Patent Application
20080281117
1. Field of the Invention
The present invention relates to a polycyclic hydrocarbon group-containing organosilicon compound having hydrogen atoms bonded to silicon atoms (hereafter also referred to as “SiH” groups), which is useful as a raw material for curable silicone materials, encapsulating materials for optical devices such as optical elements, encapsulating materials for other electronic devices such as semiconductor elements, and electrically insulating coating materials. The invention also relates to a method of producing the polycyclic hydrocarbon group-containing organosilicon compound.
2. Description of the Prior Art
In recent years, the output of blue light emitting diodes (LED) and white LEDs has increased, and they are now starting to be used for mobile telephone flashes, backlights for liquid crystal displays, and for general illumination. However, this increase in the LED output has lead to increases in the quantity of ultraviolet light emitted and the quantity of heat generated, meaning the materials used for constructing the devices require better levels of light resistance, heat resistance and crack resistance.
Coating and encapsulating materials for LEDs require favorable transparency, and although conventional epoxy resins exhibit a high degree of hardness and superior crack resistance, they are known to undergo discoloration when exposed to ultraviolet light or heat, which leads to a deterioration in the LED output.
The use of silicone resins has been investigated as one potential solution to the above discoloration problem. Soft silicone resins generally exhibit excellent heat resistance, but they suffer from poor workability and are prone to dirt and dust adhesion. Furthermore, although hard silicones provide excellent workability and handling properties, they tend to suffer from inferior crack resistance.
The present invention takes the above problems associated with the conventional technology into consideration, and has an object of providing a polycyclic hydrocarbon group-containing organosilicon compound having SiH groups, which yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and which is useful as a raw material for curable silicone materials, encapsulating materials for optical devices such as optical elements, encapsulating materials for other electronic devices such as semiconductor elements, and electrically insulating coating materials. Another object of the present invention is to provide a method of producing the polycyclic hydrocarbon group-containing organosilicon compound.
As a result of intensive investigation aimed at achieving the above objects, the inventors of the present invention were able to complete the present invention. In other words, a first aspect of the present invention provides a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of:
(a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and
(b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule.
A second aspect of the present invention provides a method of producing the above polycyclic hydrocarbon group-containing organosilicon compound, the method comprising conducting an addition reaction between the above component (a) and the above component (b) in the presence of a hydrosilylation reaction catalyst.
A cured product obtained from a composition containing the polycyclic hydrocarbon group-containing organosilicon compound having SiH groups according to the present invention has a high degree of hardness and excellent transparency, crack resistance and heat resistance. Accordingly, a curable composition that uses this compound can be used favorably within applications that involve protecting, encapsulating or bonding light emitting diode elements. Furthermore, the composition can also be used as a lens material, an encapsulating material for optical devices such as optical elements, a variety of optical materials such as display materials, an encapsulating material for other electronic devices such as semiconductor elements, and a coating material such as an electrically insulating coating material.
A more detailed description of the present invention is provided below. In this description, “Me” represents a methyl group and “Vi” represents a vinyl group.
[Polycyclic Hydrocarbon Group-containing Organosilicon Compound having SiH Groups]
The polycyclic hydrocarbon group-containing organosilicon compound having two SiH groups within each molecule according to the present invention is an addition reaction product of a component (a) described below, which is an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and a component (b) described below, which is a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule.
<Component (a)>
The component (a) is an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule. There are no particular restrictions on the component (a), provided it undergoes an addition reaction with the component (b) to generate the polycyclic hydrocarbon group-containing organosilicon compound having SiH groups of the present invention, although in terms of facilitating improvement in the hardness, transparency, crack resistance and/or heat resistance of the cured product obtained from a composition containing the polycyclic hydrocarbon group-containing organosilicon compound, the component (a) preferably contains a phenylene group, and even more preferably contains a silphenylene group (S1—C6H4—Si). The component (a) may use either a single compound or a combination of two or more different compounds.
In a preferred embodiment of the present invention, an example of the component (a) is an organosilicon compound represented by a general formula (1) shown below.
