Patent Application
20230250280
The disclosure relates to polymer compositions, more specifically, polymer compositions including recycled polyamide and an electronic device and protective case for the electronic device including the same.
Polymers are inexpensive and have good machinability and physical properties, so they are used in various fields. Because of their good strength, impact resistance, non-conductivity, and radio wave transmission, polymers are utilized in applications such as frames that support internal components of electronic devices and/or cases that protect the exterior of electronic devices. In particular, polyamide-based polymers are widely used in the fields described above because of their high tensile strength, impact strength, and easy molding.
In manufacturing polymer products, polymer scrap such as gates, sprues, and/or runners may be generated in the process of injecting a resin into a mold for injection molding. In addition, at the end of the life cycle of a polymer product, polymer waste may occur. In the case that the above-mentioned polymer scrap and polymer waste are incinerated, landfilled, or dumped, air pollution, soil pollution, and marine plastic pollution may be caused. Accordingly, the above-described polymer scrap and waste may be collected and recycled by being input as a raw material in the production of a polymer product.
In the case of mixing new polyamide raw materials and recycled polyamide in the production of polyamide products to recycle polyamide waste and scrap, poor appearance due to lower melt viscosity of resin and poor appearance due to gas generation may occur, and physical properties such as tensile strength and/or impact strength of the manufactured molded article may be deteriorated. The cause of this deterioration may be that the molecular structure of the recycled polyamide has changed because of thermal decomposition by thermal cycling during product manufacturing, hydrolysis by moisture exposure after product manufacturing, and deterioration by ultraviolet exposure.
Various embodiments in this disclosure can provide a polymer composition including a recycled polyamide that has improved physical properties and appearance and an electronic device and a protective case including the same.
The polymer composition according to various embodiments of the present disclosure may comprise a recycled polyamide, a new polyamide including at least one polyamide component, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments, the recycled polyamide may include a polyamide collected from marine plastic waste.
In some embodiments, 10 to 30% by weight of the recycled polyamide, 1 to 50% by weight of the new polyamide, 0.1 to 10% by weight of the glycidyl group-modified ethylene-octene-based copolymer, and 30 to 70% by weight of the inorganic filler may be included.
In some embodiments, the new polyamide may include polyamide PA6 and a modified polyamide having a benzene ring. In some embodiments, the modified polyamide may include at least one of polyamide PA6I, a copolymer of polyamide PA6I and PA6T, and polyamide MXD6. In some embodiments, 1 to 30% by weight of the polyamide PA6 and 1 to 20% by weight of the modified polyamide may be included.
An electronic device according to other embodiments of the present disclosure may comprise a display disposed toward a first direction; a housing including an inner space having an opening opened in the first direction; a substrate portion disposed inside the housing; and a support member supporting the substrate portion with respect to the housing and including a non-conductive material, wherein the support member includes a polymer composition including a recycled polyamide, a new polyamide including at least one polyamide component, glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments of the electronic device, the recycled polyamide may include a polyamide collected from marine plastic waste.
In some embodiments of the electronic device, the new polyamide may include polyamide PA6 and a modified polyamide having a benzene ring.
In some embodiments, the polymer composition may have a tensile strength of 2300 kgf/cm2 or more. In some embodiments, the polymer composition may have a notched Izod impact strength of 14 kgf·cm/cm or more. In some embodiments, the polymer composition may have a thermal stability with a weight loss of 2.5% or less when heated at 230° C. for 30 minutes. In some embodiments, the polymer composition may have a moisture absorption of 1% by weight or less when immersed in water for 24 hours.
A protective case according to other embodiments of the present disclosure may comprise a polymer composition including a recycled polyamide, a new polyamide including at least one polyamide component, glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler, wherein the protective case is disposed adjacent to at least a portion of an external surface of an electronic device to protect the electronic device from external impact. In some embodiments of the protective case, the recycled polyamide may include a polyamide collected from marine plastic waste.
In some embodiments of the protective case, the new polyamide may include polyamide PA6 and a modified polyamide having a benzene ring.
According to various embodiments disclosed herein, a polymer composition that recycles polyamide waste and improves physical properties and appearance and an electronic device and a protective case including the same is provided.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings. In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.
