Patent Application
20250163218
The present invention relates to a polyimide precursor for a display substrate which has a long charge half-life and a low charge decay ratio after 120 seconds in measurement of the charge half-life, can contribute to a suppression in charge up, and can achieve high adhesion, a polyimide film for a display substrate formed from this, and a display substrate.
Polyimides, which have excellent heat resistance, solvent resistance (chemical resistance), mechanical properties, electrical properties, and the like, are widely used in applications to electrical and electronic devices, such as flexible wiring substrates and tape automated bonding (TAB) tapes. For example, polyimides prepared from an aromatic tetracarboxylic dianhydride and an aromatic diamine, particularly, a polyimide prepared from 3,3′,4,4′-biphenyltetracarboxylic dianhydride and paraphenylenediamine is suitably used.
Moreover, polyimides have been examined as an alternative to glass substrates in the display device field. By replacing glass substrates by plastic substrates made of polyimide in display substrates used in a variety of display devices, displays which have light weight and high flexibility and can be bent or rolled can be provided.
For example, Patent Document 1 proposes a method using a polyimide precursor containing a specific unit structure as a polyimide precursor applicable to display substrate applications.
In polyimide films used in display substrate applications, to obtain sufficient gas barrier properties, usually, these polyimide films are used in the state where an inorganic gas barrier layer made of SiOx or the like is formed on their surfaces. On the other hand, use of polyimide films in display substrate applications has a problem of charge up caused by charges accumulated at an interface between the polyimide film and the inorganic gas barrier layer, in which charge up causes a slight amount of current to flow in a switching element or the like, thereby causing an afterglow on a display.
The present inventors, who have conducted extensive research about this problem, have found that when a certain proportion of an acidic group is contained in a polyimide film, a long charge half-life and a low charge decay ratio after 120 seconds in measurement of the charge half-life can be achieved, and thus cancellation of charge accumulation at the interface between a polyimide film and an inorganic gas barrier layer is promoted, which contributes to a suppression in charge up, and have completed the present invention.
The present inventors, who have conducted extensive research, have also found that high adhesion can be achieved by use of such a configuration.
Specifically, the present invention provides [1] to [8] below.
where in General Formula (1), X1 is a tetravalent aromatic or aliphatic group, Y1 is a divalent aromatic group, R1 and R2 are each independently a hydrogen atom, a C1 to C6 alkyl group, or a C3 to C9 alkylsilyl group.
The present invention provides a polyimide precursor for a display substrate which has a long charge half-life and a low charge decay ratio after 120 seconds in measurement of the charge half-life, can contribute to a suppression in charge up, and can achieve high adhesion.
The polyimide precursor for a display substrate according to the present invention is a polyimide precursor for forming a polyimide film for a display substrate, and is a polyimide precursor having a structural unit represented by General Formula (1) below, wherein the polyimide precursor containing a group contains an acidic group as at least part of a group represented by X1 in General Formula (1), a group represented by Y1 in General Formula (1), and a terminal group, and
where in General Formula (1), X1 is a tetravalent aromatic or aliphatic group, Y1 is a divalent aromatic group, R1 and R2 are each independently a hydrogen atom, a C1 to C6 alkyl group, or a C3 to C9 alkylsilyl group.
In General Formula (1), X1 is a residue of a tetracarboxylic acid from which four COOH groups are removed (i.e., a residue of a tetracarboxylic dianhydride from which two carboxylic anhydride groups (CO)2O are removed), and Y1 is a residue of a diamine from which two NH2 groups are removed. R1 and R2 are preferably a hydrogen atom or a C3 to C9 alkylsilyl group, and are more preferably a hydrogen atom.
Examples of the structural unit represented by General Formula (1) above include those obtained by reacting a tetracarboxylic acid component with a diamine component to form amido bonds (—CONH—).
Examples of the tetracarboxylic acid component include aromatic tetracarboxylic dianhydrides, aliphatic tetracarboxylic dianhydrides, and the like.
Specific examples of aromatic tetracarboxylic dianhydrides include 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA), pyromellitic dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic dianhydride, diphenylsulfone-3,4,3′,4′-tetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride (another name: 4,4′-(hexafluoroisopropylidene)diphthalic anhydride), 2,3,3′,4′-benzophenonetetracarboxylic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl) propane dianhydride, p-phenylenebis(trimellitic acid monoester acid anhydride), p-biphenylenebis(trimellitic acid monoester acid anhydride), m-terphenyl-3,4,3′,4′-tetracarboxylic dianhydride, p-terphenyl-3,4,3′,4′-tetracarboxylic dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis[(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 4,4′-(2,2-hexafluoroisopropylidene)diphthalic dianhydride, and the like. These may be used alone or as a mixture thereof.
The aliphatic tetracarboxylic dianhydrides suitably used are alicyclic tetracarboxylic dianhydrides. Specific examples of such alicyclic tetracarboxylic dianhydrides include (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride, cis,cis,cis-1,2,4,5-cyclohexanetetracarboxylic dianhydride, (1S,2S,4R,5R)-cyclohexanetetracarboxylic dianhydride, (1R,2S,4S,5R)-cyclohexanetetracarboxylic dianhydride, bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride, bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, 4-(2,5-dioxotetrahydrofuran-3-yl)-tetralin-1,2-dicarboxylic anhydride, tetrahydrofuran-2,3,4,5-tetracarboxylic dianhydride, bicyclo-3,3′,4,4′-tetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride (hereinafter, also referred to as “CBDA” in some cases), 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,4-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride, pentacyclo[8.2.1.14,7.02,9.03,8]tetradecane-5,6,11,12-tetracarboxylic dianhydride, 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, cyclohex-1-ene-2,3,5,6-tetracarboxylic dianhydride, bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic dianhydride, and the like. These may be used alone or as a mixture thereof.