(wherein, R represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 12 carbon atoms, and preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms)
Examples of R in the above general formula (1) include alkyl groups of 1 to 12, preferably 1 to 6, and even more preferably 1 to 3 carbon atoms, such as a methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert-butyl group, pentyl group, isopentyl group, hexyl group or sec-hexyl group; cycloalkyl groups of 3 to 12, preferably 4 to 10, and even more preferably 5 or 6 carbon atoms, such as a cyclopentyl group or cyclohexyl group; aryl groups of 6 to 12, preferably 6 to 10, and even more preferably 6 to 8 carbon atoms, such as a phenyl group, or an o-, m- or p-tolyl group; and groups in which a portion of, or all of, the hydrogen atoms within one of the above hydrocarbon groups have been substituted with a halogen atom (for example, a fluorine atom, chlorine atom, bromine atom or iodine atom) or the like, such as a p-fluorophenyl group, p-chlorophenyl group or p-bromophenyl group. In terms of ease of industrial production and availability, organosilicon compounds of the above general formula (1) in which all of the R groups are methyl groups are preferred.
Specific examples of organosilicon compounds represented by the above general formula (1) include the silphenylene compounds 1,4-bis(dimethylsilyl)benzene represented by HMe2Si-p-C6H4—SiMe2H, 1,3-bis(dimethylsilyl)benzene represented by HMe2Si-m-C6H4—SiMe2H, and 1,2-bis(dimethylsilyl)benzene represented by HMe2Si-o-C6H4—SiMe2H.
<Component (b)>
The component (b) is a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule. The component (b) may be any one of (i) a compound in which the hydrosilylation reactive carbon-carbon double bonds are formed between adjacent carbon atoms that constitute the polycyclic hydrocarbon skeleton, (ii) a compound in which hydrogen atoms bonded to carbon atoms that constitute the polycyclic hydrocarbon skeleton are substituted with groups containing hydrosilylation reactive carbon-carbon double bonds, or (iii) a compound in which a hydrosilylation reactive carbon-carbon double bond is formed between two adjacent carbon atoms that constitute the polycyclic hydrocarbon skeleton, and a hydrogen atom bonded to a carbon atom that constitutes part of the polycyclic hydrocarbon skeleton is substituted with a group containing a hydrosilylation reactive carbon-carbon double bond. The component (b) may use either a single compound or a combination of two or more different compounds.
In a preferred embodiment of the present invention, an example of the component (b) is a polycyclic hydrocarbon compound represented by a general formula (x) shown below.
(wherein, R′ represents an unsubstituted or substituted alkenyl group of 2 to 12 carbon atoms).
In the above general formula (x), examples of the alkenyl group represented by R′ include groups in which the number of carbon atoms is typically from 2 to 12, preferably from 2 to 6, and even more preferably from 2 to 4. Specific examples include a vinyl group, allyl group, propenyl group, butenyl group, pentenyl group, hexenyl group, and heptenyl group, and of these a vinyl group is preferred.
In a particularly preferred embodiment of the present invention, specific examples of the component (b) include 5-vinylbicyclo[2.2.1]hept-2-ene, represented by a structural formula (y) shown below,
6-vinylbicyclo[2.2.1]hept-2-ene, represented by a structural formula (z) shown below,
or a combination of these two compounds (hereafter, in those cases where there is no need to differentiate between these three options, the generic term “vinylnorbornene” may be used).
The arrangement of the vinyl group in the above vinylnorbornenes may adopt either a cis arrangement (the exo form) or a trans arrangement (the endo form), or alternatively, because this variation in the vinyl group arrangement does not cause any significant changes in the reactivity of the component (b), a combination of both isomers may also be used.
<Example of Polycyclic Hydrocarbon Group-Containing Organosilicon Compound having SiH Groups>
A specific example of a preferred polycyclic hydrocarbon group-containing organosilicon compound having SiH groups according to the present invention is shown below, although the present invention is not limited to this example.