Although preferred examples are presented to aid the understanding of the present disclosure, the following examples are merely illustrative of the present disclosure, and it is apparent to those skilled in the art that various changes and modifications are possible within the scope and spirit of the present disclosure and that changes and modifications fall within the scope of the appended claims.
The polymer composition according to various embodiments of the present disclosure comprises a recycled polyamide, a new polyamide, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler.
The recycled polyamide may include polyamide scrap such as runners, sprues and/or gates generated during the injection molding process, and materials molded from polyamide waste such as marine waste plastics, waste nets, waste fabrics, waste cloths, waste fibers, and/or waste films. In some embodiments, the recycled polyamide may include polyamide 6 (PA6). The recycled polyamide may be, but is not limited to, crystalline, semi-crystalline, amorphous, or a mixture thereof. The polymer composition of the present disclosure may recycle polyamide waste by including recycled polyamide. For example, it is possible to contribute to the reduction of marine plastic pollution by collecting and recycling waste nets made of polyamide 6, which account for the highest proportion of marine plastic pollutants. In some embodiments, recycled polyamide may be included in the polymer composition in an amount of 10 to 30% by weight or less. In the case that the content of the recycled polyamide exceeds the above numerical range, mechanical properties of the polymer composition may be deteriorated, or the polymer composition may have a poor appearance because gas generation may become severe.
The new polyamide may be a polyamide resin prepared directly from a polyamide raw material without undergoing a recycling process. The new polyamide may include polyamide 6 (PA6), polyamide 66 (PA66), modified polyamide, or various polymers having amide linkages similar thereto. The polymer composition of the present disclosure may contain 1 to 30% by weight of the new polyamide.
The new polyamide may include polyamide 6 (PA6). Polyamide 6 may be synthesized by dehydration condensation polymerization of 6-aminohexanoic acid into a polymer having a molecular structure as shown in Formula 1 below.
In the above formula, n is an arbitrary integer.
According to some embodiments, the new polyamide may include various modified polyamides. The modified polyamide, as a polyamide including a benzene ring in the main chain, may have a structure in which an aromatic dicarboxylic acid monomer and an aliphatic or alicyclic diamine are condensation-polymerized, or an aromatic diamine and an aliphatic or alicyclic dicarboxylic acid are condensation-polymerized. For example, the new polyamide may include at least one of polyamide PA6I, polyamide PA6I/PA6T, and/or polyamide MXD6. The polyamide PA6I may be poly-isophthalamide obtained by polymerizing hexamethylene diamine and isophthalic acid and having a molecular structure as shown in Formula 2 below.
In Formula 2, n is an arbitrary integer.
The polyamide PA6I/PA6T may be, for example, a copolymer of terephthalamide and isophthalamide and have a molecular structure as shown in the following Formula 3 below.
In Formula 3, n and m are arbitrary integers. Although the above Formula 3 describes a block copolymer of poly-terephthalamide and poly-isophthalamide, this is exemplary, and the polyamide PA6I/6T may be a block copolymer, an alternating copolymer, or a random copolymer. The polymer of terephthalamide tends to have a high degree of crystallinity, whereas the polymer of isophthalamide tends to have a low degree of crystallinity; therefore, the physical properties of the polymer composition may be improved by adjusting the crystallinity of the polyamide PA6I/6T optimally.
The polyamide MXD6 may be a polymer obtained by dehydration condensation polymerization of xylenediamine and adipic acid and have a molecular structure as shown in Formula 4 below.
In Formula 4, n is an arbitrary integer.
As described above, the modified polyamide may include a benzene ring in the monomer. By mixing the modified polyamide including a benzene ring into the polymer composition, it is possible to increase the chemical resistance of the polymer composition and lower the water absorbance. Since the amide bond is vulnerable to hydrolysis, durability and mechanical properties of the polymer composition and the injection molded product including the same may be improved by lowering the hygroscopicity of the polyamide. In some embodiments, the polymer composition may include 1 to 20% by weight of modified polyamide. In the case that the content of the modified polyamide is less than the above range, the effect of improving chemical resistance and reducing hygroscopicity according to the inclusion of the modified polyamide may not appear. The modified polyamide included in the polymer composition may be crystalline, semi-crystalline, or amorphous. In another embodiment, the polymer composition may include 5 to 15% by weight or 5 to 10% by weight of modified polyamide. In the case that the above range is satisfied, mechanical properties (e.g., the tensile strength, the impact strength) of a molded article prepared from a recycled polyamide resin composition including the same may be further improved.
