The present invention relates to a sintered polycrystalline diamond composite for use in rock drilling, machining of wear resistant materials, and other operations which require the high abrasion resistance or wear resistance of a diamond surface. Specifically, this invention relates to such composite bodies which comprise a polycrystalline diamond layer attached to a cemented metal carbide substrate via processing at ultrahigh pressures and temperatures.
It is well known to sinter a mass of crystalline particles such as diamond or cubic boron nitride in the presence of a suitable solvent catalyst by means of a high pressure, high temperature apparatus to form a compact with good particle-to-particle bonding. Typically the diamond is a synthetic industrial grade diamond with a nitrogen content above 1000 ppm. It is also well known that use of diamond particles smaller in size result in a compact with higher abrasion resistance when used to machine or drill certain materials such as rock. However, there is a limit as to how fine a particle size becomes useful since the impact strength and thermal stability of a compact are reduced as the diamond particle size becomes smaller. Such composite compacts are widely used in machining and drilling since the carbide substrate provides good mechanical support and can be clamped or brazed to a suitable tool holder or drilling bit.
It would be useful if the wear life of a compact could be extended without giving up impact resistance as happens with smaller diamond particle size or by having to make the diamond layer thicker which increases the stress in the compact leading to early catastrophic failure due to cracking or delmination.
The present invention pertains to an apparatus and method of forming a composite body including the steps of forming a diamond material layer having a first surface from diamond crystals having a nitrogen content of less than 100 ppm; providing a substrate; and bonding the first surface of the diamond material layer and the substrate under high pressure and high temperature.
The composite body has a diamond material layer formed from diamond crystals having a nitrogen content of less than 100 ppm. The diamond material layer has a first surface and a substrate. The first surface of the diamond material layer and the substrate are bonded together under high pressure and high temperature.
The various features, advantages and other uses of the present invention will become more apparent by referring to the following detailed description and drawing in which:
A diamond material is manufactured by chemical vapor deposition under conditions that limit nitrogen absorption into the diamond crystals. This material can be grown by any of the CVD techniques now being used, such as plasma assisted or heated filament methods. These low pressure methods of making the diamond layer are preferable since they can produce diamond with low nitrogen content. This low-nitrogen diamond shows a higher degree of abrasion resistance than diamonds currently being manufactured by high pressure manufacturing processes. The diamond is typically crushed, sized and then cleaned in a hydrogen furnace for about 1 hour at about 900° C. This diamond feed stock can be used by any of the well-known high pressure, high temperature manufacturing processes to produce a PDC cutter.
In the following description and claims, it should be understood that a cemented metal carbide substrate refers to a carbide of one of the group IVB, VB or VIB metals which is pressed and sintered in the presence of a binder of cobalt, nickel, or iron and the alloys thereof.
A diamond material 1 is placed into a protective metal cup 4 then a substrate, or support 2 is placed into the cup 4 on top of the diamond material 1.
An enclosure 3 is cylindrical in shape and is designed to fit within a central cavity of an ultrahigh pressure and temperature cell, such as that described in U.S. Pat. No. 3,745,623 or U.S. Pat. No. 3,913,280.
The enclosure 3 is composed of a metal, such as zirconium, molybdenum, or tantalum, which is selected because of its high melting temperature and designed to protect the reaction zone from moisture and other harmful impurities present in a high pressure and high temperature environment. The cup 4 is also made of a metal, such as zirconium, molybdenum, or tantalum, and designed to provide additional protection to the sample if the outer enclosure should fail. Discs 5 are fabricated from either zirconium or molybdenum and disc 6 is composed of fired mica, salt, boron nitride, or zirconium oxide and is used as a separator so that the composite bodies can be easily divided.
Typically, the metal carbide support 2 will be composed of tungsten carbide with a 13 weight percent cobalt binder.
The entire cell is subjected to pressures in excess of 40 K-bars and heated in excess of about 1400° C. for a time of about 10 minutes. Then the cell is allowed to cool enough so that the diamond does not back-convert to graphite when the pressure is released.
After pressing, the samples are lapped and ground to remove all the protective metals of the enclosure, cup and discs of 3, 4, 5, and 6.
Finished parts are mounted on to tool shanks or drill bit bodies by well-known methods, such as brazing, LS bonding, mechanical interference fit, etc., and find use in such applications as, machining high silicon aluminum, brass, composite materials, rock, or any application where excessive temperatures may result in thermal degradation of the diamond cutting edge.
100 carats of CVD diamond material with a nitrogen content of less than 1 ppm and with an average particle size of 25 microns is cleaned in a hydrogen atmosphere at 900° C. for one hour. The cleaned diamond thus produced is used as a feed stock to manufacture a PDC cutter by known high pressure, high temperature techniques.