As tetracarboxylic acid compounds as the tetracarboxylic acid component, acid dianhydrides selected from the group consisting of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA), pyromellitic dianhydride (PMDA), 4,4′-oxydiphthalic dianhydride (ODPA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA), 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride (6-FDA), and 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA) are preferred, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) is more preferred.
Examples of diamine compounds as the diamine component include aromatic diamines having an aromatic group, such as 4,4′-diaminodiphenyl ether, 2,2′-dimethylbenzidine, 4,4′-diaminodiphenylmethane, 4,4′-diamino-1,2-diphenylethane, p-phenylenediamine (PPD), m-phenylenediamine, 2,4-diaminotoluene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, m-xylylenediamine, p-xylylenediamine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4′-methylenebis(2,6-xylidine), α,α′-bis(4-aminophenyl)-1,4-diisopropylbenzene, 2,2′-dimethyl-4,4′-aminobiphenyl, 3,3′-dimethyl-4,4′-aminobiphenyl, and 2,2′-ethylenedianiline; alicyclic diamines having an alicyclic structure, such as 1,4-diaminocyclohexane, 1,4-diamino-2-methylcyclohexane, 1,4-diamino-2-ethylcyclohexane, 1,4-diamino-2-n-propylcyclohexane, 1,4-diamino-2-isopropylcyclohexane, 1,4-diamino-2-n-butylcyclohexane, 1,4-diamino-2-isobutylcyclohexane, 1,4-diamino-2-sec-butylcyclohexane, 1,4-diamino-2-tert-butylcyclohexane, 1,2-diaminocyclohexane, 1,3-diaminocyclobutane, 1,4-bis(aminomethyl)cyclohexane, 1,3-bis(aminomethyl)cyclohexane, diaminobicycloheptane, diaminomethylbicycloheptane, diaminooxybicycloheptane, diaminomethyloxybicycloheptane, isophoronediamine, diaminotricyclodecane, diaminomethyltricyclodecane, bis(aminocyclohexyl)methane, bis(aminocyclohexyl)isopropylidene, 6,6′-bis(3-aminophenoxy)-3,3,3′,3′-tetramethyl-1,1′-spirobiindane, and 6,6′-bis(4-aminophenoxy)-3,3,3′,3′-tetramethyl-1,1′-spirobiindane; fluorine-based diamines containing a fluorine atom, such as 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl, 2,2′-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 2,3,5,6-tetrafluoro-1,4-diaminobenzene, 2,4,5,6-tetrafluoro-1,3-diaminobenzene, 2,3,5,6-tetrafluoro-1,4-benzene(dimethaneamine), 2,2′-difluoro-(1,1′-biphenyl)-4,4′-diamine, 2,2′,6,6′-tetrafluoro-(1,1′-biphenyl)-4,4′-diamine, 4,4′-diaminooctafluorobiphenyl, 2,2-bis(4-aminophenyl)hexafluoropropane, 4,4′-oxybis(2,3,5,6-tetrafluoroaniline), 3,3′-bis(trifluoromethyl)-4,4′-diaminobiphenyl, 4,4′-diamino-2,2′-bis(trifluoromethyl)diphenyl ether, 1,4-bis[4-amino-2-(trifluoromethyl)phenoxy]benzene, 2,2-bis[4-[4-amino-2-(trifluoromethyl)phenoxy]hexafluoropropane, 3,5-diaminobenzene trifluoride, and 4,4-diamino-2-(trifluoromethyl)diphenyl ether; ester bond-containing diamines such as 4-aminophenyl 4-aminobenzoate and bis(4-aminophenyl) terephthalate; and the like. These may be used alone or as a mixture thereof.
As the diamine compounds as the diamine component, 4,4′-diaminodiphenyl ether, 2,2′-dimethylbenzidine, 4,4′-diaminodiphenylmethane, 4,4′-diamino-1,2-diphenylethane, p-phenylenediamine (PPD), and 2,2-bis[4-(4-aminophenoxy)phenyl]propane are preferred, and p-phenylenediamine (PPD) is more preferred.
In the polyimide precursor according to the present invention, a group containing an acidic group is contained as at least part of the group represented by X1 in General Formula (1) above, the group represented by Y1 in General Formula (1) above, and the terminal group, and the acidic group content ratio is 15×10−3 or more. The acidic group content ratio is preferably 16×10−3 or more, more preferably 18×10−3 or more, still more preferably 20×10−3 or more. When the acidic group is contained in such a content ratio, a polyimide film formed from the polyimide precursor according to the present invention can contain a predetermined amount of the acidic group, which can increase the charge half-life and reduce the charge decay ratio after 120 seconds, which can contribute to a suppression in charge up and can achieve high adhesion. The charge half-life and the charge decay ratio after 120 seconds can be determined by measurement of the charge half-life in accordance with JIS L 1094A.