A glycidyl group-modified ethylene-octene-based copolymer (EOR-GMA) may be, for example, a copolymer in which a grafted glycidyl group is provided by bonding glycidyl methacrylate (GMA) to a polyethylene octene copolymer (poly (ethylene octene)). For example, the glycidyl group-modified ethylene-octene-based copolymer may have a structure as shown in Formula 5 below.
In Formula 5, m, x, and y are arbitrary integers. In some embodiments, the glycidyl methacrylate content of the glycidyl group-modified ethylene-octene-based copolymer may be 2 to 20% by weight, specifically 8 to 10% by weight, but it is not necessarily limited thereto. In another embodiment, the glycidyl group-modified ethylene-octene-based copolymer may have an average molecular weight of 50,000 to 350,000 g/mol, specifically 100,000 to 300,000 g/mol, more specifically 150,000 to 250,000 g/mol. In the case that the average molecular weight of the glycidyl group-modified ethylene-octene-based copolymer satisfies the above numerical range, mechanical properties of the polymer composition including the same may be improved.
The glycidyl group-modified ethylene-octene copolymer may increase the melt viscosity and melt tension of the polymer composition including the recycled polyamide, and it may improve thermal stability and appearance. The glycidyl group grafted to the glycidyl group-modified ethylene-octene-based copolymer may extend the polyamide chain by, for example, a ring-opening reaction as shown in Formula 6 below.
In Formula 6, PA means a polyamide chain. In Formula 6, the ethylene-octene chain of the glycidyl group-modified ethylene-octene copolymer is omitted for clarity.
The recycled polyamide may undergo degradation in which polymer chains break and shorten because of various external adverse effects, such as exposure to heat during injection molding, exposure to sunlight during use and after disposal, and/or hydrolysis by exposure to moisture. Because of the above-described deterioration, there may be gas generation from the recycled polyamide included in the polymer composition during injection molding due to a decrease in thermal stability, injection molding burrs due to a decrease in melt viscosity and melt tension due to shortening of the polymer chain, a decrease in tensile strength and impact strength due to shortening of the polymer chain, and an increase in hygroscopicity. The glycidyl group-modified ethylene-octene copolymer may act as a chain extender for the deteriorated polymer chain of the recycled polyamide. Therefore, the polymer composition containing the glycidyl group-modified ethylene-octene copolymer may reduce the risk of deterioration of mechanical properties and quality because of the use of recycled polyamide through the reduction of the gas generation defect during injection molding by the improvement of thermal stability, reduction of injection molding burrs by increasing the melt viscosity and melt tension, increase of the tensile strength and impact strength, and reduction of the hygroscopicity.
In some embodiments, the polymer composition of the present disclosure may include 0.1 to 10% by weight of a glycidyl group-modified ethylene-octene-based copolymer. Within the above range, melt viscosity and melt tension of the polymer composition may be optimally adjusted to provide optimal fluidity for extrusion molding of the polymer composition.
The inorganic filler may be included in the polymer composition to strengthen the polymer composition mechanically and control the density. In some embodiments, the inorganic filler may include a fibrous or needle-like inorganic material such as, for example, glass fiber, carbon fiber, mineral wool, or alstonite. In another embodiment, the inorganic filler may include a granular or plate-like solid inorganic material such as talc, clay, kaolin, mica, and calcium carbonate.
In some embodiments, the particle shape of the inorganic filler may have a ratio of a minor axis to a major axis of 1:1 to 1:10, specifically 1:2 to 1:8. In some embodiments, the length of the inorganic filler may be 1 to 5 mm, specifically 2 to 4 mm. In the case that the length of the inorganic filler is smaller than the above range, the strengthening effect of the polymer by the inorganic filler is reduced. In addition, in the case that the length of the inorganic filler exceeds the above range, impregnation of the polyamide and the inorganic filler may be incomplete, or the possibility that the inorganic filler may be aggregated in some areas of the injection-molded product may increase because of entanglement between the inorganic fillers.
