide of claim 6 wherein the velocity of said dispersion through the low pressure zone is at least 1.2 times critical velocity.
- 8. The polyphalamide of claim 6 wherein said dispersion is passed to a finishing reactor and the polyphalamide is separated from the vapor phase.
- 9. The polyphthalamide of claim 8 wherein the finishing reactor is a twin-screw extruder.
CROSS-REFERENCE TO RELATED APPLICATIONS
This Application is a division of U.S. application Ser. No. 08/280,702, filed Jul. 26, 1994 now U.S. Pat. No. 5,480,616, which was a continuation of U.S. application Ser. No. 07/970,577, filed Nov. 3, 1992, now abandoned, which was a continuation of U.S. application Ser. No. 07/651,475, filed Feb. 6, 1991, now abandoned, which was a continuation of U.S. application Ser. No. 07/350,147, filed May 10, 1989, now abandoned, which was a divisional of U.S. application Ser. No. 07/047,905, filed May 7, 1987, now U.S. Pat. No. 4,831,108, which was a continuation of U.S. application Ser. No. 06/715,609, filed Mar. 25, 1985, now abandoned, which was a continuation-in-part of U.S. application Ser. No. 06/640,672, filed Aug. 13, 1984, now abandoned, which in turn is a continuation of U.S. application Ser. No. 06/466,904, filed Feb. 16, 1983, now abandoned.
US Referenced Citations (12)
Foreign Referenced Citations (1)
| Number |
Date |
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| 51-115596 |
Oct 1976 |
JPX |
Divisions (2)
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280702 |
Jul 1994 |
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47905 |
May 1987 |
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Continuations (5)
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970577 |
Nov 1992 |
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651475 |
Feb 1991 |
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350147 |
May 1989 |
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715609 |
Mar 1985 |
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466904 |
Feb 1983 |
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Continuation in Parts (1)
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640672 |
Aug 1984 |
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