Patent Application
20220115582
The present invention relates to a polymer-based piezoelectric composite material and a piezoelectric film formed of the polymer-based piezoelectric composite material.
With reduction in thickness of displays such as liquid crystal displays or organic EL displays, speakers used in these thin displays are also required to be lighter and thinner. Further, in flexible displays having flexibility, speakers are also required to have flexibility in order to be integrated with flexible displays without impairing lightness and flexibility. As such lightweight, thin, and flexible speakers, it is considered to employ sheet-like piezoelectric films having a property of stretching and contracting in response to an applied voltage.
It has been suggested to use a piezoelectric composite material obtained by dispersing piezoelectric particles in a matrix for such a sheet-like piezoelectric film having flexibility.
For example, JP2016-063286A describes an electroacoustic conversion film including a polymer-based piezoelectric composite material obtained by dispersing piezoelectric particles in a matrix formed of a polymer material, a thin film electrode formed on each of both surfaces of the polymer-based piezoelectric composite material, and a protective layer formed on a surface of the thin film electrode, in which the polymer-based piezoelectric composite material contains 20 ppm to 500 ppm of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature.
Further, JP1991-166778A (JP-H03-166778A) describes a piezoelectric element for an underwater acoustic converter, containing an organic base material, and 65% or greater of piezoelectric ceramic powder in the organic base material in terms of the volume ratio, in which a piezoelectric composite material having pores formed to have a relative density (the percentage of a measured density ρmeas with respect to a theoretical density ρcal) of 93.00% to 97.00% is subjected to vulcanization molding in a flat plate shape by applying a voltage in the thickness direction, polarized in the application direction of the voltage, and provided with electrodes on the front and rear surfaces thereof.
The polymer-based piezoelectric composite material of the electroacoustic conversion film described in JP2016-063286A contains 20 ppm to 500 ppm of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature, and thus degradation of conversion efficiency, a decrease in withstand voltage, and degradation of flexibility can be suppressed even in an environment where the temperature and the humidity are severe.
As described in JP2016-063286A, in a case where the content of the substance which is contained in the polymer-based piezoelectric composite material, has an SP value of less than 12.5 (cal/cm3)1/2, and is in a liquid state at room temperature is greater than 500 ppm, degradation of the piezoelectric conversion efficiency is observed in a temperature cycle test in which heating and cooling are repeated.
The above-described substance is formed by allowing a coating material which is a polymer-based piezoelectric composite material to contain a solvent. Therefore, it is necessary to control the content of the substance in the polymer-based piezoelectric composite material by applying the coating material and drying the coating material. However, since it takes time to control the content of the substance to 500 ppm or less after the coating material is applied and dried, there is a problem of poor productivity.
The present invention has been made to solve such problems of the related art, and an object thereof is to provide a polymer-based piezoelectric composite material and a piezoelectric film which have high productivity and are capable of suppressing degradation of piezoelectric conversion efficiency in an environment where the temperature and the humidity are severe.
In order to achieve the above-described object, the present invention has the following configurations.
[1] A polymer-based piezoelectric composite material comprising: piezoelectric particles in a matrix containing a polymer material, in which the polymer-based piezoelectric composite material contains greater than 500 ppm and 10000 ppm or less of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature, voids are formed in the polymer-based piezoelectric composite material, and an area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is 0.1% or greater and 20% or less.
[2] The polymer-based piezoelectric composite material according to [1], in which the area ratio of the voids is 0.1% or greater and less than 5%.
[3] The polymer-based piezoelectric composite material according to [1] or [2], in which the polymer-based piezoelectric composite material is polarized in a thickness direction.
[4] The piezoelectric film according to any one of [1] to [3], in which the polymer-based piezoelectric composite material does not have in-plane anisotropy as a piezoelectric characteristic.
[5] The polymer-based piezoelectric composite material according to any one of [1] to [4], in which a content of the substance is greater than 500 ppm and 1000 ppm or less.
[6] The polymer-based piezoelectric composite material according to any one of [1] to [5], in which the polymer material has a viscoelasticity at room temperature.
[7] The polymer-based piezoelectric composite material according to any one of [1] to [6], in which the substance is at least one selected from the group consisting of methyl ethyl ketone, dimethylformamide, cyclohexanone, acetone, cyclohexane, acetonitrile, 1-propanol, 2-propanol, 2-methoxy alcohol, diacetone alcohol, dimethylacetamide, benzyl alcohol, n-hexane, toluene, o-xylene, ethyl acetate, butyl acetate, diethyl ether, and tetrahydrofuran.
[8] A piezoelectric film comprising: the polymer-based piezoelectric composite material according to any one of [1] to [7]; and electrode layers which are formed on both surfaces of the polymer-based piezoelectric composite material.
[9] The piezoelectric film according to [8], further comprising: a protective layer laminated on a surface of the electrode layer on a side opposite to a surface provided with the polymer-based piezoelectric composite material.
According to the present invention, it is possible to provide a polymer-based piezoelectric composite material and a piezoelectric film which have high productivity and are capable of suppressing degradation of piezoelectric conversion efficiency in an environment where the temperature and the humidity are severe.
Hereinafter, a polymer-based piezoelectric composite material and a piezoelectric film of the present invention will be described in detail based on the suitable examples shown in the accompanying drawings.
Descriptions of the constituent requirements described below may be made based on representative embodiments of the present invention, but the present invention is not limited to such embodiments.
In the present specification, a numerical range shown using “to” indicates a range including numerical values described before and after “to” as a lower limit and an upper limit.
The polymer-based piezoelectric composite material according to the embodiment of the present invention is a polymer-based piezoelectric composite material including piezoelectric particles in a matrix containing a polymer material, in which the polymer-based piezoelectric composite material contains greater than 500 ppm and 10000 ppm or less of a substance on a mass basis which has a solubility parameter (SP) value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature, voids are formed in the polymer-based piezoelectric composite material, and the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is 0.1% or greater and 20% or less.
Further, the piezoelectric film according to the embodiment of the present invention is a piezoelectric film including the polymer-based piezoelectric composite material, and an electrode layer formed on each of both surfaces of the polymer-based piezoelectric composite material.
[Piezoelectric Film]
As illustrated in
The piezoelectric layer 20 contains piezoelectric particles 36 in a matrix 34 containing a polymer material. That is, the piezoelectric layer 20 is a polymer-based piezoelectric composite material according to the embodiment of the present invention. Further, the lower electrode 24 and the upper electrode 26 are electrode layers in the present invention. Further, the lower protective layer 28 and the upper protective layer 30 are protective layers in the present invention.
As will be described later, the piezoelectric film 10 (piezoelectric layer 20) is polarized in the thickness direction as a preferred embodiment.
Such a piezoelectric film 10 can be suitably used as, for example, various sensors such as sonic sensors, ultrasonic sensors, pressure sensors, tactile sensors, strain sensors, and vibration sensors, acoustic devices such as microphones, pickups, speakers, and exciters (specific applications thereof include noise cancellers (used for cars, trains, airplanes, and robots), artificial voice cords, buzzers for preventing invasion of pests and harmful animals, furniture, wallpaper, photos, helmets, goggles, signage, and robots), haptics used for automobiles, smartphones, smart watches, and games, ultrasonic converters such as ultrasonic probes and hydrophones, actuators used for preventing adhesion of water droplets, transportation, stirring, dispersion, and polishing, damping materials (dampers) used for sports equipment such as containers, vehicles, buildings, skis, and rackets, and vibration power generators used by being applied to roads, floors, mattresses, chairs, shoes, tires, wheels, and computer keyboards.
[Polymer-Based Piezoelectric Composite Material (Piezoelectric Layer)]
A piezoelectric layer 20 which is the polymer-based piezoelectric composite material according to the embodiment of the present invention contains piezoelectric particles 36 in a matrix 34.
Further, the matrix 34 of the piezoelectric layer 20 contains greater than 500 ppm and 10000 ppm or less of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature.
Further, the SP value is a solubility parameter δ and is defined as “δ={(ΔH−RT)/T}1/2” from the molar heat of vaporization ΔH and the molar volume V. That is, the SP value is calculated from the square root (cal/cm3)1/2 of the heat of vaporization required for evaporation of a liquid having a volume of 1 cm3. The reference values can also be confirmed from The Three Dimensional Solubility Parameter and Solvent Diffusion Coefficient, Their Importance in Surface Coating Formulation (Charles M. Hansen).
Further, a plurality of voids 35 are formed in the piezoelectric layer 20, and the area ratio of the voids in the cross section of the polymer-based piezoelectric composite material is 0.1% or greater and 20% or less.
Further, in the present specification, the “room temperature” indicates a temperature range of approximately 0° C. to 50° C.
Here, as the material of the matrix 34 (serving as a matrix and a binder) of the polymer-based piezoelectric composite material constituting the piezoelectric layer 20, a polymer material having a viscoelasticity at room temperature is preferably used.
The piezoelectric film 10 according to the embodiment of the present invention is suitably used for a speaker having flexibility such as a speaker for a flexible display. Here, it is preferable that the polymer-based piezoelectric composite material (piezoelectric layer 20) used for a speaker having flexibility satisfies the following requirements. Therefore, it is preferable to use a polymer material having a viscoelasticity at room temperature as a material satisfying the following requirements.
(i) Flexibility
For example, in a case of being gripped in a state of being loosely bent like a document such as a newspaper or a magazine as a portable device, the piezoelectric film is continuously subjected to large bending deformation from the outside at a relatively slow vibration of less than or equal to a few Hz. In this case, in a case where the polymer-based piezoelectric composite material is hard, a large bending stress is generated to that extent, and a crack is generated at the interface between a matrix and piezoelectric particles, which may lead to breakage. Accordingly, the polymer-based piezoelectric composite material is required to have suitable flexibility. In addition, in a case where strain energy is diffused into the outside as heat, the stress can be relieved. Therefore, the polymer-based piezoelectric composite material is required to have a suitably large loss tangent.
(ii) Acoustic Quality
In a speaker, the piezoelectric particles vibrate at a frequency of an audio band of 20 Hz to 20 kHz, and the vibration energy causes the entire polymer-based piezoelectric composite material (piezoelectric film) to vibrate integrally so that a sound is reproduced. Therefore, in order to increase the transmission efficiency of the vibration energy, the polymer-based piezoelectric composite material is required to have appropriate hardness. In addition, in a case where the frequencies of the speaker are smooth as the frequency characteristic thereof, an amount of change in acoustic quality in a case where the lowest resonance frequency is changed in association with a change in the curvature of the speaker decreases. Therefore, the loss tangent of the polymer-based piezoelectric composite material is required to be suitably large.
That is, the polymer-based piezoelectric composite material is required to exhibit a behavior of being rigid with respect to a vibration of 20 Hz to 20 kHz and being flexible with respect to a vibration of less than or equal to a few Hz. In addition, the loss tangent of a polymer-based piezoelectric composite material is required to be suitably large with respect to the vibration of all frequencies of 20 kHz or less.
In general, a polymer solid has a viscoelasticity relieving mechanism, and a molecular movement having a large scale is observed as a decrease (relief) in a storage elastic modulus (Young's modulus) or a maximal value (absorption) in a loss elastic modulus along with an increase in temperature or a decrease in frequency. Among them, the relief due to a microbrown movement of a molecular chain in an amorphous region is referred to as main dispersion, and an extremely large relieving phenomenon is observed. A temperature at which this main dispersion occurs is a glass transition point (Tg), and the viscoelasticity relieving mechanism is most remarkably observed.