The acidic group content ratio can be determined from the following equation:
acidic group content ratio={(molar amount of acidic group-containing monomer used to form polyimide precursor)×(the number of acidic groups per molecule of acidic group-containing monomer)}÷(molar amount of total monomers forming polyimide precursor)
Here, in the case where a plurality of acidic group-containing monomers each having a different number of acidic groups per molecule is used, the acidic group content ratio of each acidic group-containing monomer may be calculated from the above equation according to the proportion of these acidic group-containing monomers used, and may be used. Moreover, for the tetracarboxylic acid, it is assumed that among the acidic groups in one molecule, four carboxylic acids are reacted with a diamine during polymerization, and are no longer left as the acidic groups when polyimide is prepared. Thus, the number of acidic groups in calculation of the acidic group amount is calculated using a numeric value obtained by subtracting 4 from the number of acidic groups (including acid anhydride groups) in one molecule of the tetracarboxylic acid. In other words, the acidic group content ratio is calculated based on the number of free carboxyl groups which do not contribute to formation of imide bonds. For example, 3,3′,4,4′-biphenyltetracarboxylic dianhydride has only four carboxyl groups, all of which contribute to formation of imide bonds. Thus, the number of acidic groups is zero in calculation of the acidic group content ratio. While mellitic acid can be in a mixed state of those without an anhydride group, those having one anhydride group, and those having two anhydride groups, typically, four of six carboxyl groups constituting mellitic acid are used to form imide bonds, and two free carboxyl groups are left after the polyimide precursor or the polyimide film is formed. Thus, for mellitic acid, the acidic group content ratio can be calculated where the number of carboxyl groups as the acidic group is considered as two.
Examples of the acidic group include, but are not particularly limited to, a carboxyl group (—COOH), a sulfonic acid group (—SO3H), a phosphonic acid group (—PO3H2), and the like. Among these, a carboxyl group and a sulfonic acid group are preferred because they can further increase the charge half-life and further reduce the charge decay ratio after 120 seconds, which results in a higher effect of suppressing charge up. Here, the acidic group may be one hydrolyzed to form an acidic group not esterified or the like.
The group represented by X1 in General Formula (1) above containing a group containing an acidic group can be formed by any method, and examples thereof include a method using a specific tetracarboxylic acid compound as at least part of the tetracarboxylic acid component. Examples of such a specific tetracarboxylic acid compound include compounds having an acidic group such as a carboxyl group other than the carboxyl groups constituting —COOR1, —COOR2, and two amido bonds (—CONH—) in General Formula (1) above (hereinafter, referred to as tetracarboxylic acid compounds having an acidic group). In other words, the tetracarboxylic acid compound having an acidic group is a compound having, in addition to the tetracarboxylic acid structure which contributes to the imidization reaction, an acidic group which does not contribute to an imidization reaction.
Specific examples of the tetracarboxylic acid compound having an acidic group include compounds having a carboxyl group as the acidic group, such as mellitic acid, mellitic anhydride, mellitic acid methyl ester, mellitic acid dimethyl ester, mellitic acid trimethyl ester, mellitic acid ethyl ester, mellitic acid diethyl ester, mellitic acid triethyl ester, mellitic acid propyl ester, mellitic acid dipropyl ester, mellitic acid tripropyl ester, mellitic acid butyl ester, mellitic acid dibutyl ester, mellitic acid tributyl ester, mellitic acid phenyl ester, mellitic acid diphenyl ester, mellitic acid triphenyl ester, and the like. These may be used alone or as a mixture thereof. Among these, mellitic acid and mellitic anhydride are preferred.
Although the amount of the tetracarboxylic acid compound having an acidic group used can be appropriately selected according to the amount of the acidic group contained in the polyimide precursor, the amount is preferably 1 mol % or more, more preferably 2 mol % or more, preferably 70 mol % or less, more preferably 60 mol % or less, still more preferably 50 mol % or less, further still more preferably 10 mol % or less, particularly preferably 6 mol % or less in 100 mol % of the total amount of the tetracarboxylic acid component.
The group represented by Y1 in General Formula (1) above containing a group containing an acidic group can be formed by any method, and examples thereof include a method using an acidic group-containing diamine compound as at least part of the diamine component. Such an acidic group-containing diamine compound can be a compound having an acidic group such as a carboxyl group in addition to the diamine structure, and examples of such compounds having a carboxyl group as the acidic group include 3,5-diaminobenzoic acid (3,5-DABA), 5,5′-methylenebis(2-aminobenzoic acid), 3,3′-diamino-4,4′-dicarboxybiphenyl, 4,4′-diamino-3,3′-dicarboxydiphenylmethane, 3,3′-diamino-4,4′-dicarboxydiphenylmethane, 2,2-bis[4-(4-amino-3-carboxyphenyl)phenyl]propane, and the like. Examples of compounds having a sulfonic acid group as the acidic group include 1,4-phenylenediamine-2-sulfonic acid, 1,3-phenylenediamine-2-sulfonic acid, 3,5-diamino-2,4,6-trimethylbenzenesulfonic acid, and 4,4′-diaminostilbene-2,2′-disulfonic acid, 4,4′-bis(4-aminophenoxy)biphenyl-3,3′-disulfonic acid, and the like. These may be used alone or as a mixture thereof. Among these, the compound having a carboxyl group as the acidic group is preferably 3,5-diaminobenzoic acid (3,5-DABA), and the compounds having a sulfonic acid group as the acidic group are preferably 1,4-phenylenediamine-2-sulfonic acid and 1,3-phenylenediamine-2-sulfonic acid.
Although the amount of the acidic group-containing diamine compound used can be appropriately selected according to the amount of the acidic group contained in the polyimide precursor, the amount is preferably 2 mol % or more, more preferably 3 mol % or more, still more preferably 4 mol % or more, preferably 70 mol % or less, more preferably 60 mol % or less, still more preferably 50 mol % or less, further still more preferably 10 mol % or less, particularly preferably 6 mol % or less in 100 mol % of the total amount of the diamine component.