In some embodiments, the polymer composition may include 30 to 70% by weight of inorganic filler. In the case that the content of the inorganic filler is within the above range, mechanical properties of the polymer composition may be improved.
In some embodiments, the polymer composition of the present disclosure, in addition to the above-described components, may further include additives, if necessary, in a range that does not impair the effects of the present disclosure. The additives may include, but are not limited to, an antioxidant, a lubricant, a heat stabilizer, a flame retardant, a weathering stabilizer, an antistatic agent, a release agent, a colorant, and/or a mixture thereof. In this case, the additive may be included in an amount of 0.1 to 20% by weight, specifically 0.5 to 10% by weight.
In particular, the type of the antioxidant is not particularly limited, but it may include a phenolic antioxidant. As an example, a hindered phenol antioxidant may be mentioned, and a commercialized example may include Irganox 1010, Irganox 1098, and Irganox 245, but it is not necessarily limited thereto. In addition, the lubricant is used without limitation as long as it is commonly used, and, for example, polyethylene wax may be used. In addition, the heat stabilizer may be used without limitation as long as it is commonly used, and, for example, trimethyl phosphite, triethyl phosphite, tris(nonylphenyl) phosphite, trimethyl phosphate, and tris(2,4-di-tert-butylphenyl) phosphite may be mentioned, but it is not necessarily limited thereto.
In order to test the effects of polymer compositions according to various embodiments of the present disclosure, polymer compositions of various embodiments including recycled polyamide were manufactured, and properties and quality were compared with those of comparative examples. Specific configurations of the embodiments and the comparative examples are described in Table 1. The polymer compositions of the embodiments and the comparative examples were prepared by mixing the components of Table 1 below with a mixer to manufacture pellets, and specimens were manufactured through injection molding of the pellets.
In Table 1, EOR-GMA represents a glycidyl group-modified ethylene-octene-based copolymer. PA6I/6T, PA6I, and MXD6 are modified polyamides containing a benzene ring. In addition, the unit of the indicated content is % by weight. The recycled polyamide used material collected from marine waste. With reference to Table 1, various examples of the resin composition of the present disclosure contain 20 to 30% by weight of recycled polyamide, 1 to 3% by weight of a glycidyl group-modified ethylene-octene-based copolymer, and 50 to 70% of glass fiber as an inorganic filler. In contrast, the resin compositions of comparative examples were prepared by mixing recycled polyamide, new polyamide, or a mixture thereof with glass fiber.
Table 2 shows the results of measuring the physical properties and quality of polymer compositions according to various embodiments of the present disclosure and comparative examples prepared with the above configuration.
In Table 2, the tensile strength was measured using a tensile tester for dumbbell-type specimen in accordance with KS M ISO 527. The impact strength was measured by making a notch in a ⅛″ thick specimen in accordance with ASTM D256 and measuring the notched Izod impact strength. For hygroscopicity, the specimen was dried in an oven at 50° C. for 24 hours and weighed, after which the test specimen was immersed in water at 23° C. for 24 hours, then removed, wiped with a cloth, and immediately weighed. The thermal stability was measured by the weight loss through a thermogravimetric analyzer with the temperature maintained at 320° C. for 30 minutes. For appearance, specimens were injection molded under the conditions of processing temperature of 280° C. and mold temperature of 100° C., and defects were identified with the naked eye and evaluated in 5 stages of 1 (very poor) to 5 (very good).
With reference to Table 2, it can be seen that various embodiments of the present disclosure have a tensile strength of 2300 or more to a maximum of 3150 kgf/cm2, and an impact strength of 14 or more to a maximum of 16.2 kgf·cm/cm. In contrast, Comparative Example 1 using only recycled polyamide recovered from marine waste showed significantly lower tensile strength and impact strength compared with the present disclosure, and it can also be seen that in Comparative Example 3 to Comparative Example 5 prepared by mixing recycled polyamide and new polyamide, the tensile strength and impact strength are somewhat lower than those of the present disclosure. It can be seen that Comparative Example 2 prepared as a control that does not contain the recycled polyamide has relatively high tensile strength and impact strength; therefore, the low physical properties of Comparative Examples 1 and 3 to 5 are because of the inclusion of the recycled polyamide. Accordingly, it can be seen that the polymer composition of the present disclosure may solve the problem of deterioration of physical properties that occurs during recycling of polyamide collected from plastic waste such as marine waste.