In the polymer-based piezoelectric composite material (piezoelectric layer 20), the polymer-based piezoelectric composite material exhibiting a behavior of being rigid with respect to a vibration of 20 Hz to 20 kHz and being flexible with respect to a vibration of less than or equal to a few Hz is realized by using a polymer material whose glass transition point is room temperature, that is, a polymer material having a viscoelasticity at room temperature as a matrix. In particular, from the viewpoint that such a behavior is suitably exhibited, it is preferable that a polymer material in which the glass transition temperature at a frequency of 1 Hz is at room temperature, that is, in a range of 0° C. to 50° C. is used for a matrix of the polymer-based piezoelectric composite material.
As the polymer material having a viscoelasticity at room temperature, various known materials can be used as long as the materials have dielectric properties. It is preferable that a polymer material in which the maximal value of a loss tangent at a frequency of 1 Hz according to a dynamic viscoelasticity test at room temperature, that is, in a range of 0° C. to 50° is 0.5 or greater is used as the polymer material.
In this manner, in a case where the polymer-based piezoelectric composite material is slowly bent due to an external force, stress concentration on the interface between the matrix and the piezoelectric particles at the maximum bending moment portion is relieved, and thus satisfactory flexibility is obtained.
In the polymer material, it is preferable that a storage elastic modulus (E′) at a frequency of 1 Hz according to the dynamic viscoelasticity measurement is 100 MPa or greater at 0° C. and 10 MPa or less at 50° C.
In this manner, the bending moment generated in a case where the polymer-based piezoelectric composite material is slowly bent due to the external force can be reduced, and the polymer-based piezoelectric composite material can exhibit a behavior of being rigid with respect to an acoustic vibration of 20 Hz to 20 kHz.
In addition, the relative dielectric constant of the polymer material is 10 or greater at 25° C. Accordingly, in a case where a voltage is applied to the polymer-based piezoelectric composite material, a higher electric field is applied to the piezoelectric particles in the matrix, and thus a large deformation amount can be expected.
However, in consideration of ensuring satisfactory moisture resistance and the like, it is suitable that the relative dielectric constant of the polymer material is 10 or less at 25° C.
Examples of the polymer material satisfying such conditions include cyanoethylated polyvinyl alcohol (cyanoethylated PVA), polyvinyl acetate, polyvinylidene chloride-co-acrylonitrile, a polystyrene-vinyl polyisoprene block copolymer, polyvinyl methyl ketone, and polybutyl methacrylate. In addition, as these polymer materials, a commercially available product such as Hybrar 5127 (manufactured by Kuraray Co., Ltd.) can also be suitably used. Among these, it is preferable to use a material containing a cyanoethyl group and particularly preferable to use cyanoethylated as the polymer material.
Further, these polymer materials may be used alone or in combination (mixture) of a plurality of kinds thereof.
In the matrix 34 for which such a polymer material is used, a plurality of polymer materials may be used in combination as necessary.
That is, for the purpose of adjusting dielectric properties, mechanical properties, and the like, other dielectric polymer materials may be added to the matrix 34 in addition to the polymer material having a viscoelasticity at room temperature as necessary.
Examples of the dielectric polymer material that can be added thereto include a fluorine-based polymer such as polyvinylidene fluoride, a vinylidene fluoride-tetrafluoroethylene copolymer, a vinylidene fluoride-trifluoroethylene copolymer, a polyvinylidene fluoride-trifluoro ethylene copolymer, or a polyvinylidene fluoride-tetrafluoroethylene copolymer, a polymer containing a cyano group or a cyanoethyl group such as a vinylidene cyanide-vinyl acetate copolymer, cyanoethyl cellulose, cyanoethyl hydroxysaccharose, cyanoethyl hydroxycellulose, cyanoethyl hydroxypullulan, cyanoethyl methacrylate, cyanoethyl acrylate, cyanoethyl hydroxyethyl cellulose, cyanoethyl amylose, cyanoethyl hydroxypropyl cellulose, cyanoethyl dihydroxypropyl cellulose, cyanoethyl hydroxypropyl amylose, cyanoethyl polyacrylamide, cyanoethyl polyacrylate, cyanoethyl pullulan, cyanoethyl polyhydroxymethylene, cyanoethyl glycidol pullulan, cyanoethyl saccharose, or cyanoethyl sorbitol, and synthetic rubber such as nitrile rubber or chloroprene rubber.
Among these, a polymer material containing a cyanoethyl group is suitably used.
Further, in the matrix 34 of the piezoelectric layer 20, the number of kinds of the dielectric polymer materials to be added in addition to the polymer material having a viscoelasticity at room temperature such as cyanoethylated PVA is not limited to one, and a plurality of kinds of the materials may be added.
In addition, for the purpose of controlling the glass transition point, a thermoplastic resin such as a vinyl chloride resin, polyethylene, polystyrene, a methacrylic resin, polybutene, and isobutylene, and a thermosetting resin such as a phenol resin, a urea resin, a melamine resin, an alkyd resin, or mica may be added to the matrix 34 in addition to the dielectric polymer materials.
Further, for the purpose of improving the pressure sensitive adhesiveness, a viscosity imparting agent such as rosin ester, rosin, terpene, terpene phenol, or a petroleum resin may be added.
In the matrix 34 of the piezoelectric layer 20, the addition amount in a case of adding materials other than the polymer material having a viscoelasticity such as cyanoethylated PVA is not particularly limited, but is preferably set to 30% by mass or less in terms of the proportion of the materials in the matrix 34.
In this manner, the characteristics of the polymer material to be added can be exhibited without impairing the viscoelastic relieving mechanism in the matrix 34, and thus preferable results, for example, an increase in the dielectric constant, improvement of the heat resistant, and improvement of the adhesiveness between the piezoelectric particles 36 and the electrode layer can be obtained.
The piezoelectric layer 20 is a polymer-based piezoelectric composite material containing the piezoelectric particles 36 in the matrix 34.
The piezoelectric particles 36 consist of ceramics particles having a perovskite type or wurtzite type crystal structure.
As the ceramics particles forming the piezoelectric particles 36, for example, lead zirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), barium titanate (BaTiO3), zinc oxide (ZnO), and a solid solution (BFBT) of barium titanate and bismuth ferrite (BiFe3) are exemplified.
Only one of these piezoelectric particles 36 may be used, or a plurality of types thereof may be used in combination (mixture).
The particle diameter of such piezoelectric particles 36 is not limited, and may be appropriately selected depending on the size, the applications, and the like of the polymer-based piezoelectric composite material (piezoelectric film 10).
The particle diameter of the piezoelectric particles 36 is preferably in a range of 1 to 10 μm. By setting the particle diameter of the piezoelectric particles 36 to be in the above-described range, preferable results in terms of achieving both excellent piezoelectric characteristics and flexibility of the polymer-based piezoelectric composite material (piezoelectric film 10) can be obtained.
In
That is, the piezoelectric particles 36 in the piezoelectric layer 20 may be irregularly dispersed in the matrix 34 as long as the piezoelectric particles 36 are preferably uniformly dispersed therein.
In the piezoelectric layer 20 (polymer-based piezoelectric composite material), the ratio between the amount of the matrix 34 and the amount of the piezoelectric particles 36 in the piezoelectric layer 20 is not limited, and the ratio thereof may be appropriately set according to the size and the thickness of the piezoelectric layer 20 in the plane direction, the applications of the polymer-based piezoelectric composite material, the characteristics required for the polymer-based piezoelectric composite material, and the like.
The volume fraction of the piezoelectric particles 36 in the piezoelectric layer 20 is preferably in a range of 30% to 80%, more preferably 50% or greater, and still more preferably in a range of 50% to 80%.
By setting the ratio between the amount of the matrix 34 and the amount of the piezoelectric particles 36 to be in the above-described range, preferable results in terms of achieving both of excellent piezoelectric characteristics and flexibility can be obtained.
The thickness of the piezoelectric layer 20 is not limited, and may be appropriately set according to the applications of the polymer-based piezoelectric composite material, the characteristics required for the polymer-based piezoelectric composite material, and the like. It is advantageous that the thickness of the piezoelectric layer 20 increases in terms of the rigidity such as the strength of stiffness of a so-called sheet-like material, but the voltage (potential difference) required to stretch and contract the piezoelectric layer 20 by the same amount increases.
The thickness of the piezoelectric layer 20 is preferably in a range of 10 to 300 μm, more preferably in a range of 20 to 200 μm, and still more preferably in a range of 30 to 150 μm.
By setting the thickness of the piezoelectric layer 20 to be in the above-described range, preferable results in terms of achieving both ensuring of the rigidity and moderate elasticity can be obtained.
Here, the matrix 34 of the piezoelectric layer 20 contains greater than 500 ppm and 10000 ppm or less of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature.
Further, voids 35 are formed in the matrix 34 of the piezoelectric layer 20, and the area ratio of the voids 35 in the cross section of the piezoelectric layer 20 is 0.1% or greater and 20% or less.
Specific examples of the substance that has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature include organic compounds such as methyl ethyl ketone, dimethylformamide, cyclohexanone, acetone, cyclohexane, acetonitrile, 1-propanol, 2-propanol, 2-methoxy alcohol, diacetone alcohol, dimethylacetamide, benzyl alcohol, n-hexane, toluene, o-xylene, ethyl acetate, butyl acetate, diethyl ether, and tetrahydrofuran.
The above-described substance is typically used as an organic solvent. That is, in the present invention, the polymer-based piezoelectric composite material (piezoelectric layer 20) contains greater than 500 ppm and 10000 ppm or less of an organic solvent on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature.
In a case where the polymer-based piezoelectric composite material contains above-described substance, drying and curing of the polymer-based piezoelectric composite material even in a low-humidity environment can be prevented. As a result, it is possible to prevent degradation of the flexibility in a low-humidity environment.
Here, even in a case where the polymer-based piezoelectric composite material contains a substance that has an SP value of 12.5 (cal/cm3)1/2 or greater and is in a liquid state at room temperature, curing of the polymer-based piezoelectric composite material due to drying can be prevented. However, it is assumed that in a case where the polymer-based piezoelectric composite material contains a substance having an SP value of 12.5 (cal/cm3)1/2 or greater, the substance is not uniformly dispersed in the polymer-based piezoelectric composite material and aggregates. Therefore, in a case where the substance inside the piezoelectric material is evaporated by being exposed to a high temperature, relatively large voids are generated and peeling occurs at the interface between the piezoelectric particles and the matrix. As a result, since the vibration of the piezoelectric particles is not transmitted to the matrix, the conversion efficiency of the voltage and the sound is degraded, and current leakage and dielectric breakdown occur.
On the contrary, in the present invention, since the SP value of the substance contained in the polymer-based piezoelectric composite material layer is set to less than 12.5 (cal/cm3)1/2, the substance can be uniformly dispersed in the polymer-based piezoelectric composite material, and thus generation of large voids is suppressed and occurrence of peeling at the interface between the piezoelectric particles nad the matrix can be prevented in a case where the substance inside the polymer-based piezoelectric composite material is evaporated after being exposed to a high tempera. Therefore, degradation of the conversion efficiency and a decrease in withstand voltage can be suppressed.
Here, as described above, in a case where the content of the substance which is contained in the polymer-based piezoelectric composite material, has an SP value of less than 12.5 (cal/cm3)1/2, and is in a liquid state at room temperature is greater than 500 ppm, there is a problem of degradation of the piezoelectric conversion efficiency in a temperature cycle test in which heating and cooling are repeated. This is because in a case where the content of the substance is large, voids are likely to be generated in a case of evaporation of the substance in the polymer-based piezoelectric composite material, peeling occurs at the interface between the piezoelectric particles and the matrix, and thus the conversion efficiency is degraded and the withstand voltage is decreased.
