Claims
- 1. A process for preparing a cured composition which comprises:
- (A) forming a solution of (a) a polycyanate ester of a polyhydric phenol and
- (b) an amorphous, aromatic thermoplastic rein,
- (B) adding a curing catalyst;
- (C) heating the solution at a temperature of about 200.degree. F. to about 350.degree. F. for a time sufficient for phase separation of (a) and (b) to occur and to gel the polycyanate ester, and
- (D) curing the gel at a temperature of about 350.degree. F. to about 500.degree. F. for about 30 minutes to about 8 hours, wherein said cured composition has strain energy release rate values in the crack opening mode, G.sub.IC, in excess of 1.5 inch-pounds/inch.sup.2.
- 2. The process of claim 1 wherein (b), the amorphous, aromatic thermoplastic resin, is present in the amount of about 5 to about 25 weight percent based on the weight of (a) and (b).
- 3. The process of claim 1 wherein (b), the thermoplastic resin, has a heat defection temperature of at least 150.degree. C.
- 4. The process of claim 3 wherein the thermoplastic resin is selected from the group consisting of polysulfones, polyetherimides, wholly aromatic polyesters, polyether sulfones, wholly imidized polymers of dianhydrides and asymmetric diamines, polyarylethers and polyarylformals.
- 5. The process of claim 4 wherein the thermoplastic resins are terminated with hydroxyl groups, amine groups, or epoxy groups.
- 6. The process of claim 1 wherein the polycyanate ester is a polycyanate ester of a dihydric phenol selected from the group consisting of 4,4'-dihydroxy-diphenyl propane, 4,4'-dihydroxydiphenyl oxide, 4,4'-methylene bis(2,6-dimethylphenol) and bis(4-hydroxyphenyl-1,1-ethane.
- 7. The process of claim 1 wherein the catalyst is an active hydrogen class catalyst, a metal coordination class catlayst, or a mixture thereof.
- 8. The process of claim 1 wherein the strain release values in the crack opening mode are about 3 to about 6 inch pounds/inch.sup.2.
CROSS REFERENCE TO RELATED APPLICATIONS
This is a division of U.S. patent application Ser. No. 07/104,686, filed Oct. 5, 1987 now U.S. Pat. No. 4,902,752.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4157360 |
Prevorsek et al. |
Jun 1979 |
|
4334045 |
Wu et al. |
Jun 1982 |
|
4785075 |
Shimp |
Nov 1988 |
|
Divisions (1)
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Number |
Date |
Country |
Parent |
104686 |
Oct 1987 |
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