Claims
- 1. A heat sealable packaging film producing a peelable seal formed from a blend, the blend comprising:(A) about 99 to about 75 weight percent of a copolyester comprising: i. diacid residues of at least about 50 mole percent terephthalic acid, naphthalenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, or mixtures thereof; and ii. diol residues of about 90 to about 35 mole percent ethylene glycol and about 10 to about 65 mole percent of at least one of diethylene glycol or 1,4-cyclohexanedimethanol; and (B) about 1 to about 25 weight percent of an impact modifying polymer selected from copolymers and terpolymers having the respective general formulas E/Y and E/X/Y wherein: X represents residues derived from wherein R1 is alkyl of up to about 8 carbon atoms and R2 is hydrogen, methyl, or ethyl, and X constitutes about 1 to about 30 weight percent of terpolymer E/X/Y; Y represents residues derived from glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether or 3,4-epoxy-1-butene, and Y constitutes about 0.5 to about 10 weight percent of copolymer E/Y and terpolymer E/X/Y; and E represents ethylene residues that constitute the remainder of the copolymer or terpolymer; wherein copolyester component A is based on 100 mole percent diacid residues and 100 mole percent diol residues and the weight percentages are based on the total weight of components A and B.
- 2. The film of claim 1 wherein the impact modifying polymer is a copolymer comprising about 99.5 to about 90 weight percent ethylene and about 0.5 to about 10 weight percent glycidyl methacrylate or a terpolymer comprising about 98 to about 60 weight percent ethylene, about 1 to about 30 weight percent alkyl acrylate, and about 1 to about 10 weight percent glycidyl methacrylate.
- 3. The film of claim 1 wherein component A, the diacid residues comprise at least 80 mole percent terephthalic acid, naphthalene-dicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, or mixtures thereof.
- 4. The film of claim 1 wherein said film is heat sealable to a surface at temperatures from about 85 to about 200° C.
- 5. The film of claim 1 wherein said film is heat sealable to a surface at temperatures from about 100 to about 150° C.
- 6. The film of claim 1 wherein said film is heat sealable to itself and polyesters.
- 7. The film of claim 1 wherein component B is present in an amount of about 2 to about 10 weight percent.
- 8. The film of claim 1 wherein the ethylene copolymers and terpolymers have a melt index of about 1 to about 20 grams per 10 minutes measured at 190° C. with 2.16 kilogram weight according to ASTM D1238.
- 9. A multi-layer packaging structure comprising at least two dissimilar films, at least one of the external surfaces of the structure being made from a first film comprising the heat sealable packaging film of claim 1.
- 10. The packaging structure of claim 9 wherein the first film has a thickness from about 0.1 mil (0.0025 mm) to about 10 mils (0.25 mm).
- 11. The packaging structure of claim 10 wherein the first film has a thickness from about 0.1 mil (0.0025 mm) to about 10 mils (0.25 mm) and the second film has a thickness of about 0.5 mil (0.0125 mm) to about 40 mils (1.0 mm).
- 12. The packaging structure of claim 9 having a total thickness of about 5 mils (0.125 mm) to about 20 mils (0.5 mm).
- 13. The packaging structure of claim 9 wherein a second film is selected from polyesters, polyvinyl chloride, and polyolefins.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of application Ser. No. 09/243,317 filed Feb. 2, 1999, abandoned.
US Referenced Citations (55)
Non-Patent Literature Citations (1)
Entry |
Research Disclosure No. 36825, Dec., 1994, p. 678, “Copolyester Blends for Use in Peelable Seal Applications”. |