Therefore, in JP2016-063286, by setting the content of the substance which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature to 500 ppm or less, generation of large voids is suppressed in a case of evaporation of the substance in the polymer-based piezoelectric composite material, occurrence of peeling at the interface between the piezoelectric particles and the matrix is prevented, and degradation of the conversion coefficiency and a decrease in withstand voltage are suppressed.
Here, the above-described substance is formed by allowing a coating material which is a polymer-based piezoelectric composite material to contain a solvent. Therefore, it is necessary to control the content of the substance in the polymer-based piezoelectric composite material by applying the coating material and drying the coating material. However, since it takes time to control the content of the substance to 500 ppm or less after the coating material is applied and dried, there is a problem of poor productivity. Particularly for the purpose of improving the productivity, in a case where a polymer-based piezoelectric composite material is continuously produced, since it is necessary to slow down the line speed or lengthen the drying step for drying, there is a problem of poor productivity.
On the contrary, the polymer-based piezoelectric composite material according to the embodiment of the present invention contains greater than 500 ppm and 10000 ppm or less of a substance on a mass basis which has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature, voids are formed, and the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is 0.1% or greater and 20% or less.
In the polymer-based piezoelectric composite material according to the embodiment of the present invention, the effect of suppressing evaporation of the substance due to drying can be obtained by setting the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material to 0.1% or greater and 20% or less, that is, reducing the voids. In this manner, degradation of conversion efficiency due to the evaporation of the substance, the generation of voids, and the peeling at the interface between the piezoelectric particles and the matrix can be suppressed.
Further, in the polymer-based piezoelectric composite material according to the embodiment of the present invention, since the content of the substance on a mass basis is greater than 500 ppm and 10000 ppm or less and the drying time after application of the coating material which is the polymer-based piezoelectric composite material can be shortened, the line speed can be increased and the length of the drying step can be shortened, and thus the productivity can be improved.
Here, in a case where the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is less than 0.1%, that is, in a case where the area of voids is extremely small, the solvent during the drying is not able to escape, and thus expansion and cracking occurred. Therefore, the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is 0.1% or greater.
From the viewpoint of more suitably suppressing degradation of the conversion efficiency and suppressing evaporation of the substance due to drying, the area ratio of the voids in a cross section of the polymer-based piezoelectric composite material is preferably 0.1% or greater and less than 5% and more preferably 0.1% or greater and 2% or less.
The method of measuring the area ratio of the voids in the cross section of the polymer-based piezoelectric composite material is, for example, as follows.
The polymer-based piezoelectric composite material is cut in the thickness direction to observe a cross section thereof. The polymer-based piezoelectric composite material is cut by mounting a histo knife blade (manufactured by Drukker) having a width of 8 mm on RM2265 (manufactured by Leica Biosystems) and setting the speed to a controller scale of 1 and an engagement amount of 0.25 μm to 1 μm. The cross section thereof is observed with a scanning electron microscope (SEM) (SU8220, manufactured by Hitachi High-Tech Corporation). The sample is conductively treated by Pt vapor deposition, and the work distance is set to 8 mm. The observation is made under conditions of an SE image (Upper) and an acceleration voltage of 0.5 kV, a sharp image is output by focus adjustment and astigmatism adjustment, and automatic brightness adjustment (auto setting, brightness: 0, contrast: 0) is carried out in a state where the polymer-based piezoelectric composite material portion covers the entire screen. The photographing magnification is set as the magnification in which the electrodes at both ends fit on one screen and the width between the electrodes is at least half of the screen. Image analysis software ImageJ is used for binarization of the image, the lower limit of the threshold is set to the maximum value at which the protective layer is not colored, and the upper limit of the threshold is set to the maximum set value of 255. The area ratio of the voids in the area of the polymer-based piezoelectric composite material is calculated by defining the area of a colored site between the electrodes as the area of the voids, setting the area as the numerator, and setting the area of the polymer-based piezoelectric composite material in which the width in the lateral direction is defined as both ends of the ESM image. The same process is performed on optional ten cross sections, and the average value of the area ratios is set as the area ratio of voids in the cross section of the polymer-based piezoelectric composite material.
Examples of the method of adjusting the area ratio of voids in a cross section of the polymer-based piezoelectric composite material include a method of eliminating air bubbles that cause voids by performing a line mixing treatment before application of a coating material so that the air bubbles in the coating material are made fine and likely to escape from the surface before being dried. Here, the amount of air bubbles escaping during the drying can be adjusted by changing the treatment time and the rotation speed of the line mixing to adjust the size of air bubbles in the coating material.
The treatment time and the rotation speed of the line mixing may be appropriately set depending on the desired area ratio of voids, the kind of the matrix, the kind of the solvent (the above-described substance), the proportion of the solvent, the viscosity of the coating material, the thickness of the polymer-based piezoelectric composite material to be formed, and the like.
Further, from the viewpoint of more suitably suppressing degradation of the conversion efficiency, improving the productivity, and suppressing a decrease in flexibility, the content of the substance that has an SP value of less than 12.5 (cal/cm3)1/2 and is in a liquid state at room temperature is preferably greater than 500 ppm and 10000 ppm or less, more preferably greater than 500 ppm and 1000 ppm or less, and still more preferably greater than 500 ppm and 700 ppm or less in terms of the mass ratio.
The content of the substance in the polymer-based piezoelectric composite material is measured by gas chromatography. Here, the value in a case where the sample is allowed to stand in an environment of a temperature of 25° C. and a humidity of 50% RH for 24 hours is defined as the content of the substance. Specifically, for example, the content of the substance is measured as follows.
A part of the sample is cut out from the polymer-based piezoelectric composite material into a size of 8×8 mm square, and the content of the substance is measured using a gas chromatograph device (GC-12A, manufactured by Shimadzu Corporation). In addition, 221-14368-11 (manufactured by Shimadzu Corporation) is used as a column, and Chromosorb 101 (manufactured by Shinwa Chemical Industries Ltd.) is used as a filler. The measurement is performed by setting the temperature of the sample vaporization chamber and the detector to 200° C., the column temperature to a constant temperature of 160° C., the carrier gas to 0.4 MPa of helium.
In a case where a module having a protective layer positioned outside the electrode layer is bonded with a pressure sensitive adhesive layer containing an organic solvent, the sample is cut after the layers are peeled off to remove the pressure sensitive adhesive layer due to the influence on the measurement, and the content of the substance is measured.
The mass of the cut sample is measured before the gas chromatograph measurement. The mass of the substance in the polymer-based piezoelectric composite material is calculated by removing the polymer-based piezoelectric composite material from the same sample after the gas chromatograph measurement using an organic solvent or the like, measuring the mass of the remaining protective layer or the module having the protective layer, and subtracting the measured mass from the mass which has been measured before the gas chromatograph measurement. The content mass ratio of the substance is calculated by dividing the mass of the substance obtained by the gas chromatograph measurement by the mass of the polymer-based piezoelectric composite material.
The method of allowing the polymer-based piezoelectric composite material to contain the substance at a predetermined concentration is not particularly limited, and for example, a predetermined amount of the substance may be added to the coating material during the preparation of the coating material which is the polymer-based piezoelectric composite material.
It is preferable that the content of the substance in the polymer-based piezoelectric composite material is controlled by adjusting the drying conditions after the application of the coating material using the substance as a solvent of the prepared coating material. The drying conditions here may be appropriately set according to the kind of the substance, the desired content, the kind of the matrix, the thickness of the piezoelectric layer, and the like. Further, as a drying method, a known drying method such as heat drying with a heater or heat drying with warm air can be used.
From the viewpoint of preventing degradation of the conversion efficiency, the SP value of the substance is preferably in a range of 9.0 to 12.3 (cal/cm3)1/2 and more preferably in a range of 9.3 to 12.1 (cal/cm3)1/2.
Further, the thickness of the piezoelectric layer 20 is not limited and may be appropriately set according to the size of the piezoelectric film, the applications of the piezoelectric film 10, and the characteristics required for the piezoelectric film 10, and the like.
Here, based on the examination conducted by the present inventors, the thickness of the piezoelectric layer 20 is preferably in a range of 10 μm to 300 μm, more preferably in a range of 20 μm to 200 μm, and particularly preferably in a range of 30 μm to 150 μm, as described above.
By setting the thickness of the piezoelectric layer 20 to be in the above-described range, the content of the substance can be more easily adjusted in a case where the content thereof is controlled by performing the drying described above. Further, the concentration of the above-described substance in the piezoelectric layer 20 can be made more uniform. Further, since air bubbles that cause voids are likely to escape after the application of the coating material, the area ratio of the voids can be adjusted to be small.
It is preferable that the thickness of the piezoelectric layer 20 to be in the above-described range from the viewpoint that a preferable effect of achieving both ensuring of rigidity and moderate elasticity can be obtained.
Further, it is preferable that the piezoelectric layer 20 is subjected to a polarization treatment (poling) as described above.
[Electrode Layer and Protective Layer]
As illustrated in
In addition to these layers, the piezoelectric film 10 includes an electrode lead portion that leads out the electrodes from the upper electrode 26 and the lower electrode 24, and the electrode lead portion is connected to a power source. Further, the piezoelectric film 10 may have an insulating layer which covers a region where the piezoelectric layer 20 is exposed for preventing a short circuit or the like.
That is, the piezoelectric film 10 has a configuration in which both surfaces of the piezoelectric layer 20 are interposed between the electrode pair, that is, the upper electrode 26 and the lower electrode 24 and the laminate is further interposed between the lower protective layer 28 and the upper protective layer 30.
As described above, in the piezoelectric film 10, the region interposed between the upper electrode 26 and the lower electrode 24 is stretched and contracted according to an applied voltage.
In the piezoelectric film 10, the lower protective layer 28 and the upper protective layer 30 are provided as a preferred embodiment rather than essential constituent requirements.
The lower protective layer 28 and the upper protective layer 30 have a function of covering the upper electrode 26 and the lower electrode 24 and applying moderate rigidity and mechanical strength to the piezoelectric layer 20. That is, the piezoelectric layer 20 consisting of the matrix 34 and the piezoelectric particles 36 in the piezoelectric film 10 exhibits extremely excellent flexibility under bending deformation at a slow vibration, but may have insufficient rigidity or mechanical strength depending on the applications. As a compensation for this, the piezoelectric film 10 is provided with the lower protective layer 28 and the upper protective layer 30.
The lower protective layer 28 and the upper protective layer 30 are not limited, and various sheet-like materials can be used, and suitable examples thereof include various resin films.
Among these, from the viewpoints of excellent mechanical properties and heat resistance, a resin film consisting of polyethylene terephthalate (PET), polypropylene (PP), polystyrene (PS), polycarbonate (PC), polyphenylene sulfide (PPS), polymethylmethacrylate (PMMA), polyetherimide (PEI), polyimide (PI), polyethylene naphthalate (PEN), triacetyl cellulose (TAC), and a cyclic olefin-based resin is suitably used.
The thickness of the lower protective layer 28 or the upper protective layer 30 is not limited. In addition, the thicknesses of the lower protective layer 28 and the upper protective layer 30 are basically the same as each other, but may be different from each other.