In addition, with reference to Table 2, it can be seen that various embodiments of the present disclosure are superior in hygroscopicity (0.72 to 0.92% by weight), thermal stability (2.0 to 2.5% by weight), and appearance (good to very good) compared with the comparative examples. This may be because hygroscopicity and thermal stability were improved by various modified polyamides and glycidyl group-modified ethylene-octene-based copolymers (EOR-GMA) included in embodiments of the present disclosure, so that the gas generation during injection molding was reduced and melt viscosity and the melt tension were properly adjusted.
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According to an embodiment, the electronic device 101 may include at least one of a display 220 (refer to
The display 220, for example, may be visually exposed through a substantial portion of the front plate 201. The shape of the display 220 may be a shape corresponding to the shape of the front plate 201, and it may have a circular shape, an oval shape, or a polygonal shape. The display 220 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a fingerprint sensor.
The audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. In the microphone hole 205, a microphone for acquiring an external sound may be disposed therein; and, in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker hole 208 may be used as an external speaker and a receiver for calls. In some embodiments, the speaker holes 208 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 208 and 214 (e.g., a piezo speaker).
The sensor module 211 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module 211 may include, for example, a biometric sensor module 211 (e.g., an HRM sensor) disposed on the second surface 210B of the housing 210. The electronic device 101 may further include a sensor module not shown, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The key input devices 202, 203, and 204 may include a wheel key 202 disposed on a first surface 210A of the housing 210 and rotatable in at least one direction, and/or side key buttons 203 and 204 disposed on a side surface 210C of the housing 210. The wheel key may have a shape corresponding to the shape of the front plate 201. In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 202, 203, and 204 and the non-included key input devices 202, 203, and 204 may be implemented in the form of a soft key or a touch key on the display 220. The connector hole 209 may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and it may include another connector hole (not shown) capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device. The electronic device 101 may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole 209 and blocks the inflow of foreign substances into the connector hole.
The binding members 250 and 260 may be detachably attached to at least a partial area of the housing 210 using the locking members 251 and 261. The binding members 250 and 260 may include one or more of the fixing member 252, the fixing member fastening hole 253, the band guide member 254, and the band fixing ring 255.
The fixing member 252 may be composed to fix the housing 210 and the binding members 250 and 260 to a part of the user's body (e.g., a wrist or an ankle). The fixing member fastening hole 253 may fix the housing 210 and the binding members 250 and 260 to a part of the user's body corresponding to the fixing member 252. The band guide member 254 is composed to limit the range of movement of the fixing member 252 in the case that the fixing member 252 is fastened with the fixing member fastening hole 253, so that the binding members 250 and 260 may be made to adhere and bind to a part of the user's body. The band fixing ring 255 may limit the range of movement of the binding members 250 and 260 in a state in which the fixing member 252 and the fixing member fastening hole 253 are fastened.
With reference to
The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, connect electrically or physically the electronic device 101 to an external electronic device, and it may include a USB connector, an SD card/MMC connector, or an audio connector.
The battery 470 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. At least a portion of the battery 470 may, for example, be disposed substantially coplanar with the printed circuit board 480. The battery 470 may be integrally disposed inside the electronic device 101, or it may be disposed detachably from the electronic device 101.
The first antenna 450 may be disposed between the display 220 and the support member 460. The first antenna 450 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The first antenna 450 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging, and it may transmit a magnetic-based signal including a short-range communication signal or payment data. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 410 and/or the support member 460 or a combination thereof.
The second antenna 455 may be disposed between the circuit board 480 and the back plate 493. The second antenna 455 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The second antenna 455 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging, and it may transmit a magnetic-based signal including a short-range communication signal or payment data. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 410 and/or the rear plate 493 or a combination thereof.
The sealing member 490 may be disposed between the side bezel structure 410 and the rear plate 493. The sealing member 490 may be composed to block moisture and foreign substances from flowing from the outside into a space surrounded by the side bezel structure 410 and the rear plate 493.
With reference to
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In some embodiments, the bracket 464 may include at least one or more lightening holes 465. The lightening hole 465 may pass through at least a portion of the support member 460, and it may be a through hole formed to improve rigidity of the bracket 464 or to reduce the weight of the bracket 464.
