Claims
- 1. A device for cutting and drilling, wherein the device comprises:
- a substrate having a base plane with a plurality of substantially cylindrical projections protruding substantially perpendicular therefrom, where the projections are disposed generally in a nonlinear pattern across said base plane, having a base fixed to said substrate, a sidewall projecting upward from the base, and a top surface having a substantially convex shape; and
- a polycrystalline material sintered onto the substrate base plane and cylindrical projections, having a cutting surface and an opposed mounting surface, the mounting surface having a plurality of complementary depressions for receiving the plurality of projections on the support surface, said mounting surface being fixed to said base plane and cylindrical projections.
- 2. The device as defined in claim 1 wherein the substrate and the projections on said substrate are comprised of carbide.
- 3. The device as defined in claim 1 wherein the sidewall of the projections taper so as to be wider at the base than at the top surface thereof.
- 4. The device as defined in claim 3 wherein the taper of the sidewall of the projections generally varies between 5 and 20 degrees from vertical.
- 5. The device as defined in claim 1 wherein the top surface of the projections is generally rounded.
- 6. The device as defined in claim 1 wherein the base of the projections is beveled for a smooth transition between the sidewall and the substrate support surface.
- 7. The device as defined in claim 1 wherein the projections extend at least 0.010 inches in height above the substrate support surface.
- 8. The device as defined in claim 7 wherein the top surface of the projections is tangential to the cutting surface.
- 9. The device as defined in claim 7 wherein the top surface of the projections is below the cutting surface.
- 10. The device as defined in claim 1 wherein the projections are all of substantially equal height, and are distributed in a random pattern across the substrate support surface.
- 11. The device as defined in claim 1 wherein the polycrystalline material further comprises a layer of cubic boron nitride.
- 12. The device as defined in claim 1 wherein the plurality of projections are distributed across the substrate support surface in a substantially concentric series of at least two rings.
- 13. The device as defined in claim 12 wherein the plurality of projections are distributed with substantially equidistant space between projections in the rings, and wherein each consecutive ring of projections decreases in height toward a center of the substrate support surface.
- 14. The device as defined in claim 12 wherein the plurality of projections are distributed with substantially equidistant space between projections in the rings, and wherein each consecutive ring of projections increases in height toward a center of the substrate support surface.
- 15. The device as defined in claim 12 wherein distribution density of the plurality of projections increases in rings nearer the center of the substrate support surface, and the projections are of substantially equal height.
- 16. The device as defined in claim 12 wherein distribution density of the plurality of projections decreases in rings nearer the center of the substrate support surface, and projections are of substantially equal height.
- 17. The device as defined in claim 12 wherein distribution density and height of the plurality of projections increases in rings nearer the center of the substrate support surface.
- 18. The device as defined in claim 12 wherein distribution density and height of the plurality of projections decreases in rings nearer the center of the substrate support surface.
- 19. The device as defined in claim 12 wherein distribution density of the plurality of projections decreases while the height of the plurality of projections increases in the rings nearer to the center of the substrate support surface.
- 20. The device as defined in claim 12 wherein distribution density of the plurality of projections increases while the height of the plurality of projections decreases in the rings nearer to the center of the substrate support surface.
- 21. The device as defined in claim 12 wherein the plurality of projections are covered by the polycrystalline material so as to leave no portion of said projections exposed.
- 22. The device as defined in claim 12 wherein at least one of the plurality of projections completely penetrates so as to be exposed on the cutting surface of the polycrystalline material.
- 23. A method for creating a transition zone in a composite body used for cutting or drilling, and comprising a polycrystalline diamond cutting surface and a carbide substrate, wherein residual stress within the transition zone is modified so as to increase a load bearing capacity of the composite body, comprising the steps of:
- a) providing a carbide substrate;
- b) forming a plurality of carbide projections attached and perpendicular to a top surface of the carbide substrate, wherein said top surface of the carbide substrate is otherwise planar, wherein the projections are substantially cylindrical and have a top which is generally convex, so as to be easily removed from a die, and wherein the projections modify residual stress so as to increase load bearing capacity of the composite body; and
- c) sintering a polycrystalline diamond layer to the carbide substrate such that the carbide projections are covered by the polycrystalline diamond layer; wherein said sintering occurs in an ultra-high pressure/high temperature apparatus.
- 24. The method for modifying residual stresses within a composite body as defined in claim 23, wherein modifying the residual stress includes the step of using the plurality of projections to modify tensile and compression stresses created in manufacturing.
- 25. The method for modifying residual stress within a composite body as defined in claim 24, wherein modifying the residual stress includes the further step of using the plurality of projections to reduce tensile stress created in manufacturing.
- 26. The method for modifying residual stress within a composite body as defined in claim 24, wherein modifying the residual stress includes the further step of using the plurality of projections to reduce tensile stress in a core of the carbide substrate and on an outer perimeter of the composite body just below the transition zone.
- 27. The method for modifying residual stress within a composite body as defined in claim 23, wherein the step of manufacturing a plurality of carbide projections includes the further step of forming the plurality of carbide projections with rounded edges so as to prevents cracks from developing in the composite body.
- 28. The method for modifying residual stress within a composite body as defined in claim 23, wherein the step of forming a plurality of carbide projections includes the further step of varying a pattern of distribution, density within the distribution, and height of the plurality of carbide projections so as to achieve a desired residual stress distribution in the composite body.
- 29. The method for modifying residual stress within a composite body as defined in claim 23, wherein the step of forming a plurality of carbide projections includes the further step of varying a pattern of distribution, density within the distribution, thickness and height of the plurality of carbide projections so as to achieve a desired residual stress distribution in the composite body.
Parent Case Info
This application is a continuation of U.S. application Ser. No. 08/502,821, filed Jul. 14, 1995, of Stephen R. Jurewicz for POLYCRYSTALLINE DIAMOND CUTTER WITH INTEGRAL CARBIDE/DIAMOND TRANSITION LAYER, now abandoned.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2283772 |
May 1995 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
502821 |
Jul 1995 |
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