Here, in a case where the rigidity of the lower protective layer 28 and the upper protective layer 30 is extremely high, not only is the stretch and contraction of the piezoelectric layer 20 constrained, but also the flexibility is impaired. Therefore, it is advantageous that the thickness of the lower protective layer 28 and the thickness of the upper protective layer 30 decrease except for the case where the mechanical strength or excellent handleability as a sheet-like material is required.
In a case where the thickness of the lower protective layer 28 and the upper protective layer 30 in the piezoelectric film 10 is two times or less the thickness of the piezoelectric layer 20, preferable results in terms of achieving both ensuring of the rigidity and moderate elasticity can be obtained.
For example, in a case where the thickness of the piezoelectric layer 20 is 50 μm and the lower protective layer 28 and the upper protective layer 30 consist of PET, the thickness of the lower protective layer 28 and the upper protective layer 30 is preferably 100 μm or less, more preferably 50 μm or less, and still more preferably 25 μm or less.
In the piezoelectric film 10, the lower electrode 24 is formed between the piezoelectric layer 20 and the lower protective layer 28, and the upper electrode 26 is formed between the piezoelectric layer 20 and the upper protective layer 30.
The lower electrode 24 and the upper electrode 26 are provided to apply a driving voltage to the piezoelectric layer 20.
In the present invention, the material for forming the lower electrode 24 and the upper electrode 26 is not limited, and various conductors can be used as the material. Specific examples thereof include carbon, palladium, iron, tin, aluminum, nickel, platinum, gold, silver, copper, titanium, chromium, and molybdenum, alloys thereof, laminates and composites of these metals and alloys, and indium tin oxide. Among these, copper, aluminum, gold, silver, platinum, and indium-tin oxide are suitably as the lower electrode 24 and the upper electrode 26.
In addition, the method of forming the lower electrode 24 and the upper electrode 26 is not limited, and various known methods such as a vapor-phase deposition method (a vacuum film forming method) such as vacuum vapor deposition or sputtering, film formation using plating, and a method of bonding a foil formed of the materials described above can be used.
Among these, particularly from the viewpoint of ensuring the flexibility of the piezoelectric film 10, a thin film made of copper, aluminum, or the like formed by vacuum vapor deposition is suitably used as the lower electrode 24 and the upper electrode 26. Among these, particularly a thin film made of copper formed by vacuum vapor deposition is suitably used.
The thickness of the lower electrode 24 and the upper electrode 26 is not limited. In addition, the thicknesses of the lower electrode 24 and the upper electrode 26 are basically the same as each other, but may be different from each other.
Here, similarly to the lower protective layer 28 and upper protective layer 30 described above, in a case where the rigidity of the lower electrode 24 and the upper electrode 26 is extremely high, not only is the stretch and contraction of the piezoelectric layer 20 constrained, but also the flexibility is impaired. Therefore, it is advantageous that the thicknesses of lower electrode 24 and the upper electrode 26 decrease in a case where the electrical resistance is not excessively high. That is, it is preferable that the lower electrode 24 and the upper electrode 26 are thin film electrodes.
It is suitable that the product of the thicknesses of the lower electrode 24 and the upper electrode 26 of the piezoelectric film 10 and the Young's modulus is less than the product of the thicknesses of the lower protective layer 28 and the upper protective layer 30 and the Young's modulus because the flexibility is not considerably impaired.
For example, in a case of a combination consisting of the lower protective layer 28 and the upper protective layer 30 formed of PET (Young's modulus: approximately 6.2 GPa) and the lower electrode 24 and the upper electrode 26 formed of copper (Young's modulus: approximately 130 GPa), the thickness of the lower electrode 24 and the upper electrode 26 is preferably 1.2 μm or less, more preferably 0.3 μm or less, and still more preferably 0.1 μm or less in a case of assuming that the thickness of the lower protective layer 28 and the upper protective layer 30 is 25 μm.
It is preferable that, in the piezoelectric film 10, the maximal value of the loss tangent (tan δ) at a frequency of 1 Hz according to dynamic viscoelasticity measurement is present at room temperature and more preferable that the maximal value at which the loss tangent is 0.1 or greater is present at room temperature.
In this manner, even in a case where the piezoelectric film 10 is subjected to bending deformation at a slow vibration of less than or equal to a few Hz from the outside, since the strain energy can be effectively diffused to the outside as heat, occurrence of cracks on the interface between the matrix and the piezoelectric particle can be prevented.
In the piezoelectric film 10, it is preferable that the storage elastic modulus (E′) at a frequency of 1 Hz according to the dynamic viscoelasticity measurement is in a range of 10 GPa to 30 GPa at 0° C. and in a range of 1 GPa to 10 GPa at 50° C. The same applies to the conditions for the piezoelectric layer 20.
In this manner, the piezoelectric film 10 may have large frequency dispersion in the storage elastic modulus (E′). That is, the piezoelectric film 10 can exhibit a behavior of being rigid with respect to a vibration of 20 Hz to 20 kHz and being flexible with respect to a vibration of less than or equal to a few Hz.
In the piezoelectric film 10, it is preferable that the product of the thickness and the storage elastic modulus at a frequency of 1 Hz according to the dynamic viscoelasticity measurement is in a range of 1.0×105 to 2.0×106 (1.0E+05 to 2.0E+06) N/m at 0° C. and in a range of 1.0×105 to 1.0×106 (1.0E+05 to 1.0E+06) N/m at 50° C. The same applies to the conditions for the piezoelectric layer 20.
In this manner, the piezoelectric film 10 may have moderate rigidity and mechanical strength within a range not impairing the flexibility and the acoustic characteristics.
Further, in the piezoelectric film 10, it is preferable that the loss tangent at a frequency of 1 kHz at 25° C. is 0.05 or greater in a master curve obtained from the dynamic viscoelasticity measurement. The same applies to the conditions for the piezoelectric layer 20.
In this manner, the frequency of a speaker using the piezoelectric film 10 is smooth as the frequency characteristic thereof, and thus a change in acoustic quality in a case where the lowest resonance frequency f0 is changed according to a change in the curvature of the speaker can be decreased.
In the present invention, the storage elastic modulus (Young's modulus) and the loss tangent of the piezoelectric film 10, the piezoelectric layer 20, and the like may be measured by a known method. As an example, the measurement may be performed using a dynamic viscoelasticity measuring device DMS6100 (manufactured by SII Nanotechnology Inc.).
Examples of the measurement conditions include a measurement frequency of 0.1 to 20 Hz (0.1 Hz, 0.2 Hz, 0.5 Hz, 1 Hz, 2 Hz, 5 Hz, 10 Hz, and 20 Hz), a measurement temperature of −50° C. to 150° C., a temperature rising rate of 2° C./min (in a nitrogen atmosphere), a sample size of 40 mm×10 mm (including the clamped region), and a chuck-to-chuck distance of 20 mm.
Next, an example of the method of producing the piezoelectric film 10 will be described with reference to
First, as illustrated in
Meanwhile, the coating material is prepared by dissolving a polymer material serving as a material of the matrix in an organic solvent, adding the piezoelectric particles 36 such as PZT particles thereto, and stirring the solution for dispersion. Further, it is preferable that a substance that is in a liquid state at room temperature and has an SP value of less than 12.5 (cal/cm3)1/2 is used as the organic solvent, but the substance may be added to the coating material in a case where an organic solvent other than the substance is used.
The organic solvent other than the above-described substances is not limited, and various organic solvents can be used.
Here, as described above, the line mixing treatment is performed before application of the prepared coating material. By performing the line mixing treatment, the air bubbles in the coating material are made fine and likely to escape from the surface before being dried, and thus the area ratio of the voids in the prepared polymer-based piezoelectric composite material can be decreased.
In a case where the sheet-like material 10a is prepared and the coating material is prepared, the coating material is cast (applied) onto the sheet-like material 10a, and the organic solvent is evaporated and dried. Accordingly, as illustrated in
Here, as described above, the substance (organic solvent) having a mass ratio of greater than 500 ppm and 10000 ppm or less is allowed to remain in the piezoelectric layer 20 by adjusting the conditions for drying the coating material.
A casting method of the coating material is not limited, and all known methods (coating devices) such as a slide coater or a doctor knife can be used.
As described above, in the piezoelectric film 10, in addition to the viscoelastic material such as cyanoethylated PVA, a dielectric polymer material may be added to the matrix 34.
In a case where the polymer material is added to the matrix 34, the polymer material added to the coating material may be dissolved.
In a case where the laminate 10b in which the lower electrode 24 is provided on the lower protective layer 28 and the piezoelectric layer 20 is formed on the lower electrode 24 is prepared, it is preferable that the piezoelectric layer 20 is subjected to a polarization treatment (poling).
A method of performing the polarization treatment on the piezoelectric layer 20 is not limited, and a known method can be used.
Before the polarization treatment, a calender treatment may be performed to smoothen the surface of the piezoelectric layer 20 using a heating roller or the like. By performing the calender treatment, a thermal compression bonding step described below can be smoothly performed.
In this manner, while the piezoelectric layer 20 of the laminate 10b is subjected to the polarization treatment, a sheet-like material 10c in which the upper electrode 26 is formed on the upper protective layer 30 is prepared. The sheet-like material 10c may be prepared by forming a copper thin film or the like as the upper electrode 26 on the surface of the upper protective layer 30 using vacuum vapor deposition, sputtering, plating, or the like.
Next, as illustrated in
Further, a laminate of the laminate 10b and the sheet-like material 10c is subjected to the thermal compression bonding using a heating press device, a heating roller pair, or the like such that the upper protective layer 30 and the lower protective layer 28 are interposed between the laminate 10b and the sheet-like material 10c, thereby preparing the piezoelectric film 10.
The laminated piezoelectric element 14 described below has a configuration in which the piezoelectric films 10 according to the embodiment of the present invention are laminated and bonded to each other using a bonding layer 19 as a preferred embodiment. In the laminated piezoelectric element 14 illustrated in
A typical laminated ceramic piezoelectric element in which piezoelectric ceramic materials are laminated is subjected to a polarization treatment after preparation of a laminate of the piezoelectric ceramic materials. Only common electrodes exist at the interface between the piezoelectric layers, and thus the polarization directions of the piezoelectric layers alternate in the lamination direction.
On the contrary, the laminated piezoelectric element obtained by using the piezoelectric film 10 according to the embodiment of the present invention can be subjected to the polarization treatment in a state of the piezoelectric film 10 before lamination.
Therefore, the laminated piezoelectric element obtained by using the piezoelectric film according to the embodiment of the present invention can be prepared by laminating the piezoelectric films 10 after being subjected to the polarization treatment. It is preferable that a long piezoelectric film (a piezoelectric film with a large area) on which the polarization treatment has been performed is prepared and cut into individual piezoelectric films 10, and the piezoelectric films 10 are laminated to form the laminated piezoelectric element 14.
Therefore, in the laminated piezoelectric element obtained by using the piezoelectric film according to the embodiment of the present invention, the polarization directions of the piezoelectric films 10 adjacent to each other can be aligned in the lamination direction as in a laminated piezoelectric element 60 illustrated in
Further, it is known that in a case where a typical piezoelectric film consisting of a polymer material such as PVDF is subjected to a stretching treatment in a uniaxial direction after the polarization treatment, the molecular chains are aligned with respect to the stretching direction, and as a result, excellent piezoelectric characteristics are obtained in the stretching direction. Therefore, a typical piezoelectric film has in-plane anisotropy as a piezoelectric characteristic and has anisotropy in the amount of stretch and contraction in the plane direction in a case where a voltage is applied.