(wherein, R is as defined above, and n represents an integer from 1 to 50, preferably from 1 to 30, and even more preferably from 1 to 20)
Because this compound includes both a polycyclic hydrocarbon group and a phenylene group, a cured product obtained from a composition that contains this compound has a particularly high degree of hardness, and particularly superior levels of transparency, crack resistance and heat resistance.
<Preparation of Polycyclic Hydrocarbon Group-Containing Organosilicon Compound having SiH Groups>
The polycyclic hydrocarbon group-containing organosilicon compound having SiH groups can be produced by conducting an addition reaction, in the presence of a hydrosilylation reaction catalyst, of an excess of the above component (a) equivalent to more than 1 mol but not more than 10 mols, and preferably more than 1 mol but not more than 5 mols, per 1 mol of the above component (b). Because a molar excess of the component (a) is reacted with the component (b) during the preparation, the produced polycyclic hydrocarbon group-containing organosilicon compound having SiH groups according to the present invention contains two SiH groups derived from the structure of the component (a) within each molecule.
There are no particular restrictions on the hydrosilylation reaction catalyst, and any of the conventional catalysts may be used. Examples include platinum-based catalysts such as platinic chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monovalent alcohols, complexes of chloroplatinic acid and olefins, platinum bisacetoacetate, metallic platinum supported on carbon powder, and platinum black; as well as other platinum group metal-based catalysts such as palladium-based catalysts and rhodium-based catalysts. Furthermore, there are no particular restrictions on the addition reaction conditions or the solvent used, and normal practices may be followed. The hydrosilylation reaction catalyst may use either a single material or a combination of two or more different materials.
In a specific example, a polycyclic hydrocarbon group-containing organosilicon compound represented by the above general formula (2) can be produced by conducting an addition reaction, in the presence of a hydrosilylation reaction catalyst, of an excess of an organosilicon compound represented by the above general formula (1) equivalent to more than 1 mol but not more than 10 mols, and preferably more than 1 mol but not more than 5 mols, per 1 mol of 5-vinylbicyclo[2.2.1]hept-2-ene, 6-vinylbicyclo[2.2.1]hept-2-ene, or a combination of these two compounds. This reaction may be conducted in the absence of a solvent, or may be conducted in the presence of a solvent such as toluene. The reaction temperature is typically within a range from 50 to 150° C., and is preferably from 80 to 120° C. The reaction time is typically within a range from 10 to 30 hours. The quantity added of the hydrosilylation reaction catalyst need only be sufficient to accelerate the above addition reaction, and a typical quantity, calculated as the mass of the platinum group metal relative to the combined mass of the raw material compounds, is within a range from 1 ppm (on a mass basis, this also applies below) to 1% by mass, and is preferably within a range from 10 to 500 ppm. Provided the quantity of the catalyst is within this range, the addition reaction can be accelerated satisfactorily, and the addition reaction rate can be easily increased by increasing the quantity of the catalyst, which is desirable from an economic perspective.
The polycyclic hydrocarbon group-containing organosilicon compound having SiH groups according to the present invention is useful as a raw material for curable silicone materials, encapsulating materials for optical devices such as optical elements, encapsulating materials for other electronic devices such as semiconductor elements, and electrically insulating coating materials. Examples of optical devices include optical elements such as LEDs, semiconductor lasers, photodiodes, phototransistors, solar cells and CCDs; and optical components such as lenses. Examples of electronic devices include semiconductor elements such as diodes, transistors, ICs, CPUs and memory elements.
Specifics of the present invention are described below using a series of examples, although the present invention is in no way limited by the examples presented below.