The terminal group containing a group containing an acidic group can be formed by any method, and examples thereof include a method of relacing part of the tetracarboxylic acid component by a dicarboxylic acid compound having an acidic group or a dicarboxylic anhydride compound having an acidic group. The dicarboxylic acid compound having an acidic group is a compound having, in addition to the dicarboxylic acid structure which contributes to the imidization reaction, an acidic group which does not contribute to an imidization reaction other than the carboxyl groups constituting the dicarboxylic acid structure. The dicarboxylic anhydride compound having an acidic group is a compound having, in addition to the dicarboxylic anhydride structure which contributes to the imidization reaction, an acidic group which does not contribute to an imidization reaction other than the carboxyl groups constituting the dicarboxylic anhydride structure.
Examples of the dicarboxylic acid compound having an acidic group or the dicarboxylic anhydride compound having an acidic group include compounds having a carboxyl group as the acidic group, such as trimellitic acid, trimellitic anhydride, hemimellitic acid, hemimellitic anhydride, and the like. Examples of compounds having a sulfonic acid group as the acidic group include 3-sulfophthalic acid, 4-sulfophthalic acid, 3-sulfophthalic anhydride, 4-sulfophthalic anhydride, and the like. These may be used alone or as a mixture thereof. Among these, compounds having a carboxyl group as the acidic group are preferred, and trimellitic anhydride is preferred.
Although the amount of the dicarboxylic acid compound having an acidic group or the dicarboxylic anhydride compound having an acidic group used can be appropriately selected according to the amount of the acidic group contained in the polyimide precursor, the amount thereof in terms of the tetracarboxylic acid is preferably 1 mol % or more, more preferably 1.5 mol % or more, still more preferably 2 mol % or more, preferably 35 mol % or less, more preferably 30 mol % or less, still more preferably 25 mol % or less, particularly preferably 5 mol % or less in 100 mol % of the total of the tetracarboxylic acid component, the dicarboxylic acid compound having an acidic group, and the dicarboxylic anhydride compound having an acidic group, and the amount thereof in terms of the compound is preferably 2 mol % or more, more preferably 3 mol % or more, still more preferably 4 mol % or more, preferably 70 mol % or less, more preferably 60 mol % or less, still more preferably 50 mol % or less, further still more preferably 10 mol % or less, particularly preferably 6 mol % or less in 100 mol % of the total of the tetracarboxylic acid component, the dicarboxylic acid compound having an acidic group, and the dicarboxylic anhydride compound having an acidic group. Note that the dicarboxylic acid compound having an acidic group and the dicarboxylic anhydride compound having an acidic group have a dicarboxylic acid structure but not the tetracarboxylic acid structure as the structure which contributes to the imidization reaction. Thus, the amount added in terms of tetracarboxylic acid is usually a half of the amount added in terms of the compound.
In addition, a group represented by General Formula (2) below may be contained as a group represented by Y1 in General Formula (1):
where in General Formula (2), R3, R4, R5, and R6 are each independently a hydrogen atom, an optionally substituted C1 to C12 alkyl group, or an optionally substituted C6 to C12 aryl group.
When the group represented by General Formula (2) is contained, the charge half-life can be further increased and the charge decay ratio after 120 seconds can be further reduced, which can further improve the effect of suppressing charge up.
Examples of the method for allowing the group represented by General Formula (2) to be contained as a group represented by Y1 in General Formula (1) include a method using a triazine structure-containing diamine compound represented by General Formula (3) below as at least part of the diamine component.
In General Formula (3), R3, R4, R5, and R6 are as defined in General Formula (2) above.
In General Formulae (2) and (3), R3, R4, and R5 are each independently a hydrogen atom, an optionally substituted C1 to C12 alkyl group, or an optionally substituted C6 to C12 aryl group, preferably a hydrogen atom, a non-substituted C1 to C12 alkyl group, or a non-substituted C6 to C12 aryl group, more preferably a hydrogen atom or a non-substituted C1 to C4 alkyl group, still more preferably a hydrogen atom.
In General Formulae (2) and (3), R6 is a hydrogen atom, an optionally substituted C1 to C12 alkyl group, or an optionally substituted C6 to C12 aryl group, preferably a hydrogen atom, a non-substituted C1 to C12 alkyl group, or a non-substituted C6 to C12 aryl group, more preferably a hydrogen atom or a non-substituted C6 to C12 aryl group, still more preferably a phenyl group.
Specific examples of the triazine structure-containing diamine compound represented by General Formula (3) above include 2,4-bis(3-aminoanilino)-6-anilino-1,3,5-triazine (p-ATDA), 2,4-bis(3-aminoanilino)-6-benzylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-naphthylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-biphenylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-diphenylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-dibenzylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-dinaphthylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-N-methylanilino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-N-methylnaphthylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-methylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-ethylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-dimethylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-diethylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-dibutylamino-1,3,5-triazine, 2,4-bis(3-aminoanilino)-6-amino-1,3,5-triazine, and the like. These may be used alone or as a mixture thereof. Among these, 2,4-bis(3-aminoanilino)-6-anilino-1,3,5-triazine (p-ATDA) is preferred. Use of 2,4-bis(3-aminoanilino)-6-anilino-1,3,5-triazine (p-ATDA) enables introduction of the group represented by Formula (4) below as Y1 in General Formula (1) above.
The triazine structure-containing diamine compound represented by General Formula (3) above is used in an amount of preferably 50 to 100 mol %, more preferably 70 to 100 mol %, still more preferably 90 to 100 mol % in 100 mol % of the total amount of the diamine component. In other words, the proportion of the structural unit containing the group represented by General Formula (2) in 100 mol % of the group represented by Y1 is preferably 50 to 100 mol %, more preferably 70 to 100 mol %, still more preferably 90 to 100 mol %.