On the contrary, the polymer-based piezoelectric composite material according to the embodiment of the present invention which contains the piezoelectric particles 36 in the matrix 34 achieves excellent piezoelectric properties without performing the stretching treatment after the polarization treatment. Therefore, the polymer-based piezoelectric composite material according to the embodiment of the present invention has no in-plane anisotropy as a piezoelectric characteristic, and stretches and contracts isotropically in all directions in an in-plane direction in a case where a driving voltage is applied as described later.
The polymer-based piezoelectric composite material and the piezoelectric film 10 according to the embodiment of the present invention may be produced by using a cut sheet-like material, but preferably roll-to-roll (hereinafter, also referred to as RtoR) is used.
As is well known, RtoR is a production method of pulling out a long raw material from a roll around which the raw material is wound, performing various treatments such as film formation and a surface treatment while transporting the raw material in the longitudinal direction, and winding the treated raw material into a roll shape again.
In a case where the piezoelectric film 10 is produced by the above-described production method by RtoR, a first roll obtained by winding the sheet-like material 10a having the lower electrode 24 formed on the long lower protective layer 28, and a second roll obtained by winding the sheet-like material 10c having the upper electrode 26 formed on the long upper protective layer 30 are used.
The first roll and the second roll may be exactly the same as each other.
The sheet-like material 10a is pulled out from the roll, coated with a coating material containing the matrix 34 and the piezoelectric particles 36 while being transported in the longitudinal direction, and dried by being heated or the like to form the piezoelectric layer 20 on the lower electrode 24, thereby obtaining the laminate 10b described above.
Next, the piezoelectric layer 20 is subjected to a polarization treatment. Here, in a case where the piezoelectric film 10 is produced by RtoR, the polarization treatment is performed on the piezoelectric layer 20 in a direction orthogonal to the transport direction of the laminate 10b while the laminate 10b is transported. Before the polarization treatment, the calender treatment may be performed as described above.
Next, the sheet-like material 10c is laminated on the laminate 10b in a state where the upper electrode 26 is directed toward the piezoelectric layer 20 as described above according to a known method of pulling out the sheet-material 10c from a second roll and utilizing a bonding roller or the like while transporting the sheet-like material 10c and the laminate.
Thereafter, the laminate 10b and the sheet-like material 10c which have been laminated are interposed and transported between a pair of heating rollers to be subjected to thermal compression bonding to complete the piezoelectric film 10 according to the embodiment of the present invention, and the piezoelectric film 10 is wound in a roll shape.
In the above example, the piezoelectric film 10 according to the embodiment of the present invention is prepared by transporting the sheet-like material (laminate) only once in the longitudinal direction by RtoR, but the present invention is not limited thereto.
For example, the above-described laminate 10b is formed, the polarization treatment is performed, and the laminate is wound once into a roll shape to obtain a laminate roll. Next, the laminate is pulled out from the laminate roll, the sheet-like material in which the upper electrode 26 is formed on the upper protective layer 30 is laminated as described above while the laminate is transported in the longitudinal direction, the piezoelectric film 10 is completed, and the piezoelectric film 10 may be wound into a roll shape.
In a case where a voltage is applied to the lower electrode 24 and the upper electrode 26 of the piezoelectric film 10, the piezoelectric particles 36 stretch and contract in the polarization direction according to the applied voltage. As a result, the piezoelectric film 10 (piezoelectric layer 20) contracts in the thickness direction. At the same time, the piezoelectric film 10 stretches and contracts in the in-plane direction due to the Poisson's ratio. The degree of stretch and contraction is approximately in a range of 0.01% to 0.1%. In the in-plane direction, the piezoelectric film 10 stretches and contracts isotropically in all directions as described above.
As described above, the thickness of the piezoelectric layer 20 is preferably approximately 10 to 300 Therefore, the degree of stretch and contraction in the thickness direction is as extremely small as approximately 0.3 μm at the maximum.
On the contrary, the piezoelectric film 10, that is, the piezoelectric layer 20, has a size much larger than the thickness in the plane direction. Therefore, for example, in a case where the length of the piezoelectric film 10 is 20 cm, the piezoelectric film 10 stretches and contracts by a maximum of approximately 0.2 mm by the application of a voltage.
Further, in a case where a pressure is applied to the piezoelectric film 10, electric power is generated by the action of the piezoelectric particles 36.
By utilizing this, the piezoelectric film 10 can be used for various applications such as a speaker, a microphone, and a pressure sensitive sensor as described above.
[Piezoelectric Speaker]
The piezoelectric speaker 45 is a flat plate type piezoelectric speaker that uses the piezoelectric film 10 according to the embodiment of the present invention as a vibration plate that converts an electrical signal into vibration energy. Further, the piezoelectric speaker 45 can also be used as a microphone, a sensor, or the like.
The piezoelectric speaker 45 is configured to include the piezoelectric film 10, a case 43, a viscoelastic support 46, and a frame 48.
The case 43 is a thin regular square tubular housing formed of plastic or the like and having one surface that is open.
The frame 48 is a plate material having a through-hole at the center and having the same shape as the upper end surface (open surface side) of the case 43.
The viscoelastic support 46 is a support used for efficiently converting the stretch and contraction movement of the piezoelectric film 10 into a forward and rearward movement (a movement in the direction perpendicular to the surface of the film) by means of having moderate viscosity and elasticity, supporting the piezoelectric film 10, and applying a constant mechanical bias to any place of the piezoelectric film. Examples of the viscoelastic support 46 include wool felt, nonwoven fabric such as wool felt containing rayon and PET, and glass wool.
The piezoelectric speaker 45 is configured by accommodating the viscoelastic support 46 in the case 43, covering the case 43 and the viscoelastic support 46 with the piezoelectric film 10, and fixing the frame 48 to the case 43 in a state of pressing the periphery of the piezoelectric film 10 against the upper end surface of the case 43 by the frame 48.
Here, in the piezoelectric speaker 45, the viscoelastic support 46 has a square columnar shape whose height (thickness) is larger than the height of the inner surface of the case 43.
Therefore, in the piezoelectric speaker 45, the viscoelastic support 46 is held in a state of being thinned by being pressed downward by the piezoelectric film 10 at the peripheral portion of the viscoelastic support 46. Similarly, in the peripheral portion of the viscoelastic support 46, the curvature of the piezoelectric film 10 suddenly fluctuates, and a rising portion 45a that decreases in height toward the periphery of the viscoelastic support 46 is formed in the piezoelectric film 10. Further, the central region of the piezoelectric film 10 is pressed by the viscoelastic support 46 having a square columnar shape and has a (approximately) planar shape.
In the piezoelectric speaker 45, in a case where the piezoelectric film 10 is stretched in the in-plane direction due to the application of a driving voltage to the lower electrode 24 and the upper electrode 26, the rising portion 45a of the piezoelectric film 10 changes the angle in a rising direction due to the action of the viscoelastic support 46 in order to absorb the stretched part. As a result, the piezoelectric film 10 having the planar portion moves upward.
On the contrary, in a case where the piezoelectric film 10 contracts in the in-plane direction due to the application of the driving voltage to the lower electrode 24 and the upper electrode 26, the rising portion 45a of the piezoelectric film 10 changes the angle in a falling direction (a direction approaching the flat surface) in order to absorb the contracted part. As a result, the piezoelectric film 10 having the planar portion moves downward.
The piezoelectric speaker 45 generates a sound by the vibration of the piezoelectric film 10.
In the piezoelectric film 10 according to the embodiment of the present invention, the conversion from the stretching and contracting movement to vibration can also be achieved by holding the piezoelectric film 10 in a curved state.
Therefore, the piezoelectric film 10 according to the embodiment of the present invention can function as a speaker having flexibility by being simply held in a curved state instead of the piezoelectric speaker 45.
[Electroacoustic Converter]
An electroacoustic converter 50 illustrated in
In the electroacoustic converter 50, the laminated piezoelectric element 14 and the vibration plate 12 are bonded to each other by a bonding layer 16.
Power sources PS for applying a driving voltage are connected to the piezoelectric films 10 constituting the laminated piezoelectric element 14 of the electroacoustic converter 50.
For simplification of the drawings, the lower protective layer 28 and the upper protective layer 30 are omitted in
However, the laminated piezoelectric element is not limited thereto, and a piezoelectric film having a protective layer and a piezoelectric film having no protective layer may be mixed. Further, in a case where the piezoelectric film has a protective layer, the piezoelectric film may have only the lower protective layer 28 or only the upper protective layer 30. As an example, the laminated piezoelectric element 14 having a three-layer configuration as illustrated in
From this viewpoint, the same applies to the laminated piezoelectric element 56 illustrated in
As will be described in detail later, in the electroacoustic converter 50, in a case where the driving voltage is applied to the piezoelectric film 10 of the laminated piezoelectric element 14, the piezoelectric film 10 stretches and contracts in the plane direction, and the laminated piezoelectric element 14 stretches and contracts in the plane direction due to the stretching and contracting of the piezoelectric film 10.
The stretching and contracting of the laminated piezoelectric element 14 in the plane direction causes the vibration plate 12 to bend, and as a result, the vibration plate 12 vibrates in the thickness direction. The vibration plate 12 generates a sound due to the vibration in the thickness direction. That is, the vibration plate 12 vibrates according to the magnitude of the driving voltage applied to the piezoelectric film 10, and generates a sound according to the driving voltage applied to the piezoelectric film 10.
That is, the electroacoustic converter 50 is a speaker that uses the laminated piezoelectric element 14 as an exciter.
In the electroacoustic converter 50, the vibration plate 12 has flexibility as a preferred embodiment. In the present invention, the expression of “having flexibility” is synonymous with having flexibility in the general interpretation, and indicates being capable of bending and being flexible, specifically, being capable of bending and stretching without causing breakage and damage.
The vibration plate 12 is not limited as long as the vibration plate 12 preferably has flexibility and satisfies the relationship with the laminated piezoelectric element 14 described later, and various sheet-like materials (plate-like materials or films) can be used.
Examples of the vibration plate 12 include resin films formed of polyethylene terephthalate (PET), polypropylene (PP), polystyrene (PS), polycarbonate (PC), polyphenylene sulfide (PPS), polymethylmethacrylate (PMMA), and polyetherimide (PEI), polyimide (PI), polyethylene naphthalate (PEN), triacetyl cellulose (TAC), a cyclic olefin-based resin, or the like, foamed plastic formed of foamed polystyrene, foamed styrene, foamed polyethylene, or the like, and various kinds of corrugated cardboard materials obtained by bonding other paperboards to one or both surfaces of wavy paperboards.
Further, in the electroacoustic converter 50, a display device such as an organic electroluminescence (organic light emitting diode (OLED)) display, a liquid crystal display, a micro light emitting diode (LED) display, or an inorganic electroluminescence display can be suitably used as the vibration plate 12 as long as these have flexibility.
In the electroacoustic converter 50 illustrated in
Various known layers can be used as the bonding layer 16 as long as the vibration plate 12 and the laminated piezoelectric element 14 can be bonded to each other.
Therefore, the bonding layer 16 may be a layer consisting of an adhesive, which has fluidity during bonding and thereafter enters a solid state, a layer consisting of a pressure sensitive adhesive, which is a gel-like (rubber-like) flexible solid during bonding and does not change in the gel-like state thereafter, or a layer consisting of a material having characteristics of both an adhesive and a pressure sensitive adhesive.