As described above, the upper support member 461, the lower support member 462, the reinforcing member 463, and the bracket 464 may include the polymer compositions of the present disclosure including a recycled polyamide, a new polyamide, a glycidyl group-modified ethylene-octene copolymer (EOR-GMA), and an inorganic filler. Accordingly, plastic waste, particularly marine waste, may be recycled in the case that the electronic device 101 is manufactured, and mechanical properties, moldability, and appearance quality of the support member 460 manufactured through recycling may be improved.
With reference to
In the illustrated embodiment, the front plate 502 may include two first areas 510D that extend seamlessly by bending from the first surface 510A toward the rear surface plate 511 at both ends of the long edge of the front plate 502. In the illustrated embodiment (with reference to
According to an embodiment, the electronic device 500 may include at least one of a display 501, an audio module 503, 507 and 514, a sensor module 504, 516 and 519, a camera module 505, 512 and 513, a key input device 517, a light emitting element 506, and connector holes 508 and 509. In some embodiments, the electronic device 500 may omit at least one of the components (e.g., the key input device 517 or the light emitting device 506) or additionally include other components.
The display 501, for example, may be exposed through a substantial portion of the front plate 502. In some embodiments, at least a portion of the display 501 may be exposed through the front plate 502 forming the first areas 510D of the first surface 510A and the side surface 510C. In some embodiments, the edge of the display 501 may be formed to be substantially the same as an adjacent outer shape of the front surface plate 502. In another embodiment (not shown), in order to expand the area to which the display 501 is exposed, the distance between the outer edge of the display 501 and the outer edge of the front surface plate 502 may be substantially the same.
In another embodiment (not shown), a recess or an opening may be formed in a part of the screen display area of the display 501, and at least one of an audio module 514, a sensor module 504, a camera module 505, and a light emitting device 506 that is aligned with the recess or opening may be included. In another embodiment (not shown), on the rear surface of the screen display area of the display 501, at least one of an audio module 514, a sensor module 504, a camera module 505, a fingerprint sensor 516, and a light emitting element 506 may be included. In another embodiment (not shown), the display 501 may be disposed coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module 504 and 519 and/or at least a portion of a key input device 517 may be disposed in the first areas 510D and/or the second areas 510E.
The audio modules 503, 507, and 514 may include a microphone hole 503 and speaker holes 507 and 514. In the microphone hole 503, a microphone for acquiring an external sound may be disposed therein; and, in some embodiments, a plurality of microphones may be disposed to sense the direction of the sound. The speaker holes 507 and 514 may include an external speaker hole 507 and a receiver hole 514 for a call. In some embodiments, the speaker holes 507 and 514 and the microphone hole 503 may be implemented as a single hole, or a speaker may be included without the speaker holes 507 and 514 (e.g., a piezo speaker).
The sensor modules 504, 516, and 519 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 500 or an external environmental state. The sensor modules 504, 516, and 519 may include, for example, a first sensor module 504 (e.g., a proximity sensor), a second sensor module (not shown) (e.g., a fingerprint sensor), a third sensor module 519 (e.g., HRM sensor) disposed on the second side 510B of the housing 510, and/or a fourth sensor module 516 (e.g., fingerprint sensor). The fingerprint sensor may be disposed on the second surface 510B of the housing 510 as well as the first surface 510A (e.g., the display 501). The electronic device 500 may further include a sensor module not shown, such as, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 504.
The camera modules 505, 512, and 513 may include a first camera device 505 disposed on the first surface 510A of the electronic device 500, a second camera device 512 disposed on the second surface 510B of the electronic device 500, and/or a flash 513. The camera devices 505 and 512 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 513 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 500.
The key input device 517 may be disposed on the side surface 510C of the housing 510. In other embodiments, the electronic device 500 may not include some or all of the above-mentioned key input devices 517 and the key input devices 517 not included may be implemented on the display 501 in different form such as soft keys, etc. In some embodiments, the key input device may include a sensor module 516 disposed on the second side 510B of the housing 510.
The light emitting element 506 may be disposed, for example, on the first surface 510A of the housing 510. The light emitting device 506 may provide, for example, state information of the electronic device 500 in the form of light. In another embodiment, the light emitting device 506 may provide, for example, a light source that is interlocked with the operation of the camera module 505. The light emitting element 506 may include, for example, an LED, an IR LED, and a xenon lamp.
