Claims
- 1. An improved low profile additive molding composition comprising
- (a) a thermosetting polyester resin,
- (b) from about 25 to 70 weight percent of a first crosslinkable vinyl monomer that is crosslinkable with the polyester resin,
- (c) from about 1 to 25 weight percent of a thermoplastic low profile additive for shrinkage control,
- (d) an effective amount of a second crosslinkable vinyl monomer having a reactivity ratio with styrene of greater than 1, and
- (e) from 1 to 25 weight percent of a thermosetting epoxy compound containing at least one 1,2-epoxy group per molecule, said epoxy compound being selected from the group consisting of
- (1) 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate,
- (2) 3-(3,4-epoxycyclohexane)-8,9-epoxy-2,4,-dioxaspiro[5.5]-undercane,
- (3) bis(3,4-epoxy-cyclohexylmethyl)adipate, ##STR9## all weights being based on the combined weight of components (a), (b), and (c).
- 2. Composition claimed in claim 1 wherein the second vinyl monomer has a reactivity ratio with styrene of greater than 5.
- 3. Composition claimed in claim 1 wherein the second vinyl monomer has a reactivity ratio with styrene of greater than 20.
- 4. Composition claimed in claim 1 wherein the second vinyl monomer is vinyl acetate.
- 5. Composition claimed in claim 1 wherein the second vinyl monomer is vinyl stearate.
- 6. Composition claimed in claim 1 wherein the second vinyl monomer is vinyl norbornene.
- 7. Composition claimed in claim 1 wherein the second vinyl monomer is dicyclopentadiene.
- 8. Composition claimed in claim 1 wherein the second vinyl monomer is butyl vinyl ether.
- 9. Composition claimed in claim 1 wherein the second vinyl monomer is diallyl phthalate.
- 10. Composition claimed in claim 1 wherein the second vinyl monomer has the formula: ##STR10##
- 11. Composition claimed in claim 1 containing a thickening amount of a chemically active thickening agent.
- 12. Composition claimed in claim 11 wherein the thickening agent is magnesium oxide.
- 13. Composition claimed in claim 1 wherein the low profile additive is a polyvinyl acetate.
- 14. Composition claimed in claim 11 containing a carboxylated polyvinyl acetate low profile additive.
- 15. Composition claimed in claim 1 containing a reinforcing filler.
- 16. Composition claimed in claim 15 wherein the reinforcing filler is glass fiber.
- 17. Composition claimed in claim 1 containing a rubber or elastomer.
- 18. A molded article produced from the composition of claims 1 or 11 or 13 or 15 or 16 or 17.
- 19. An improved low profile additive molding composition comprising
- (a) a thermosetting polyester resin,
- (b) from about 25 to 70 weight percent of a first crosslinkable vinyl monomer that is crosslinkable with the polyester resin,
- (c) from about 1 to 25 weight percent of a thermoplastic low profile additive for shrinkage control,
- (d) an effective amount of a second crosslinkable vinyl monomer having a reactivity ratio with styrene of greater than 1, and
- (e) from 1 to 25 weight percent of a thermosetting epoxy compound containing at least one 1,2-epoxy group per molecule, said epoxy compound being selected from the group consisting of
- (a) epoxidized pentaerythritol tetratallate,
- (b) epoxidized soy bean oil,
- (c) octyl epoxytallate, and
- (d) epoxidized linseed oil, all weights being based on the combined weight of components (a), (b) and (c).
Parent Case Info
This application is a continuation of prior U.S. application Ser. No. 706,908, filing date 3/1/85, which is a continuation of application Ser. No. 237,697, filing date 2/24/81, now both abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
55-118912 |
Sep 1980 |
JPX |
Non-Patent Literature Citations (2)
Entry |
Encyclopedia of Polymer Science and Technology, pp. 209-216, vol. 6, 1967. |
J. Brandrup et al, Polymer Handbook, 2nd ed, p. II-319, John Wiley & Sons, New York, (1975). |
Continuations (2)
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Number |
Date |
Country |
Parent |
706908 |
Mar 1985 |
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Parent |
237697 |
Feb 1981 |
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