The polyimide precursor according to the present invention can be simply prepared by a traditionally known method, for example. Although the method of preparing the polyimide precursor according to the present invention is not particularly limited, for example, by reacting substantially equimolar amounts of the tetracarboxylic acid component and the diamine component in a solvent at a relatively low temperature of 100° C. or lower, preferably 80° C. or lower to avoid progression or excessive progression of the imidization reaction, the polyimide precursor can be prepared in the state where it is dissolved in the solvent, that is, in the state of a polyimide precursor solution. The polyimide precursor solution thus prepared may contain, in addition to a polyamic acid as a polyimide precursor, a polyimide precursor or polyimide formed as a result of progression of the imidization reaction and partially or completely imidized.
The polymerization temperature for preparing the polyimide precursor according to the present invention is preferably 25° C. or higher and 100° C. or lower, more preferably 40° C. or higher and 80° C. or lower, still more preferably 50° C. or higher and 80° C. or lower. The polymerization time is preferably 0.1 hours or more and 24 hours or less, more preferably 2 hours or more and 12 hours or less. By controlling the polymerization temperature and the polymerization time within the above ranges, a high molecular weight polyimide precursor can be easily prepared with high production efficiency. Although polymerization can also be performed under an air atmosphere, polymerization is suitably performed usually under an inert gas atmosphere, preferably a nitrogen gas atmosphere. The expression “substantially equimolar amounts of the tetracarboxylic acid component and the diamine component” specifically indicates that the molar ratio of these [the total tetracarboxylic acid components/the total diamine components] is 0.90 or more and 1.10 or less, preferably 0.95 or more and 1.05 or less, still more preferably more than 0.98 and 1.04 or less, further still more preferably more than 0.98 and 1.03 or less. In this specification, “substantially equimolar” indicates a molar ratio in the range of more than 0.99 to 1.01, and “equimolar” indicates a molar ratio of 1.00 (significant figure).
When the tetracarboxylic acid component is reacted with the diamine component, usually, a method of adding the diamine component to a polymerization apparatus containing a solvent, and adding the tetracarboxylic acid component after confirming that the diamine component is dissolved can be suitably used.
The solvent used in the reaction of the tetracarboxylic acid component with the diamine component can be any solvent that enables polymerization of the polyimide precursor and can dissolve the polyimide precursor, and may be either a water solvent or an organic solvent. The solvent may be a mixture of two or more solvents, and a mixed solvent of two or more organic solvents or a mixed solvent of water and one or more organic solvents can also be used. Examples of organic solvents include, but not particularly limited to, N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, N-methylcaprolactam, hexamethylphosphorotriamide, 1,2-dimethoxyethane, bis(2-methoxyethyl)ether, 1,2-bis(2-methoxyethoxy)ethane, tetrahydrofuran, bis[2-(2-methoxyethoxy)ethyl]ether, 1,4-dioxane, dimethyl sulfoxide, dimethyl sulfone, diphenyl ether, sulfolane, diphenylsulfone, tetramethylurea, anisole, m-cresol, phenol, y-butyrolactone, and the like. In the present invention, the solvent used in polymerization of the polyimide precursor can be used as it is as the solvent for the polyimide precursor solution when the polyimide film for a display substrate is produced.
Although not particularly limited, the solids concentration of the polyimide precursor in the polyimide precursor solution is preferably 5% by mass or more and 45% by mass or less, more preferably 5% by mass or more and 40% by mass or less, still preferably more than 10% by mass and 30% by mass or less relative to the total amount of the polyimide precursor and the solvent. When the solids concentration is less than 5% by mass, it may take some time and effort to increase the thickness of the film in some cases. When the solids concentration is more than 45% by mass, the solution viscosity may be excessively increased, leading to a necessity for a special film production apparatus in some cases.
The solution viscosity at 30° C. of the polyimide precursor solution used in the present invention is not limited, but is preferably 1000 Pa·sec or less, more preferably 0.5 Pa·sec or more and 500 Pa·sec or less, still more preferably 1 Pa·sec or more and 300 Pa·sec or less, particularly preferably 2 Pa·sec or more and 200 Pa·sec or less because of suitable handling.
The polyimide precursor solution may contain known additives, such as an amine compound, an additive for promoting the imidization reaction, such as a dehydrating agent, an organic phosphorus-containing compound, the above-mentioned filler, a surfactant, a silane coupling agent, and a leveling agent, as needed.
Examples of the amine compound include substituted or non-substituted nitrogen-containing heterocyclic compounds, N-oxide compounds of the nitrogen-containing heterocyclic compounds, substituted or non-substituted amino acid compounds, aromatic hydrocarbon compounds or aromatic heterocyclic compounds having a hydroxyl group, and the like. Specific examples of the imidization catalyst include imidazole derivatives such as 1,2-dimethylimidazole, N-methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 5-methylbenzimidazole, and N-benzyl-2-methylimidazole; substituted pyridine derivatives such as isoquinoline, 3,5-dimethylpyridine, 3,4-dimethylpyridine, 2,5-dimethylpyridine, 2,4-dimethylpyridine, and 4-n-propylpyridine; and the like. Preferably, the amount of the imidization catalyst to be used is 0.01-fold equivalents or more and 2-fold equivalents or less, particularly 0.02-fold equivalents or more and 1-fold equivalents or less relative to amide acid units of the polyamide precursor. Use of the imidization catalyst may improve physical properties of a polyimide film to be obtained, particularly elongation or end tear resistance in some cases.
Examples of other amine compounds include aliphatic tertiary amines such as trimethylamine and triethylenediamine; aromatic tertiary amines such as dimethylaniline; and heterocyclic tertiary amines such as isoquinoline, pyridine, α-picoline, and β-picoline; and the like, and these can be added as needed.