A 500 ml four-neck flask fitted with a stirrer, a cooling tube, a dropping funnel and a thermometer was charged with 194 g (1 mol) of 1,4-bis(dimethylsilyl)benzene and 100 g of toluene as a solvent, and the flask was then heated to 85° C. using an oil bath. 0.1 g of a carbon powder supporting 5% by mass of platinum metal was added to the flask, and with the mixture undergoing constant stirring, 60 g (0.5 mols) of a vinylnorbornene (product name: V0062, manufactured by Tokyo Kasei Kogyo Co., Ltd., a substantially equimolar isomeric mixture of 5-vinylbicyclo[2.2.1]hept-2-ene and 6-vinylbicyclo[2.2.1]hept-2-ene) was added dropwise over a period of 60 minutes. Following completion of the dropwise addition, the reaction mixture was stirred for a further 24 hours under heating at 120° C., and was then cooled to room temperature. Subsequently, the carbon powder-supported platinum metal was removed by filtration, and the toluene and unreacted raw materials were removed by evaporation under reduced pressure, yielding 206 g of a colorless and transparent oily reaction product (viscosity at 25° C.: 300 Pa·s).
The results of FT-IR, NMR and GPC analyses of the reaction product confirmed that the product was a mixture represented by the structural formula shown below (n=1: 38 mol %, n=2: 20 mol %, n=3: 16 mol %, n=4 to 10: a total of 26 mol %). Furthermore, the refractive index of the reaction product was 1.545.
A composition was prepared by mixing uniformly together:
(A) 77 parts by mass of the reaction product obtained in the example 1,
(B) 15 parts by mass of (ViMeSiO)4,
(C) a platinum-vinylsiloxane complex as a curing catalyst, in sufficient quantity to provide 20 ppm of platinum metal atoms relative to the total mass of the composition,
(D) 0.03 parts by mass of 1-ethynylcyclohexanol, and
(as another component) 8 parts by mass of 1-(2-trimethoxysilylethyl)-3-(3-glycidoxypropyl)-1,3,5,7-tetramethylcyclotetrasiloxane.
This composition was poured into a mold formed from glass plates to generate a thickness of 2 mm, and was then heated at 150° C. for 5 hours, thus yielding a cured product.
A composition was prepared by mixing uniformly together:
(A) 75 parts by mass of the reaction product obtained in the example 1,
(B) 17 parts by mass of (ViMeSiO)4,
(C) a platinum-vinylsiloxane complex as a curing catalyst, in sufficient quantity to provide 20 ppm of platinum metal atoms relative to the total mass of the composition,
(D) 0.03 parts by mass of 1-ethynylcyclohexanol, and
(as another component) 8 parts by mass of 1-(2-trimethoxysilylethyl)-3-(3-glycidoxypropyl)-1,3,5,7-tetramethylcyclotetrasiloxane.
This composition was poured into a mold formed from glass plates to generate a thickness of 2 mm, and was then heated at 150° C. for 5 hours, thus yielding a cured product.
The performance of the cured products obtained in each of the above reference examples was evaluated using the following techniques.
The external appearance of each cured product was inspected visually. The results are shown in Table 1.
The hardness (Shore D) of each cured product was measured in accordance with ASTM D 2240. The results of the measurements are shown in Table 1.
Each of the resin compositions obtained in the reference examples was poured into a PPA cup containing an LED chip that had been wire bonded with gold wire, and was subsequently cured by heating at 100° C. for 1 hour and then at 150° C. for a further 5 hours. Using a thermal shock tester, the resulting structure was subjected to 100 cycles of a thermal shock test, with each cycle consisting of 30 minutes at −40° C. and then 30 minutes at 100° C., and the structure was then inspected for cracking. The results are shown in Table 1, using the evaluation criteria shown below.
A: No anomalies
B: Micro-cracks around the wiring portion
C: Cracking around the wiring portion and the chip portion
D: Cracks exist throughout the entire encapsulating resin, or the resin may suffer detachment
The light transmittance at 400 nm of the 2 mm thick cured product prepared in each of the reference examples was measured, the cured product was then left to stand for 240 hours at 150° C., and the light transmittance at 400 nm was then re-measured. The measurement results are shown in Table 1.
The cured products obtained from the compositions containing a polycyclic hydrocarbon group-containing organosilicon compound of the example 1 were colorless and transparent, exhibited a high degree of hardness, and also offered superior crack resistance and light transmittance. Furthermore, the cured products also exhibited excellent resistance to heat and coloration, and are particularly suited to use as all manner of optical materials and encapsulating materials.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2007-122486 | May 2007 | JP | national |