Here, in the electroacoustic converter 50, the laminated piezoelectric element 14 is stretched and contracted to bend and vibrate the vibration plate 12 to generate a sound. Therefore, in the electroacoustic converter 50, it is preferable that the stretching and contracting of the laminated piezoelectric element 14 is directly transmitted to the vibration plate 12. In a case where a substance having a viscosity that relieves vibration is present between the vibration plate 12 and the laminated piezoelectric element 14, the efficiency of transmitting the stretching and contracting energy of the laminated piezoelectric element 14 to the vibration plate 12 is lowered, and the driving efficiency of the electroacoustic converter 50 is also decreased.
In consideration of this point, it is preferable that the bonding layer 16 is an adhesive layer consisting of an adhesive from which a solid and hard bonding layer 16 is obtained, rather than a pressure sensitive adhesive layer consisting of a pressure sensitive adhesive. As a more preferable bonding layer 16, specifically, a bonding layer consisting of a thermoplastic type adhesive such as a polyester-based adhesive or a styrene-butadiene rubber (SBR)-based adhesive is exemplified.
Adhesion, which is different from pressure sensitive adhesion, is useful in a case where a high adhesion temperature is required. Further, the thermoplastic type adhesive has characteristics of “a relatively low temperature, a short time, and strong adhesion”, which is suitable.
The thickness of the bonding layer 16 is not limited, and a thickness at which sufficient bonding force (adhesive force or pressure sensitive adhesive force) can be obtained may be appropriately set depending on the material of the bonding layer 16.
Here, in the electroacoustic converter 50, it is preferable that the thickness of the bonding layer 16 decreases because the effect of transmitting the stretching and contracting energy (vibration energy) of the laminated piezoelectric element 14 transmitted to the vibration plate 12 increases and the energy efficiency increases. In addition, in a case where the bonding layer 16 is thick and has high rigidity, there is also a possibility that the stretching and contracting of the laminated piezoelectric element 14 may be constrained.
In consideration of this point, it is preferable that the bonding layer 16 is thin. Specifically, the thickness of the bonding layer 16 is preferably in a range of 0.1 to 50 μm, more preferably in a range of 0.1 to 30 μm, and still more preferably in a range of 0.1 to 10 μm in terms of thickness after bonding.
In the electroacoustic converter 50, the bonding layer 16 is provided as a preferred embodiment and is not an essential constituent element.
Therefore, the electroacoustic converter 50 may fix the vibration plate 12 and the laminated piezoelectric element 14 using a known pressure bonding unit, a fastening unit, a fixing unit, or the like without having the bonding layer 16. For example, in a case where the laminated piezoelectric element 14 is rectangular, the electroacoustic converter may be configured by fastening four corners with members such as bolts and nuts, or the electroacoustic converter may be configured by fastening the four corners and a center portion with members such as bolts and nuts.
However, in this case, in a case where the driving voltage is applied from the power source PS, the laminated piezoelectric element 14 stretches and contracts independently of the vibration plate 12, and in some cases, only the laminated piezoelectric element 14 bends, and the stretching and contracting of the laminated piezoelectric element 14 is not transmitted to the vibration plate 12. As described above, in a case where the laminated piezoelectric element 14 stretches and contracts independently of the vibration plate 12, the vibration efficiency of the vibration plate 12 due to the laminated piezoelectric element 14 decreases.
Thus, the vibration plate 12 may not be sufficiently vibrated.
In consideration of this point, it is preferable that the vibration plate 12 and the laminated piezoelectric element 14 are bonded to each other with the bonding layer 16 as illustrated in
In the electroacoustic converter 50 illustrated in
Further, the laminated piezoelectric element 14 illustrated in
In addition, the electroacoustic converter may generate a sound by vibrating the vibration plate 12 with the same action and effect using the piezoelectric film according to the embodiment of the present invention instead of the laminated piezoelectric element 14. That is, the electroacoustic converter may use the piezoelectric film according to the embodiment of the present invention as an exciter.
As a preferred embodiment, the laminated piezoelectric element 14 illustrated in
As the bonding layer 19, various known layers can be used as long as the adjacent piezoelectric films 10 can be bonded to each other.
Therefore, the bonding layer 19 may be a layer consisting of an adhesive, a layer consisting of a pressure sensitive adhesive, or a layer consisting of a material having characteristics of both an adhesive and a pressure sensitive adhesive, which are described above.
Here, the laminated piezoelectric element 14 vibrates the vibration plate 12 and generates a sound by stretching and contracting the plurality of laminated piezoelectric films 10. Therefore, in the laminated piezoelectric element 14, it is preferable that the stretching and contracting of each piezoelectric film 10 is directly transmitted. In a case where a substance having a viscosity that relieves vibration is present between the piezoelectric films 10, the efficiency of transmitting the stretching and contracting energy of the piezoelectric film 10 is lowered, and the driving efficiency of the laminated piezoelectric element 14 is also degraded.
In consideration of this point, it is preferable that the bonding layer 19 is an adhesive layer consisting of an adhesive from which a solid and hard bonding layer 19 is obtained, rather than a pressure sensitive adhesive layer consisting of a pressure sensitive adhesive. As a more preferable bonding layer 19, specifically, a bonding layer consisting of a thermoplastic type adhesive such as a polyester-based adhesive or a styrene-butadiene rubber (SBR)-based adhesive is suitably exemplified.
Adhesion, which is different from pressure sensitive adhesion, is useful in a case where a high adhesion temperature is required. Further, the thermoplastic type adhesive has characteristics of “a relatively low temperature, a short time, and strong adhesion”, which is suitable.
The thickness of the bonding layer 19 is not limited, and a thickness that enables a sufficient bonding force to be exhibited may be appropriately set depending on the material for forming the bonding layer 19.
Here, in the laminated piezoelectric element 14 illustrated in
In consideration of this point, it is preferable that the bonding layer 19 is thinner than the piezoelectric layer 20. That is, it is preferable that the bonding layer 19 in the laminated piezoelectric element 14 is hard and thin. Specifically, the thickness of the bonding layer 19 is preferably in a range of 0.1 to 50 μm, more preferably in a range of 0.1 to 30 μm, and still more preferably in a range of 0.1 to 10 μm in terms of thickness after the bonding.
Further, as will be described later, in the laminated piezoelectric element 14 illustrated in
In the laminated piezoelectric element 14 illustrated in
Specifically, the product of the thickness of the bonding layer 19 and the storage elastic modulus (E′) at a frequency of 1 Hz according to the dynamic viscoelasticity measurement is preferably 2.0×106 N/m or less at 0° C. and 1.0×106 N/m or less at 50° C.
It is preferable that the internal loss of the bonding layer at a frequency of 1 Hz according to the dynamic viscoelasticity measurement is 1.0 or less at 25° C. in the case of the bonding layer 19 consisting of a pressure sensitive adhesive, and is 0.1 or less at 25° C. in the case of the bonding layer 19 consisting of an adhesive.
In the laminated piezoelectric element 14 constituting the electroacoustic converter 50, the bonding layer 19 is provided as a preferred embodiment and is not an essential constituent element.
Therefore, in the laminated piezoelectric element constituting the electroacoustic converter, the laminated piezoelectric element may be configured by laminating the piezoelectric films 10 so that the piezoelectric films are in close contact with each other using a known pressure bonding unit, a fastening unit, a fixing unit, or the like without having the bonding layer 19. For example, in a case where the piezoelectric film 10 is rectangular, the laminated piezoelectric element may be configured by fastening four corners with bolts, nuts, and the like or the laminated piezoelectric element may be configured by fastening four corners and a center portion with bolts, nuts, and the like. Alternatively, the laminated piezoelectric element may be configured by laminating the piezoelectric films 10 and thereafter bonding the peripheral portion (end surface) with a pressure sensitive adhesive tape to fix the laminated piezoelectric films 10.
However, in this case, in a case where a driving voltage is applied from the power source PS, the individual piezoelectric films 10 stretch and contract independently, and in some cases, layers of the piezoelectric films 10 bend in opposite directions and form a void. As described above, in a case where the individual piezoelectric films 10 stretch and contract independently, the driving efficiency of the laminated piezoelectric element decreases, the degree of stretching and contracting of the entire laminated piezoelectric element decreases, and there is a possibility that an abutting vibration plate or the like cannot be sufficiently vibrated. In particular, in a case where the layers of the piezoelectric films 10 bend in the opposite directions and form a void, the driving efficiency of the laminated piezoelectric element is greatly decreased.
In consideration of this point, it is preferable that the laminated piezoelectric element has the bonding layer 19 for bonding adjacent piezoelectric films 10 to each other, as in the laminated piezoelectric element 14 illustrated in
As illustrated in
The power source PS is not limited and may be a direct-current power source or an alternating-current power source. In addition, as for the driving voltage, a driving voltage capable of appropriately driving each of the piezoelectric films 10 may be appropriately set according to the thickness, the forming material, and the like of the piezoelectric layer 20 of each piezoelectric film 10.
As will be described later, in the laminated piezoelectric element 14, the polarization directions of the adjacent piezoelectric films 10 are opposite to each other. Therefore, in the adjacent piezoelectric films 10, the lower electrodes 24 face each other and the upper electrodes 26 face each other. Therefore, the power source PS constantly supplies power of the same polarity to the facing electrodes regardless of whether the power source PS is an alternating-current power source or a direct-current power source. For example, in the laminated piezoelectric element 14 illustrated in
A method of leading out an electrode from the lower electrode 24 and the upper electrode 26 is not limited, and various known methods can be used.
As an example, a method of leading out an electrode to the outside by connecting a conductor such as a copper foil to the lower electrode 24 and the upper electrode 26, and a method of leading out an electrode to the outside by forming through-holes in the lower protective layer 28 and the upper protective layer 30 by a laser or the like and filling the through-holes with a conductive material are exemplified.
As a suitable method of leading out an electrode, the method described in JP2014-209724A, the method described in JP2016-015354A, and the like are exemplified.
As described above, the piezoelectric layer 20 contains the piezoelectric particles 36 in the matrix 34. In addition, the lower electrode 24 and the upper electrode 26 are provided so as to sandwich the piezoelectric layer 20 therebetween in the thickness direction.
In a case where a voltage is applied to the lower electrode 24 and the upper electrode 26 of the piezoelectric film 10 having the piezoelectric layer 20, the piezoelectric particles 36 stretch and contract in the polarization direction according to the applied voltage. As a result, the piezoelectric film 10 (piezoelectric layer 20) contracts in the thickness direction. At the same time, the piezoelectric film 10 stretches and contracts in the in-plane direction due to the Poisson's ratio.
The degree of stretch and contraction is approximately in a range of 0.01% to 0.1%.
As described above, the thickness of the piezoelectric layer 20 is preferably approximately 10 to 300 μm. Therefore, the degree of stretch and contraction in the thickness direction is as extremely small as approximately 0.3 μm at the maximum.
On the contrary, the piezoelectric film 10, that is, the piezoelectric layer 20, has a size much larger than the thickness in the plane direction. Therefore, for example, in a case where the length of the piezoelectric film 10 is 20 cm, the piezoelectric film 10 stretches and contracts by a maximum of approximately 0.2 mm by the application of a voltage.
The laminated piezoelectric element 14 is formed by laminating and bonding the piezoelectric films 10. Therefore, in a case where the piezoelectric film 10 stretches and contracts, the laminated piezoelectric element 14 also stretches and contracts.
The vibration plate 12 is bonded to the laminated piezoelectric element 14 by the bonding layer 16. Therefore, the stretching and contracting of the laminated piezoelectric element 14 causes the vibration plate 12 to bend, and as a result, the vibration plate 12 vibrates in the thickness direction.