Examples of the dehydrating agent include aliphatic carboxylic anhydrides such as acetic anhydride, propionic anhydride, and butyric anhydride; aromatic carboxylic anhydrides such as benzoic anhydride; and the like.
Examples of the organic phosphorus-containing compound include phosphoric acid esters such as monocaproyl phosphoric acid ester, monooctyl phosphoric acid ester, monolauryl phosphoric acid ester, monomyristyl phosphoric acid ester, monocetyl phosphoric acid ester, monostearyl phosphoric acid ester, monophosphoric acid ester of triethylene glycol monotridecyl ether, monophosphoric acid ester of tetraethylene glycol monolauryl ether, monophosphoric acid ester of diethylene glycol monostearyl ether, dicaproyl phosphoric acid ester, dioctyl phosphoric acid ester, dicapryl phosphoric acid ester, dilauryl phosphoric acid ester, dimyristyl phosphoric acid ester, dicetyl phosphoric acid ester, distearyl phosphoric acid ester, diphosphoric acid ester of tetraethylene glycol mononeopentyl ether, diphosphoric acid ester of triethylene glycol monotridecyl ether, diphosphoric acid ester of tetraethylene glycol monolauryl ether, and diphosphoric acid ester of diethylene glycol monostearyl ether; and amine salts of these phosphoric acid esters. Examples of the amines include ammonia, monomethylamine, monoethylamine, monopropylamine, monobutylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, trimethylamine, triethylamine, tripropylamine, tributylamine, monoethanolamine, diethanolamine, triethanolamine, and the like.
The polyimide film for a display substrate according to the present invention is a product formed from the above-mentioned polyimide precursor for a display substrate.
For example, the polyimide film for a display substrate according to the present invention can be produced by a known method using the above-mentioned polyimide precursor solution (a solution containing the polyimide precursor for a display substrate according to the present invention, which is also referred to as “display substrate formation solution”).
For example, the polyimide film for a display substrate according to the present invention can be produced by a method of applying the polyimide precursor solution onto a support, drying the polyimide precursor solution to form a laminate of the support and the polyimide precursor film, and chemically or thermally imidizing the laminate; a method of applying the polyimide precursor solution onto a support, drying the polyimide precursor solution to form a laminate of the support and the polyimide precursor film, chemically or thermally imidizing the laminate, and then peeling the polyimide film from the support; or a method of applying the polyimide precursor solution onto a support, drying the polyimide precursor solution, peeling the polyimide precursor film from the support to obtain a self-supporting film, fixing the self-supporting film, and chemically or thermally imidizing the self-supporting film.
Although the polyimide precursor solution can be applied onto a support by any method as long as it can form a desired coating, for example, a known method such as spin coating, screen printing, bar coating, electrophoretic deposition, casting, or extrusion molding can be suitably used. Considering the subsequent steps, such as drying and heating, to form the polyimide film, the coating can be formed to have a thickness of about 1 μm to 500 μm.
Although the drying conditions are not particularly limited, the drying temperature can be in the temperature range of, for example, 20° C. or higher and 200° C. or lower, preferably room temperature (25° C.) or higher and 180° C. or lower, more preferably 30° C. or higher and 150° C. or lower. The time for drying is, for example, 1 minute or more and 60 minutes or less, preferably 30 minutes or more and 20 minutes or less although it varies depending on the heating temperature. The heating method is not particularly limited, for example, hot air, infrared light, or the like can be used; the heating method may be performed several times, or may be performed while the temperature is being gradually increased. The drying conditions can be selected considering the properties of the polyimide film in vacuum or an atmosphere of an inert gas such as nitrogen, or air, for example.
Although the support to which the polyimide precursor solution is applied can be any support to which the polyimide precursor solution can be applied and which does not affect the subsequent formation of the polyimide precursor film by drying, heating, and the chemical or thermal imidization reaction, a glass, metal, or plastic substrate is preferably used.
In the present invention, the chemical or thermal imidization can be performed by performing a heat treatment. An example of the thermal imidization will be described: Generally, the highest heating temperature in the heat treatment is 300° C. or higher, preferably 350° C. or higher, more preferably 450° C. or higher, still more preferably 470° C. or higher. The upper limit of the heat treatment temperature can be a temperature which does not cause a reduction in properties of the polyimide film, and is preferably 600° C. or lower, more preferably 550° C. or lower, still more preferably 520° C. or lower. Although the heat treatment can also be performed under an air atmosphere, usually, it is suitably performed under an inert gas atmosphere, preferably a nitrogen gas atmosphere. In the chemical imidization, the heat treatment can be performed on a condition milder than that for the thermal imidization although it depends on the type of an additive such as a chemical imidization catalyst. For example, the heat treatment can be performed in the temperature range of usually 100° C. or higher, preferably 120° C. or higher, more preferably 150° C. or higher, still more preferably 200° C. or higher and usually 360° C. or lower, preferably 300° C. or lower, more preferably 250° C. or lower, still more preferably 220° C. or lower.
The heat treatment for the chemical or thermal imidization may be performed stepwise. For example, it is preferred that a first heat treatment be performed at a relatively low temperature of 100° C. to 170° C. for 0.5 to 30 minutes, a second heat treatment be then performed at a temperature of more than 170° C. to 220° C. or less for about 0.5 to 30 minutes, and subsequently, a third heat treatment be performed at a high temperature of more than 220° C. to less than 350° C. for about 0.5 to 30 minutes. Further, a fourth high-temperature heat treatment can be performed at 350° C. or more to the highest heating temperature. It is preferred that the heat treatment be continuously performed. For example, preferably, a heat treatment can be performed from a relatively low temperature of 100° C. to 170° C. to the highest heating temperature. Although the heating rate is not particularly limited, the heating rate is preferably 1° C./min or more and 30° C./min or less, particularly preferably 2° C./min or more and 20° C./min or less. The ranges above are preferred because foaming caused by a rapid increase in temperature can be suppressed.
