1. Field of the Invention
The present invention relates to a manifold polygonal sheet package structure, and more particularly to packaging for a liquid crystal panel module.
2. Description of Related Art
In the electronic industry, the production and assembly electronic products require complex supply chain to support. Typically, electronic products are produced and fabricated in different places. After transportation, the electronic products are delivery to the assembly plant together for assembly. In the field of liquid crystal display (LCD), an LCD module is a core component of an LCD. During the transportation process, the package of the LCD module should be reliable. However, the traditional packaging method can not sustain an external pressure well such that the LCD modules which are multilayer stacked generate a deformation. The use of the LCD modules will be affected and generates unnecessary loss to the company. As a result, providing a packaging box capable of resisting an external force and impact is particularly necessary.
The conventional packaging box for LCD modules is shown in
A conventional large packaging box for the LCD modules is shown in
A China patent, CN203033205U, discloses a packaging basket which includes a bottom box formed by surrounding and folding three section plates, and a top cover engaged with the bottom box. The packaging basket is convenient for engaging and sealing, fast, recyclable, and reducing the waste of resources.
Although to some extent, the conventional packaging technology provides a reliable way to solve packaging problems, but there are still some drawbacks:
(1) The price of the buffer material is higher, which increases the packaging costs. The material of the buffer material is a foamed polyethylene. Therefore, the buffer material is soft. After an external is applied, the buffer material is easily to be compressed so as to generate a large deformation. In order to reduce the risk of the collision of the LCD modules, the thickness of the buffer material is very thick. As a result, the material is consumed and the space is occupied by the buffer material such that the number of the LCD modules that can be installed into the packaging box is reduced so as to greatly increase the packaging cost.
(2) The anti-pressure strength and the anti-impact performance are inversely proportional to the number of the LCD modules installed. When a packaging box has better anti-pressure strength and the anti-impact performance, the number of the LCD modules installed inside is usually less. Generally, the number of the LCD modules installed inside is less than 10 pieces. When the number of the LCD modules installed inside is increased, supporting members are added inside the packaging box to increase anti-pressure strength. As a result, for an operator, the operation process is increased, which is not conducive to improve efficiency and also increases the packaging cost.
(3) The conventional large packaging box is big in size. The LCD modules installed inside are not easy to take out. The LCD modules closed to the edge of the conventional large packaging box is easily to take out. The LCD modules located at the center of the large packaging box is harder to take out because those LCD modules are far away from an operator.
The technology problem solved by the present invention is to provide a polygonal packaging structure having features of low packaging cost, high anti-pressure strength, good anti-impact performance, and capable of receiving more LCD modules. At the same time, the polygonal packaging structure also has beneficial effects of safe for packing, reliable and convenient operation.
The polygonal packaging structure is used for packaging a piece-shaped object, and comprising: a bottom buffer seat located at a bottom of the polygonal packaging structure, wherein, the bottom buffer seat is provided with multiple receiving slots, and the multiple receiving slots are arranged radially from a center to an edge; and a top buffer cover located at a top of the polygonal packaging structure, wherein, the top buffer cover is provided with multiple fixing slots corresponding to the multiple receiving slots.
Wherein, the bottom buffer seat comprises a buffer pad and a bottom seat; the top buffer cover comprises a buffer cover and a top cover; a case body is disposed between the bottom buffer seat and the top buffer cover.
Wherein, the buffer pad and the bottom seat are both polygonal; the buffer pad is installed at the interior of the bottom seat.
Wherein, the buffer cover and the top cover are both polygonal; the buffer cover is installed at the interior of the top cover.
Wherein, an upper end and a lower end of the case body are respectively installed at the buffer cover and the buffer pad.
Wherein, the case body is an enclosed-tubular-polygonal wall formed integrally; multiple ridges are formed on the wall for supporting.
Wherein, the number of the ridges is greater than 4, and is an even number.
Wherein, each of the receiving slots has a first start terminal and a first end terminal; the first start terminal is closed to a center of the buffer pad, and the first end terminal is closed to an edge of the buffer pad.