This application claims the benefit of the Oct. 8, 2003 filing date of U.S. Provisional Application No. 60/509,443, the entire contents of which are hereby incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
2077345 | Van der Pyl | Apr 1937 | A |
2137200 | Boyer | Nov 1938 | A |
2137201 | Boyer | Nov 1938 | A |
2173833 | Fitz-Randolph | Sep 1939 | A |
2238351 | Van der Pyl | Apr 1941 | A |
2270209 | Van der Pyl | Jan 1942 | A |
2561709 | Norling | Jul 1951 | A |
2828197 | Blackman, Jr. | Mar 1958 | A |
2944323 | Stadler | Jul 1960 | A |
2947610 | Hall | Aug 1960 | A |
2992900 | Bovenkerk | Jul 1961 | A |
3087803 | Bakian | Apr 1963 | A |
3141746 | De Lai | Jul 1964 | A |
3192620 | Huiziny | Jul 1965 | A |
3233988 | Wentorf, Jr. | Feb 1966 | A |
3369879 | Miller | Feb 1968 | A |
3517464 | Mattia | Jun 1970 | A |
3609818 | Wentorf, Jr. | Oct 1971 | A |
3637360 | Ueltz | Jan 1972 | A |
3645706 | Bovenkerk | Feb 1972 | A |
3743489 | Wentorf, Jr. | Jul 1973 | A |
3745623 | Wentorf, Jr. | Jul 1973 | A |
3767371 | Wentorf, Jr. | Oct 1973 | A |
3902873 | Hughes | Sep 1975 | A |
3904391 | Lindstrom | Sep 1975 | A |
3913280 | Hall | Oct 1975 | A |
4034066 | Strong et al. | Jul 1977 | A |
4041650 | Sawluk | Aug 1977 | A |
4042673 | Strong | Aug 1977 | A |
4104344 | Pope | Aug 1978 | A |
4109737 | Bovenkerk | Aug 1978 | A |
4156329 | Daniel | May 1979 | A |
4224380 | Bovenkerk | Sep 1980 | A |
4225322 | Knemeyer | Sep 1980 | A |
4229186 | Wilson | Oct 1980 | A |
4239501 | Wirth | Dec 1980 | A |
4239502 | Slack | Dec 1980 | A |
4259090 | Bovenkerk | Mar 1981 | A |
4260397 | Bovenkerk | Apr 1981 | A |
4268276 | Bovenkerk | May 1981 | A |
4278448 | Ishizuka | Jul 1981 | A |
4311490 | Bovenkerk | Jan 1982 | A |
4322396 | Strong | Mar 1982 | A |
4339896 | Dennis | Jul 1982 | A |
4350215 | Radtke | Sep 1982 | A |
4378233 | Carver | Mar 1983 | A |
4411672 | Ishizuka | Oct 1983 | A |
4481016 | Campbell | Nov 1984 | A |
4481180 | Bedere | Nov 1984 | A |
4496372 | Almond | Jan 1985 | A |
4505721 | Almond | Mar 1985 | A |
4522633 | Dyer | Jun 1985 | A |
4592433 | Dennis | Jun 1986 | A |
4604106 | Hall | Aug 1986 | A |
4626407 | Veltri | Dec 1986 | A |
4629373 | Hall | Dec 1986 | A |
RE32380 | Wentorf, Jr. | Mar 1987 | E |
4661180 | Frushour | Apr 1987 | A |
4662896 | Dennis | May 1987 | A |
4670025 | Pipkin | Jun 1987 | A |
4686080 | Hara | Aug 1987 | A |
4705123 | Dennis | Nov 1987 | A |
4716975 | Dennis | Jan 1988 | A |
4776861 | Frushour | Oct 1988 | A |
4784023 | Dennis | Nov 1988 | A |
4789385 | Dyer | Dec 1988 | A |
4802895 | Burnand | Feb 1989 | A |
4828582 | Frushour | May 1989 | A |
4866885 | Dodsworth | Sep 1989 | A |
4871377 | Frushour | Oct 1989 | A |
4875907 | Phaal | Oct 1989 | A |
4954139 | Cerutti | Sep 1990 | A |
4972637 | Dyer | Nov 1990 | A |
4988554 | Peterson | Jan 1991 | A |
5007207 | Phaal | Apr 1991 | A |
5011509 | Frushour | Apr 1991 | A |
5011515 | Frushour | Apr 1991 | A |
5014468 | Ravipati | May 1991 | A |
5032147 | Frushour | Jul 1991 | A |
5049164 | Horton | Sep 1991 | A |
5054246 | Phaal | Oct 1991 | A |
5120327 | Dennis | Jun 1992 | A |
5133332 | Tanaka et al. | Jul 1992 | A |
5190734 | Frushour | Mar 1993 | A |
5351772 | Smith | Oct 1994 | A |
5355969 | Hardy | Oct 1994 | A |
5379854 | Dennis | Jan 1995 | A |
5449388 | Wiand | Sep 1995 | A |
5469927 | Griffin | Nov 1995 | A |
5564511 | Frushour | Oct 1996 | A |
5598750 | Griffin | Feb 1997 | A |
5645617 | Frushour | Jul 1997 | A |
5981057 | Collins | Nov 1999 | A |
6030595 | Sumiya et al. | Feb 2000 | A |
6187068 | Frushour | Feb 2001 | B1 |
6582513 | Linares et al. | Jun 2003 | B1 |
6846341 | Middlemiss | Jan 2005 | B2 |
Number | Date | Country | |
---|---|---|---|
20050079358 A1 | Apr 2005 | US |
Number | Date | Country | |
---|---|---|---|
60509443 | Oct 2003 | US |