Since the polyimide film for a display substrate according to the present invention is formed from the above-mentioned polyimide precursor for a display substrate, the polyimide film has a long charge half-life and a low charge decay ratio after 120 seconds in measurement of the charge half-life, can contribute to a suppression in charge up, and can achieve high adhesion.
Specifically, the charge half-life is preferably 48 seconds or more, more preferably 50 seconds or more, still more preferably 52 seconds or more in measurement of charge half-life in accordance with JIS L 1094A. The charge half-life in the measurement of the charge half-life refers to the time until the charge amount halves after the polyimide film is charged by corona discharge performed on the polyimide film for a display substrate according to the present invention.
The charge half-life can be measured as follows, for example. Specifically, the polyimide film for a display substrate according to the present invention is charged by corona discharge in accordance with JIS L 1094A, and then the charge half-life is measured.
The polyimide film for a display substrate according to the present invention has a charge decay ratio after 120 seconds of preferably 63% or less, more preferably 61% or less in the measurement of charge half-life in accordance with JIS L 1094A. The lower limit of the charge decay ratio after 120 seconds is preferably 30% or more. The charge decay ratio after 120 seconds in the measurement of the charge half-life is a proportion of an amount of the charge amount reduced after 120 seconds from charging of the polyimide film by corona discharge performed on the polyimide film for a display substrate according to the present invention to the charge amount immediately after the charging. In other words, the charge decay ratio after 120 seconds in the measurement of the charge half-life is calculated from the equation: charge decay ratio after 120 seconds (%)={(charge amount immediately after charging−charge amount after 120 seconds)÷charge amount immediately after charging}×100.
The charge decay ratio after 120 seconds can be measured as follows, for example. Specifically, the polyimide film for a display substrate according to the present invention is charged by corona discharge in accordance with JIS L 1094A, and then the charge amount immediately after the charging and the charge amount after 120 seconds are measured. At this time, these charge amounts may be measured simultaneously with the measurement of the charge half-life.
In the present invention, from the viewpoint of more appropriately suppressing charge up, the polyimide firm, when used in display substrate applications, preferably demonstrates the charge half-life or charge decay ratio after 120 seconds close to that of an inorganic material which forms an inorganic layer as a gas barrier layer laminated on the polyimide film for a display substrate. In particular, SiOX is suitably used as the inorganic material which forms the inorganic layer. Since the inorganic material such as SiOX has a relatively long charge half-life and a relatively small charge decay ratio after 120 seconds, the charge half-life or charge decay ratio after 120 seconds of the polyimide film can be made closer to those of the inorganic material such as SiOX by further increasing the charge half-life and further reducing the charge decay ratio after 120 seconds as described above. Thereby, the charge up can be more appropriately suppressed. The charge half-life and the charge decay ratio after 120 seconds of the inorganic material which forms the inorganic layer can be determined by the same methods as those in the measurement of the charge half-life in accordance with JIS L 1094A and the measurement of the charge decay ratio after 120 seconds described above.
The polyimide film for a display substrate according to the present invention has a 90° peel strength of preferably 15 mN/mm or more, more preferably 20 mN/mm or more. The 90° peel strength can be measured by forming the polyimide film for a display substrate according to the present invention on the surface of glass, and performing a 90° peeling test on the formed polyimide film.
The polyimide film for a display substrate according to the present invention is suitably used in display substrates for displays and touch panels.
The display substrate is formed as follows, for example. Specifically, first, an inorganic gas barrier layer as a gas barrier layer against water vapors and oxygen is formed on the surface of the polyimide film for a display substrate according to the present invention by sputtering, deposition, or a gel-sol method. The inorganic gas barrier layer is formed of SiOx or the like, for example. In the next step, an electrically conductive layer made of a conductive substance (such as a metal or a metal oxide, a conductive organic product, or a conductive carbon) is formed thereon. Thereby, a display substrate can be obtained. The electrically conductive layer with a predetermined circuit pattern is formed by a method such as photolithography, a variety of printing methods, or an inkjet method. Subsequently, members for configuring the display, such as elements and semiconductors, may be additionally formed.
The display substrate according to the present invention may be produced as follows: an inorganic gas barrier layer is formed on the surface of the polyimide film formed from the polyimide precursor for a display substrate according to the present invention, and an electrically conductive layer with a circuit pattern is formed; and thereafter, the polyimide film including the inorganic gas barrier layer and the electrically conductive layer formed on the surface thereof is peeled off from the support. The peeling method is not particularly limited. For example, the polyimide film can be peeled by any peeling method such as laser peeling to peel the film by irradiation of the film with laser or the like from the support side or mechanical peeling to mechanically peel the film.
The display substrate according to the present invention thus obtained includes a polyimide film for a display substrate formed from the polyimide precursor for a display substrate according to the present invention, an inorganic gas barrier layer formed on the surface of the polyimide film, and an electrically conductive layer with a circuit pattern formed thereon. Since the display substrate according to the present invention includes a polyimide film for a display substrate formed from the polyimide precursor for a display substrate according to the present invention and the polyimide film for a display substrate according to the present invention has a long charge half-life, such a polyimide film is effective in cancelling charge accumulation at the interface with the inorganic gas barrier layer, and thus contributes to a suppression in charge up.
Hereinafter, the present invention will be more specifically described by way of Examples, Comparative Examples, and Reference Examples, but the present invention is not limited to these.
Measurement methods used in examples below will be shown.