Wherein, each of the fixing slots is provided with a second start terminal and a second end terminal; the second start terminal is closed to a center of the buffer cover, and the second end terminal is closed to an edge of the buffer cover.
Beneficial effects of the present invention:
(1) Safe, Reliable, Convenient Operation, Low Cost of Packaging.
In the polygonal packaging structure of the present invention, the receiving slots arranged radially on the buffer pad are used for fixing the LCD modules, and the upper end of the LCD modules utilizes the corresponding buffer cover for fixing more securely. The buffer pad and cover both have a buffer and protection function. During the transportation process, the buffer pad and cover both generate a protection function. At the same time, the receiving slots arranged radially from the center of the buffer pad to the edge of the buffer pad. A distance between each LCD module and the edge of the buffer pad is equal. The operator is easily to install and remove. Besides, the polygonal packaging structure can be folded to store along the ridges in order to save the space. The polygonal packaging structure can be recycled so as to reduce the packaging cost.
(2) High Anti-Pressure Strength, Good Anti-Impact Performance.
In the polygonal packaging structure of the present invention, the case body using the polygonal wall has a better anti-pressure strength and anti-impact performance. From physical knowledge, the anti-pressure strength of a ridge formed by two side walls intersected is stronger. When the ridges are increased, the anti-pressure strength is stronger. The corner of the case body has a better anti-impact performance comparing to a flat surface. Because the number of the ridges and corners of the polygonal case body is greater than the conventional packaging box, the polygonal case body has a better anti-pressure strength and anti-impact performance.
(3) Capable of Receiving More LCD Modules.
In the polygonal packaging structure of the present invention, the receiving slots are arranged radially and along the circumference such that the polygonal packaging structure can receive more LCD modules than the conventional packaging box in order to increase the space utilization.
The following content combines with the drawings and the embodiment for describing the present invention in detail.
With reference to
With reference to
The buffer cover 140 is provided with multiple fixing slots 141. The multiple fixing slots 141 are arranged radially for fixing the LCD modules more securely and providing a supporting-buffering-protection function. Wherein, each of the fixing slots 141 is provided with a second start terminal 1411 and a second end terminal 1412. The second start terminal 1411 is closed to a center of the buffer cover 140, and the second end terminal 1412 is closed to an edge of the buffer cover 140. The fixing slots are arranged radially from the center of the buffer cover 140 to the edge of the buffer cover 140. The arrange direction of the fixing slots 141 corresponds to the arrange location of the circumference installed with the LCD modules.
The case body 130 is an enclosed-tubular-polygonal wall formed integrally. Multiple ridges 131 are formed on the wall for supporting. In general, the number of the ridges 131 is greater than 4 and is an even number. In this embodiment, the number of the ridges is 8. In the transportation process of the case body 130, the case body 130 can be folded to store along the ridges 131 in order to save the space as shown in
With reference to
With reference to
In summary, the polygonal packaging structure provided by the present invention, through the fixing and protection function of the buffer pad, and the fixing and supporting function of the buffer cover to achieve the safe-protection function for the LCD modules. Because the polygonal design, the packaging box can receive more LCD modules. At the same time, the polygonal packaging structure also provides a better anti-pressure strength and anti-impact performance in order to ensure the reliability in the transportation process. Finally, the case body is foldable and can be stored so as to save the space, increase recycling-reuse rate, and decrease the packaging cost.
It should be noted that, herein, relational terms such as first and second, and the like are only used to distinguish one entity or operation from another entity or operation. It is not required or implied that these entities or operations exist any such relationship or order between them. Moreover, the terms “comprise,” include,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a series of elements including the process, method, article or device that includes not only those elements but also other elements not expressly listed or further comprising such process, method, article or device inherent elements. Without more constraints, by the statement “comprises one” element defined does not exclude the existence of additional identical elements in the process, method, article, or apparatus.
The above embodiments of the present invention are not used to limit the claims of this invention. Any use of the content in the specification or in the drawings of the present invention which produces equivalent structures or equivalent processes, or directly or indirectly used in other related technical fields is still covered by the claims in the present invention.
Number | Date | Country | Kind |
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201410441340.8 | Sep 2014 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2014/085873 | 9/3/2014 | WO | 00 |