The connector holes 508 and 509 may include a first connector hole 508 capable of accommodating a connector (e.g., the USB connector) for transmitting and receiving power and/or data to and from an external electronic device and/or a second connector hole (e.g., the earphone jack) 509 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
With reference to
The first support member 611 may be disposed inside the electronic device 600 and connected to the side bezel structure 610 (e.g., the housing), or it may be integrally formed with the side bezel structure 610. The first support member 611 may include, for example, a metal material and/or a non-metal such as the polymer composition of the present disclosure including a recycled polyamide, a new polyamide, a glycidyl group-modified ethylene-octene copolymer (EOR-GMA), and an inorganic filler as described above. The first support member 611 may support, for example, the display 630 and/or print circuit board 640 against the side bezel structure (e.g., the housing) 610 with one side coupled to the display 630 and the other side coupled to the printed circuit board 640. The printed circuit board 640 may be equipped with a processor, memory, and/or interfaces. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
The second support member 660 may be a member to prevent collisions and electrical short circuits among the housing 610, the printed circuit board 640, and the battery 650 while supporting and fixing the printed circuit board 640 and the battery 650 in the housing 610 of the electronic device. The second support member 660 may include a non-conductive material, for example, the polymer composition according to various embodiments of the present disclosure described above.
The memory may include, for example, volatile memory or non-volatile memory.
The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, connect electrically or physically the electronic device 600 to an external electronic device, and it may include a USB connector, an SD card/MMC connector, or an audio connector.
The battery 650 may include a device for supplying power to at least one component of the electronic device 600 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 650 may be disposed substantially coplanar with the printed circuit board 640, for example. The battery 650 may be integrally disposed inside the electronic device 600 or may be disposed detachably from the electronic device 600.
The antenna 670 may be disposed between the rear surface plate 680 and the battery 650. The antenna 670 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 670 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 610 and/or the first support member 611 or a combination thereof.
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With reference to
With reference to
The brackets 611a, 611b, 611c, and 611d, the key bracket 611e, and the support plates 660a, 660b, and 660c may include the polymer composition including the above-described recycled polyamide, new polyamide, glycidyl group-modified ethylene-octene copolymer (EOR-GMA), and inorganic filler. Accordingly, plastic waste, particularly marine waste, may be recycled when manufacturing the electronic devices 500 and 600, and mechanical properties, moldability, and appearance quality of the support member 460 manufactured through recycling may be improved.
With reference to
According to various embodiments, the protective cover 700 may include a cradle 740 attached to the first plate portion 711 of the first cover 710. According to an embodiment, the cradle 740 may include a mounting portion 741 that may accommodate at least a portion of the rear surface 802 and the side surface 803 of the electronic device 800. According to an embodiment, the cradle 740 may be formed of a polymer and/or a metal material. In some embodiments, the polymer material of cradle 740 may include recycled polyamide. For example, as described above, the polymer material of the cradle 740 may be a polymer composition of the present disclosure including a recycled polyamide, a new polyamide, a glycidyl group-modified ethylene-octene-based copolymer (EOR-GMA), and an inorganic filler. In another embodiment, the cradle 740 may be formed of at least one of a metal material, GFRP, CFRP, rubber, silicon, PC, PC-ABS, and FG-PC. According to an embodiment, the cradle 740 may be disposed on the mounting part 741 and include a cradle inner skin layer for protecting the electronic device 800. According to an embodiment, the cradle inner skin layer may be formed of a fabric (e.g., felt).
According to various embodiments, the electronic device 800 may include a housing 810 (e.g., the housing structure) including a front surface 801 facing a specified direction, a rear surface 802 facing a direction opposite to the front surface 801, and a side member 811 including the side surface surrounding the space between the front surface 801 and the rear surface 802. According to an embodiment, the electronic device 800 may include a display 830 that is disposed to be visible from the outside through substantially the entire area of the front surface 801.