The total acidic group amount contained in the polyimide film was calculated as follows: initially, for each of acid dianhydride, diamine, tetracarboxylic acid, and a terminating agent as raw materials, the amount of the acidic group contained therein was calculated from the following expression. Note that for tetracarboxylic acid, it was assumed that among the acidic groups in one molecule, four carboxylic acids are reacted with a diamine during polymerization, and are no longer left as the acidic groups when the film is formed, and the number of acidic groups in calculation of the acidic group amount was calculated using a numeric value obtained by subtracting 4 from the number of acidic group in one molecule of the tetracarboxylic acid (including acid anhydride groups).
amount (mol) of acidic group contained in raw material=(amount (mol) of substance in raw material)×(the number of acidic groups in one molecule of raw material)
Next, the total molar amount of acid dianhydride, diamine, tetracarboxylic acid, and the terminating agent excluding the catalyst was regarded as the total amount (mol) of the monomer added, and the content ratio of acidic groups (—COOH group, —SO3H groups) contained in the polyimide film was calculated from the expression below:
content ratio of acidic groups contained in film=total amount (mol) of acidic groups contained in raw material/total amount (mol) of monomer added
[Charge Half-Life and Charge Decay Ratio after 120 Seconds in Measurement of Charge Half-Life]
A polyimide film was cut into a size of 55 mm in length and width to prepare a sample piece. Using Static Honestmeter available from SHISHIDO ELECTROSTATIC, LTD., this test piece was subjected to measurement of the charge half-life in accordance with JIS L 1094A by a corona charge method under an environment at 23±2° C. and 50% RH where a voltage of −10 kV was applied for 30 s and the maximum measurement time was 120 s, thereby measuring charge half-life and charge decay ratio after 120 seconds.
The 90° peel strength was measured by the following method. A glass plate including a polyimide film formed thereon was cut into a width of 25 mm to prepare a sample piece. In this sample piece, the test piece was partially peeled to make an end for fixation, and was fixed to a peeling test measurement jig of Tensilon RTF-1350. Then, using a tensile tester, 50 mm or more of the test piece was peeled off at a rate of 50 mm/min, and the load during the peeling was measured. The peel-off load was divided by the peeled length (mm) of the test piece, and the obtained value was defined as 90° peel strength.
The following abbreviations stand for the compounds used in Examples below.
34.4734 g of NMP (N-methylpyrrolidone), 1.4340 g of PPD, and 0.0842 g of 3,5-DABA were placed into a reactor equipped with a stirrer and a nitrogen inlet pipe, and were stirred under a nitrogen atmosphere at 50° C. for 30 minutes. Thereafter, 3.9820 g of s-BPDA was added to cause a reaction, preparing a polyimide precursor solution (polyamic acid solution). At this time, the molar ratio of s-BPDA:PPD:3,5-DABA was 100:96:4.
In the next step, the polyamic acid solution prepared in Synthetic Example was applied onto an alkali-free glass wafer by spin coating, and the workpiece was heated at 120° C., 150° C., 200° C., at 250° C. each for 10 minutes, and at 450° C. for 5 minutes to remove the solvent and perform imidization. Thus, a polyimide film having a thickness of 10 μm was obtained. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine component and the tetracarboxylic acid components were used in a molar ratio of s-BPDA:trimellitic anhydride:PPD of 98:4:100, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine component and the tetracarboxylic acid components were used in a molar ratio of s-BPDA:mellitic acid:PPD of 98:2:100, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
For the mellitic acid used in Example 3, it was assumed that as a result of a reaction similar to that of the tetracarboxylic acid component, the acidic groups finally left in the film were two carboxylic acids after excluding four carboxylic acids of the tetracarboxylic acid component from six carboxylic acids corresponding to the number of acidic groups of mellitic acid, and the number of acidic groups per molecule of the raw material in calculation of the acidic group content ratio was 2.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine component and the tetracarboxylic acid components were used in a molar ratio of s-BPDA:PPD:1,4-phenylenediamine-2-sulfonic acid of 100:96:4, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine component and the tetracarboxylic acid component were used in a ratio of s-BPDA:PPD of 100:100, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine components and the tetracarboxylic acid component were used in a ratio of s-BPDA:PPD:NPD of 100:96:4, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine components and the tetracarboxylic acid component were used in a ratio of s-BPDA:PPD:HAB of 100:96:4, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
A polyimide precursor solution was prepared in the same manner as in Example 1 except that the diamine component and the tetracarboxylic acid component were used in a ratio of s-BPDA:DATP of 100:100, and then, removal of the solvent, imidization, and the like were performed in the same manner as in Example 1, obtaining a polyimide film. The results of evaluations are shown in Table 1.
Table 1 shows that polyimide films having a charge half-life of 48 seconds or more and a charge decay ratio after 120 seconds of 630 or less were obtained by allowing the acidic group to be contained in the polyimide precursor in a predetermined proportion, and due to their long charge half-life and low charge decay ratio after 120 seconds, the polyimide films thus obtained can be used as polyimide films for a display substrate, which contributes to a suppression in charge up (Examples 1 to 4). For the 90° peel strength, it was also verified that the peel strength in Example 1 was 25 mN/mm and was higher than that in Comparative Example 1 (13 mN/mm), and in Examples 2, the adhesion of the polyimide film was very high so that it was difficult to peel the film in order to set the film in the jig for measurement of the peel strength.
The polyimide precursor for a display substrate according to the present invention is suitably used in display substrates.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-032805 | Mar 2022 | JP | national |
| 2022-032822 | Mar 2022 | JP | national |
| 2022-032838 | Mar 2022 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2023/008161 | 3/3/2023 | WO |