The vibration plate 12 generates a sound due to the vibration in the thickness direction. That is, the vibration plate 12 vibrates according to the magnitude of the voltage (driving voltage) applied to the piezoelectric film 10, and generates a sound according to the driving voltage applied to the piezoelectric film 10.
As described above, a typical piezoelectric film consisting of a polymer material such as PVDF has in-plane anisotropy as a piezoelectric characteristic, and has anisotropy in the amount of stretching and contracting in the plane direction in a case where a voltage is applied.
On the contrary, in the electroacoustic converter 50 illustrated in
According to the laminated piezoelectric element 14 in which such piezoelectric films 10 that stretch and contract isotropically and two-dimensionally are laminated, compared to a case where typical piezoelectric films formed of PVDF or the like that stretch and contract greatly in only one direction are laminated, the vibration plate 12 can be vibrated with a large force, and a louder and more beautiful sound can be generated.
The laminated piezoelectric element 14 illustrated in
Therefore, even in a case where the rigidity of each piezoelectric film 10 is low and the stretching and contracting force thereof is small, the rigidity is increased by laminating the piezoelectric films 10, and the stretching and contracting force as the laminated piezoelectric element 14 is increased. As a result, in the laminated piezoelectric element 14, even in a case where the vibration plate 12 has a certain degree of rigidity, the vibration plate 12 is sufficiently bent with a large force and the vibration plate 12 can be sufficiently vibrated in the thickness direction, whereby the vibration plate 12 can generate a sound.
Further, in a case where the thickness of the piezoelectric layer 20 increases, the stretching and contracting force of the piezoelectric film 10 increases, but the driving voltage required for stretching and contracting the film is increased by the same amount. Here, as described above, in the laminated piezoelectric element 14, since the maximum thickness of the piezoelectric layer 20 is preferably approximately 300 μm, the piezoelectric film 10 can be sufficiently stretched and contracted even in a case where the voltage applied to each piezoelectric film 10 is small.
It is preferable that the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 Hz and 25° C. according to the dynamic viscoelasticity measurement is 0.1 to 3 times the product of the thickness of the vibration plate 12 and the Young's modulus thereof.
As described above, the piezoelectric film 10 according to the embodiment of the present invention has satisfactory flexibility, and the laminated piezoelectric element 14 on which the piezoelectric film 10 is laminated also has satisfactory flexibility.
Further, the vibration plate 12 has a certain degree of rigidity. In a case where the laminated piezoelectric element 14 having rigidity is combined with the vibration plate 12, the combination is hard and unlikely to be bent, which is disadvantageous in terms of flexibility of the electroacoustic converter 50.
Meanwhile, in the electroacoustic converter 50, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 Hz and 25° C. according to the dynamic viscoelasticity measurement is preferably three times or less the product of the thickness of the vibration plate 12 and the Young's modulus thereof. That is, in the laminated piezoelectric element 14, the spring constant with respect to a slow movement is preferably three times or less that of the vibration plate 12.
With this configuration, the electroacoustic converter 50 exhibits a behavior of being flexible with respect to a slow movement due to an external force such as bending and rolling, that is, exhibits satisfactory flexibility with respect to a slow movement.
In the electroacoustic converter 50, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 Hz and 25° C. according to the dynamic viscoelasticity measurement is more preferably two times or less, still more preferably one time or less, and particularly preferably 0.3 times or less the product of the thickness of the vibration plate 12 and the Young's modulus thereof.
In consideration of the material used for the laminated piezoelectric element 14, a preferable configuration of the laminated piezoelectric element 14, and the like, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 Hz and 25° C. according to the dynamic viscoelasticity measurement is preferably 0.1 times or greater the product of the thickness of the vibration plate 12 and the Young's modulus thereof.
In the electroacoustic converter 50, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 kHz and 25° C. in the master curve obtained from the dynamic viscoelasticity measurement is preferably in a range of 0.3 to 10 times the product of the thickness of the vibration plate 12 and the Young's modulus thereof. That is, in the laminated piezoelectric element 14, the spring constant for a fast movement in a driven state is preferably in a range of 0.3 to 10 times that of the vibration plate 12.
As described above, the electroacoustic converter 50 generates a sound by stretching and contracting the laminated piezoelectric element 14 in the plane direction to vibrate the vibration plate 12. Therefore, it is preferable that the laminated piezoelectric element 14 has a certain degree of rigidity (hardness, stiffness) with respect to the vibration plate 12 at a frequency of the audio band (20 Hz to 20 kHz).
In the electroacoustic converter 50, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 kHz and 25° C. in the master curve obtained from the dynamic viscoelasticity measurement is set to preferably 0.3 times or greater, more preferably 0.5 times or greater, and still more preferably 1 time or greater the product of the thickness of the vibration plate 12 and the Young's modulus thereof. That is, in the laminated piezoelectric element 14, the spring constant with respect to a fast movement is preferably 0.3 times or greater, more preferably 0.5 times or greater, and still more preferably 1 time or greater that of the vibration plate 12.
In this manner, at a frequency of the audio band, the rigidity of the laminated piezoelectric element 14 with respect to the vibration plate 12 is sufficiently ensured, and the electroacoustic converter 50 can output a sound with a high sound pressure and high energy efficiency.
Meanwhile, in consideration of the materials available for the laminated piezoelectric element 14, a preferable configuration of the laminated piezoelectric element 14, and the like, the product of the thickness of the laminated piezoelectric element 14 and the storage elastic modulus at a frequency of 1 kHz and 25° C. according to the dynamic viscoelasticity measurement is preferably 10 times or less the product of the thickness of the vibration plate 12 and the Young's modulus thereof.
In regard to the product of the thickness and the storage elastic modulus described above, the same applies to a case where the electroacoustic converter is configured by using the piezoelectric film 10 instead of the laminated piezoelectric element 14.
In the electroacoustic converter 50 illustrated in
In the piezoelectric film 10, the polarity of the voltage applied to the piezoelectric layer 20 depends on the polarization direction. Therefore, in regard to the polarity of the voltage to be applied, the polarity of the electrode on the side in a direction in which the arrows are directed (the downstream side of the arrows) and the polarity of the electrode on the opposite side (the upstream side of the arrows) are coincident with each other in all the piezoelectric films 10 in the polarization directions indicated by the arrows in
In the example illustrated in
Therefore, in the laminated piezoelectric element 14 in which the polarization directions of the piezoelectric layers 20 of the adjacent piezoelectric films 10 are opposite to each other, the upper electrodes 26 face each other on one surface and the lower electrodes face each other on the other surface in the adjacent piezoelectric films 10. Therefore, in the laminated piezoelectric element 14, even in a case where the electrodes of the adjacent piezoelectric films 10 come into contact with each other, there is no risk of a short circuit.
As described above, in order to stretch and contract the laminated piezoelectric element 14 with satisfactory energy efficiency, it is preferable that the thickness of the bonding layer 19 is decreased so that the bonding layer 19 does not interfere with the stretching and contracting of the piezoelectric layer 20.
On the contrary, in the laminated piezoelectric element 14 illustrated in
Therefore, the laminated piezoelectric element 14 can be stretched and contracted with high energy efficiency.
As described above, in the piezoelectric film 10, the absolute amount of stretching and contracting of the piezoelectric layer 20 in the thickness direction is extremely small, and the stretching and contracting of the piezoelectric film 10 are made substantially only in the plane direction.
Therefore, even in a case where the polarization directions of the piezoelectric films 10 to be laminated are opposite to each other, all the piezoelectric films 10 stretch and contract in the same direction as long as the polarities of the voltages applied to the lower electrode 24 and the upper electrode 26 are correct.
In the laminated piezoelectric element 14, the polarization direction of the piezoelectric film 10 may be detected by a d33 meter or the like.
Alternatively, the polarization direction of the piezoelectric film 10 may be known from the treatment conditions of the polarization treatment described above.
In the laminated piezoelectric element 14 illustrated in
However, the present invention is not limited thereto. That is, the piezoelectric laminate in the electroacoustic converter may have any of various configurations such as a configuration in which piezoelectric films having different layer configurations, such as a piezoelectric film having the lower protective layer 28 and the upper protective layer 30 and a piezoelectric film having no lower protective layer and no upper protective layer, are laminated, a configuration in which piezoelectric films in which the thicknesses of the piezoelectric layers 20 are different from each other are laminated, and the like.
In the electroacoustic converter 50 illustrated in
The laminated piezoelectric element according to the embodiment of the present invention is not limited thereto, and various configurations can be used.
The laminated piezoelectric element 56 illustrated in
By folding back and laminating one sheet of the long piezoelectric film 10L polarized in the thickness direction, the polarization directions of the piezoelectric film 10L adjacent (facing) in the lamination direction are opposite directions as indicated by the arrows in
According to this configuration, the laminated piezoelectric element 56 can be configured with only one long piezoelectric film 10L, only one power source PS for applying the driving voltage is required, and an electrode may be led out from the piezoelectric film 10L at one place.
Therefore, according to the laminated piezoelectric element 56 illustrated in
Similar to the laminated piezoelectric element 56 illustrated in
As described above, the lower electrode 24 and the upper electrode 26 of the piezoelectric film 10L are formed of a metal vapor deposition film or the like. In a case where the metal vapor deposition film is bent at an acute angle, cracks and the like are likely to occur, and thus the electrode may be broken. That is, in the laminated piezoelectric element 56 illustrated in
On the contrary, in the laminated piezoelectric element 56 in which the long piezoelectric film 10L is folded back, by inserting the core rod 58 into the folded-back portion of the piezoelectric film 10L, the lower electrode 24 and the upper electrode 26 are prevented from being bent. Therefore, the occurrence of breakage can be suitably prevented.
In the electroacoustic converter according to the embodiment of the present invention, the laminated piezoelectric element may use the bonding layer 19 having conductivity. In particular, in the laminated piezoelectric element 56 in which one sheet of the long piezoelectric film 10L is folded back and laminated as illustrated in
In the laminated piezoelectric element in which the polarization directions of the adjacent piezoelectric films 10 are opposite to each other as illustrated in
On the contrary, as described above, in the laminated piezoelectric element 56 in which the piezoelectric film 10L is folded back and laminated, the electrode is likely to be broken inside the bent portion that is folded back at an acute angle.
Therefore, by bonding the laminated piezoelectric film 10L with the bonding layer 19 having conductivity, since electrical conduction can be ensured by the bonding layer 19 even in a case where the electrode is broken inside the bent portion, breakage is prevented and the reliability of the laminated piezoelectric element 56 can be greatly improved.
Here, the piezoelectric film 10L forming the laminated piezoelectric element 56 has the lower protective layer 28 and the upper protective layer 30 preferably in a manner that the lower electrode 24 and the upper electrode 26 face each other and interpose the laminate therebetween as illustrated in
In this case, even in a case where the bonding layer 19 having conductivity is used, the conductivity cannot be secured. Therefore, in a case where the piezoelectric film 10L has a protective layer, through-holes may be provided in the lower protective layer 28 and the upper protective layer 30 in regions where the lower electrodes 24 face each other and the upper electrodes 26 face each other in the laminated piezoelectric film 10L, and the bonding layer 19 having conductivity may be brought into contact with the lower electrode 24 and the upper electrode 26. Preferably, the through-holes formed in the lower protective layer 28 and the upper protective layer 30 are closed with a silver paste or a conductive bonding agent, and the adjacent piezoelectric film 10L is bonded thereto with the bonding layer 19 having conductivity.