According to various embodiments, the first cover 710 of the protective cover 700 may accommodate at least a portion of the electronic device 800. According to an embodiment, the electronic device 800 may be fixed in such a way that it is mounted on the mounting part 741 of the cradle 740 disposed on the first plate part 711 of the first cover 710. For example, the electronic device 800 may be fixed to a protective cover 700 such that the rear surface 802 faces the mounting portion 741 of the cradle 740, and at least a portion of the side surface 803 is tightly fitted to the cradle 740. According to an embodiment, in the case that the electronic device 800 is used, a first state (the state of
According to some embodiments, the protective cover 700 may include a stylus pen cover 750 for accommodating and protecting a stylus pen (not shown). The stylus pen cover 750 may be located on the front surface, side surface, or rear surface of the protective cover, and it may be a member that accommodates the stylus pen when the stylus pen is not in use to prevent loss and protects the stylus pen from external impact. As described above, the stylus pen cover 750 may include the polymer composition of the present disclosure including a recycled polyamide, a new polyamide, a glycidyl group-modified ethylene-octene-based copolymer (EOR-GMA), and an inorganic filler. Accordingly, plastic waste, particularly marine waste, may be recycled when the electronic device 101 is manufactured, and mechanical properties, moldability, and appearance quality of the support member 460 manufactured through recycling may be improved.
The polymer composition according to various embodiments of the present disclosure may include a recycled polyamide, a new polyamide including at least one polyamide component, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments, the recycled polyamide may be material collected from marine plastic waste.
In some embodiments, 10 to 30% by weight of the recycled polyamide, 1 to 50% by weight of the new polyamide, 0.1 to 10% by weight of the glycidyl group-modified ethylene-octene-based copolymer, and 30 to 70% by weight of the inorganic filler may be included.
In some embodiments, the new polyamide may include polyamide PA6 and a modified polyamide having a benzene ring. In some embodiments, the modified polyamide may include at least one of polyamide PA6I, a copolymer of polyamide PA6I and PA6T, and polyamide MXD6. In some embodiments, 1 to 30% by weight of the polyamide PA6 and 1 to 20% by weight of the modified polyamide may be included.
The electronic devices 101, 500, and 600 according to other embodiments of the present disclosure may include the displays 220, 501, and 630 disposed in a first direction; the housings 210, 510, and 610 including an internal space having an opening opened in the first direction; the substrate portion 480 and 640 disposed inside the housing; and the support member 460, 611, and 660 supporting the substrate portion 480 and 640 with respect to the housings 210, 510, and 610 and including a non-conductive material, wherein the support member 460, 611, and 660 may include a polymer composition including a recycled polyamide, a new polyamide including at least one polyamide component, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments, the recycled polyamide may be material collected from marine plastic waste.
In some embodiments, the new polyamide may include polyamide PA6 and a modified polyamide having a benzene ring.
In some embodiments, the polymer composition may have a tensile strength of 2300 kgf/cm2 or more. In some embodiments, the polymer composition may have a notched Izod impact strength of 14 kgf·cm/cm or more. In some embodiments, the polymer composition may have a thermal stability with a weight loss of 2.5% or less when heated at 230° C. for 30 minutes. In some embodiments, the polymer composition may have a moisture absorption of 1% by weight or less when immersed in water for 24 hours.
The protective case (e.g., the protective cover 700) according to other embodiments of the present disclosure may include a polymer composition including a recycled polyamide, a new polyamide including at least one polyamide component, glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler as a protective case that is disposed adjacent to at least a portion of an external surface of an electronic device to protect the electronic device from external impact. In some embodiments, the recycled polyamide may include material collected from marine plastic waste.
Also embodiments disclosed in the specification and drawings are merely presented as specific examples to easily explain the technical content according to the embodiments of the disclosure and help the understanding of the embodiments of the disclosure, but they are not intended to limit the scope of the embodiments of the disclosure. Therefore, all changes or modifications derived from the technical ideals of the various embodiments of the disclosure should be interpreted to be included in the scope of the various embodiments of the disclosure in addition to the embodiments disclosed herein.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2022-0016468 | Feb 2022 | KR | national |
This application is a bypass continuation of International Application No. PCT/KR2023/001771, filed on Feb. 8, 2023, which is based on and claims priority to Korean Patent Application No. 10-2022-0016468, filed on Feb. 8, 2022, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2023/001771 | Feb 2023 | US |
| Child | 18118453 | US |