In this case, the through-holes of the lower protective layer 28 and the upper protective layer 30 may be formed by removal of the protective layers through laser processing, solvent etching, mechanical polishing, or the like.
The number of through-holes of the lower protective layer 28 and the upper protective layer 30 may be one or more in the regions where the lower electrodes 24 face each other and the upper electrodes 26 face each other in the laminated piezoelectric film 10L, preferably outside the bent portion of the piezoelectric film 10L. Alternatively, the through-holes of the lower protective layer 28 and the upper protective layer 30 may be formed regularly or irregularly on the entire surface of the lower protective layer 28 and the upper protective layer 30.
The bonding layer 19 having conductivity is not limited, and various known bonding layers can be used.
In the above-described laminated piezoelectric element, the polarization directions of the laminated piezoelectric films 10 are opposite to each other in the adjacent piezoelectric films 10, but the present invention is not limited thereto.
That is, in the present invention, in the laminated piezoelectric element obtained by laminating the piezoelectric films 10, the polarization directions of the piezoelectric layers 20 may be all the same as in the laminated piezoelectric element 60 illustrated in
As illustrated in
Therefore, as illustrated in
Hereinbefore, the polymer-based piezoelectric composite material and the piezoelectric film according to the embodiment of the present invention have been described in detail, but the present invention is not limited to the above-described examples, and various improvements or modifications may be made within a range not departing from the scope of the present invention.
Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.
<Preparation of Coating Material>
First, cyanoethylated PVA (CR-V, manufactured by Shin-Etsu Chemical Co., Ltd.) was dissolved in cyclohexanone (SP value: 9.9 (cal/cm3)1/2) at the following compositional ratio. Thereafter, PZT particles were added to the solution at the following compositional ratio and dispersed using a propeller mixer (rotation speed of 2000 rpm), thereby preparing a coating material for forming a piezoelectric layer.
The treatment of allowing the coating solution to pass through an in-line mixer (MX-F8, manufactured by OHR Laboratory Corporation) at a flow rate of 5 kg/min was repeated for 2 passes to make the air bubbles fine in the coating liquid.
(Coating material)
In addition, PZT particles obtained by sintering commercially available PZT raw material powder at 1000° C. to 1200° C. and thereafter crushing and classifying the sintered powder to have an average particle diameter of 5 μm were used as the PZT particles.
<Application of Coating Material>
Further, a sheet-like material obtained by performing vacuum vapor deposition on a copper thin film having a thickness of 0.1 μm was prepared on a PET film having a thickness of 4 μm. That is, in the present example, the thin film electrode is a copper-deposited thin film having a thickness of 0.1 m, and the protective layer is a PET film having a thickness of 4 μm.
The coating material for forming the piezoelectric layer prepared in advance was applied onto the thin film electrode (copper vapor deposition thin film) of the sheet-like material using a slide coater. Further, the coating material was applied such that the film thickness of the coating film after being dried reached 40 μm.
<Drying Coating Material>
Next, a material obtained by coating the sheet-like material with the coating material was heated and dried on a hot plate at 100° C. for 60 minutes to evaporate a part of the cyclohexanone. In this manner, a laminate in which the thin film electrode made of copper was provided on the protective layer made of PET and the piezoelectric layer (polymer-based piezoelectric composite material) having a thickness of 40 μm was formed thereon was prepared.
<Polarization Treatment>
Next, the piezoelectric layer of the laminate was subjected to a polarization treatment according to the above-described method.
<Lamination of Sheet-Like Material>
The sheet-like material was laminated on the laminate which had been subjected to the polarization treatment in a state where the thin film electrode (copper thin film side) was directed toward the piezoelectric layer. Next, the laminate of the laminate and the sheet-like material was used to bond the piezoelectric layer and the thin film electrode to each other using a laminator device.
A piezoelectric film was prepared by performing the above-described steps.
<Measurement of Area Ratio of Voids>
A sample was cut out from the prepared piezoelectric film, and the area ratio of voids in the polymer-based piezoelectric composite material was measured by the following method.
The polymer-based piezoelectric composite material was cut in the thickness direction to observe the cross section of the polymer-based piezoelectric composite material. The polymer-based piezoelectric composite material was cut by mounting a histo knife blade (manufactured by Drukker) having a width of 8 mm on RM2265 (manufactured by Leica Biosystems) and setting the speed to a controller scale of 1 and an engagement amount of 0.25 μm to 1 μm. The cross section thereof was observed with a SEM (SU8220, manufactured by Hitachi High-Tech Corporation). The sample is conductively treated by Pt vapor deposition, and the work distance is set to 8 mm. The observation was made under conditions of an SE image (Upper) and an acceleration voltage of 0.5 kV, a sharp image was output by focus adjustment and astigmatism adjustment, and automatic brightness adjustment (auto setting, brightness: 0, contrast: 0) was carried out in a state where the polymer-based piezoelectric composite material portion covered the entire screen. The photographing magnification was set as the magnification in which the electrodes at both ends were fitted on one screen and the width between the electrodes was at least half of the screen. Image analysis software ImageJ is used for binarization of the image, the lower limit of the threshold is set to the maximum value at which the protective layer is not colored, and the upper limit of the threshold is set to the maximum set value of 255. The area ratio of the voids in the area of the polymer-based piezoelectric composite material was calculated by defining the area of a colored site between the electrodes as the area of the voids, setting the area as the numerator, and setting the area of the polymer-based piezoelectric composite material in which the width in the lateral direction was defined as both ends of the ESM image. The same process was performed on optional ten cross sections, and the average value of the area ratios was set as the area ratio of voids in the cross section of the polymer-based piezoelectric composite material. As a result, the area ratio of the voids in the cross section of the polymer-based piezoelectric composite material was 1.2%.
<Measurement of Content of Solvent>
A sample was cut out from the prepared piezoelectric film, and the content of the substance (solvent) in the polymer-based piezoelectric composite material which had an SP value of less than 12.5 (cal/cm3)1/2 and was in a liquid state at room temperature was measured by the following method.
A part of the sample was cut out from the polymer-based piezoelectric composite material into a size of 8×8 mm square, and the content of the substance was measured using a gas chromatograph device (GC-12A, manufactured by Shimadzu Corporation). In addition, 221-14368-11 (manufactured by Shimadzu Corporation) was used as a column, and Chromosorb 101 (manufactured by Shinwa Chemical Industries Ltd.) was used as a filler. The measurement was performed by setting the temperature of the sample vaporization chamber and the detector to 200° C., the column temperature to a constant temperature of 160° C., the carrier gas to 0.4 MPa of helium. The content mass ratio of the substance was calculated by dividing the mass of the obtained cyclohexanone by the mass of the polymer-based piezoelectric composite material in the sample. As a result, the content of the substance (solvent) in the polymer-based piezoelectric composite material which had an SP value of less than 12.5 (cal/cm3)1/2 and was in a liquid state at room temperature was 520 ppm.
A piezoelectric film was prepared in the same manner as in Example 1 except that the mixing method and the drying conditions for the coating material serving as the piezoelectric layer were respectively changed as listed in Table 1.
A piezoelectric film was prepared in the same manner as in Example 1 except that dimethylformamide (DMF) (SP value: 12.1 (cal/cm3)1/2) was used as the solvent contained in the coating material serving as the piezoelectric layer in place of cyclohexanone.
A piezoelectric film was prepared in the same manner as in Example 1 except that methyl ethyl ketone (MEK) (SP value: 9.3 (cal/cm3)1/2) was used as the solvent contained in the coating material serving as the piezoelectric layer in place of cyclohexanone and the drying condition for the coating material were changed as listed in Table 1.
A piezoelectric film was prepared in the same manner as in Example 1 except that the mixing of the coating material serving as the piezoelectric film was not performed and the drying conditions were changed as listed in Table 1.
A piezoelectric film was prepared in the same manner as in Example 1 except that the drying conditions for the coating material serving as the piezoelectric film were changed as listed in Table 1.
A piezoelectric film was prepared in the same manner as in Example 1 except that the mixing method and the drying conditions for the coating material serving as the piezoelectric film were changed as listed in Table 1.
[Evaluation]
The change in conversion efficiency before and after the temperature cycle test of the prepared piezoelectric film was evaluated.
First, the piezoelectric film immediately after being prepared was incorporated into the piezoelectric speaker, and the speaker performance was evaluated.
Specifically, a circular test piece having a diameter of 150 mm was cut out from the prepared piezoelectric film. The test piece was fixed to cover the opening surface of a plastic round case having an inner diameter of 138 mm and a depth of 9 mm, and the pressure inside the case was maintained at 1.02 atm. In this manner, the conversion film was bent into a convex shape like a contact lens to form a piezoelectric speaker.
The sound pressure level frequency characteristics of the piezoelectric speaker prepared in the above-described manner were measured by sine wave sweep measurement using a constant current type power amplifier. Further, the measurement microphone was disposed at a position directly above by of 10 cm at the center of the piezoelectric speaker.
Next, the piezoelectric film was removed from the piezoelectric speaker, and the temperature cycle test was performed in conformity with JISC60068-2-14. After the piezoelectric film was exposed to a temperature of 85° C. and heated for 10 minutes, the piezoelectric film was exposed to a temperature of −33° C. and cooled for 10 minutes. This process of heating and cooling was repeated 5 times.
After the temperature cycle test, the piezoelectric film was incorporated into the piezoelectric speaker again, and the sound pressure level frequency characteristics of the piezoelectric speaker were measured by the above-described method.
The ratio of the conversion efficiency of the piezoelectric speaker after the temperature cycle test to the conversion efficiency of the piezoelectric speaker immediately after the preparation (before the temperature cycle test) was acquired and evaluated based on the following evaluation standards.
A: The ratio thereof was 95% or greater.
B: The ratio thereof was 90% or greater and less than 95%.
C: The ratio was less than 90%.
The results are listed in Table 1.
As listed in Table 1, it was found that in Examples 1 to 8 of the present invention, the degradation of conversion efficiency of the piezoelectric speaker after the temperature cycle test was smaller than that of each comparative example.
In Comparative Example 1, it was considered that since the area ratio of the voids in the cross section of the polymer-based piezoelectric composite material was greater than 20%, the solvent evaporated due to the drying, voids were generated, peeling occurred at the interface between the piezoelectric particles and the matrix, and thus the conversion efficiency was degraded.
In Comparative Example 2, it was considered that since the content of the solvent was greater than 10,000 ppm, the solvent evaporated due to the drying, voids were generated, peeling occurred at the interface between the piezoelectric particles and the matrix, and thus the conversion efficiency was degraded.
In Comparative Example 3, it was considered that since the area ratio of the voids was less than 0.1%, the solvent during the drying was not able to escape, expansion and cracking occurred, and thus the conversion efficiency was degraded.
Further, based on the comparison of Examples 1 to 4, it was found that the area ratio of the voids is preferably 0.1% or greater and less than 5%.
As described above, the effects of the present invention are apparent.
Suitable use for various usages such as audio equipment including speakers and microphones and pressure-sensitive sensors can be achieved.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-121167 | Jun 2019 | JP | national |
This application is a Continuation of PCT International Application No. PCT/JP2020/022535 filed on Jun. 8, 2020, which claims priority under 35 U.S.C. § 119(a) to Japanese Patent Application No. 2019-121167 filed on Jun. 28, 2019. The above application is hereby expressly incorporated by reference, in its entirety, into the present application.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2020/022535 | Jun 2020 | US |
| Child | 17556950 | US |
