Claims
- 1. A composite composition comprising a polymer having side groups chemically bonded to inorganic particles.
- 2. The composite composition of claim 1 wherein the inorganic particles comprise metal/metalloid particles, metal/metalloid oxides, metal/metalloid nitrides, metal/metalloid carbides, metal/metalloid sulfides, metal/metalloid phosphates, or mixtures thereof.
- 3. The composite composition of claim 1 wherein the polymer is bonded into the composite through a side group that comprises an organic moiety, a siloxy moiety, a sulfide moiety, a sulphate moiety, a phosphate moiety, an amine moiety, a carboxyl moiety, a hydroxyl moiety, or a combination thereof.
- 4. The composite composition of claim 1 wherein the chemically bonded side groups comprise an ether group, an ester group, a carbonate group, an amide group, an imide group, an amine group, a urethane group, an ureate group, an anhydride group, a sulfide group, a disulfide group, a hydrocarbyl group, an alkoxy group, an hydridosilane group, an organosilane group, a silane group, a siloxane group, a silazone group, a phosphonate group or a combination thereof.
- 5. The composite composition of claim 4 wherein the side groups are bonded to the inorganic particle directly at the side group.
- 6. The composite composition of claim 4 wherein the side groups are bonded also to one or more carbon atoms along a linkage connected to an inorganic particle.
- 7. The composite composition of claim 1 wherein the side groups are bonded to the inorganic particle at a functional group comprising an oxysilane group, a phosphonate group, a sulfide group, an amine group, a sulphonate group or an oxo group.
- 8. The composite composition of claim 1 wherein the polymer comprises polyamides, polyimides, poly acrylic acid, polyacrylates, polyacrylamides or polysiloxanes.
- 9. The composite composition of claim 1 having greater than about 6 percent by weight inorganic particles.
- 10. The composite composition of claim 1 having greater than about 25 percent by weight inorganic particles.
- 11. The composite composition of claim 1 wherein the inorganic particles have an average particle size less than about 100 nm.
- 12. The composite composition of claim 1 wherein the inorganic particles have an average particle size less than about 50 nm.
- 13. A composite composition comprising inorganic particles chemically bonded to a polymer through a linkage comprising a plurality of functional groups, the polymer selected from the group consisting of polyamides, polycarbonates, polyimides, polyphosphazenes, polyurethanes, polyacrylates, polyacrylamides, heterocyclic polymers, polysiloxanes, polyacrylonitrile, polyacrylic acid, polyvinyl alcohol, polyvinyl chloride, conjugated polymers, aromatic polymers, electrically conducting polymers and mixtures thereof.
- 14. The composite composition of claim 13 wherein at least one of the functional groups is selected from the group consisting of an ether group, an ester group, an amide group, an imide group, an amine group, an urethane group. an ureate group, a carbonate group, an anhydride group, a sulfide group, a disulfide group, a hydrocarbyl group, an alkoxy group, an hydridosilane group, an organosilane group, a silane group, an siloxane group, a silazone group, a phosphonate group, a sulphonate group or a combination thereof.
- 15. The composite composition of claim 14 wherein at one of the functional groups is a siloxy group.
- 16. The composite composition of claim 14 wherein at least one of the functional groups is an ether group, ester group, amide group, or acid anhydride group.
- 17. The composite composition of claim 14 wherein the particles comprise a metal/metalloid oxide, metal/metalloid carbide, metal/metalloid nitride, metal/metalloid sulfide, metal/metalloid phosphates, or mixtures thereof.
- 18. The composite composition of claim 14 wherein the polymer is selected from the group consisting of polyamides, polyimides, polyacrylates, polyacrylic acid, polyacrylamides, polysiloxanes and mixtures thereof.
- 19. The composite composition of claim 14 wherein the polymer comprises polymers with conjugated polymer backbones, polymers with aromatic polymer backbones, or mixtures thereof.
- 20. The composite composition of claim 14 wherein the polymer comprises electrically conducting polymers.
- 21. The composite composition of claim 14 wherein the inorganic particles have an average particle size less than about 500 nm.
- 22. The composite composition of claim 14 wherein the inorganic particles have an average particle size less than about 100 nm.
- 23. The composite composition of claim 14 wherein the inorganic particles have an average particle size less than about 50 nm.
- 24. A composite composition comprising chemically bonded inorganic particles and polymer selected from the group consisting of polyamides, polycarbonates, polyimides, polyphosphazenes, polyurethanes, heterocyclic polymers, polysiloxanes, polyacrylonitrile, polyacrylic acid, polyvinyl alcohol, polyvinyl chloride, conjugated polymers, aromatic polymers, electrically conducting polymers and mixtures thereof, wherein the polymer is chemically bonded to the inorganic particle through a terminal site of a polymer chain.
- 25. The composite composition of claim 24 wherein the polymer comprises polyamide, polyimide, polycarbonate, polysiloxane, polyurethanes and mixtures thereof.
- 26. A composite composition comprising a polymer chemically bonded to inorganic particles, wherein the inorganic particles comprise a metal.
- 27. The composite composition of claim 26 wherein the composite has at least about 6 percent by weight inorganic particles.
- 28. The composite composition of claim 26 wherein the metal comprises gold, silver, copper, platinum or palladium.
- 29. The composite composition of claim 26 wherein a linkage comprising a plurality of functional groups chemically joins the polymer and the inorganic particle.
- 30. The composite composition of claim 26 wherein a sulfide group is bonded to the inorganic particle.
- 31. The composite composition of claim 26 having at least about 25 weight percent inorganic particles.
- 32. A collection of metal/metalloid oxide or metal/metalloid nitride particles that are chemically bonded through a chemical linkage comprising an amine group, an amide group, a sulfide group, a disulfide group, an alkoxy group, a ester group, an acid anhydride group, the linkage being chemically bonded with a polymer.
- 33. The collection of particles of claim 32 wherein the particles comprise silicon oxide, silicon nitride or silicon oxynitride.
- 34. The collection of particles of claim 32 wherein the particles comprise TiO2, zinc oxide, tin oxide or aluminum oxide.
- 35. The collection of particles of claim 32 wherein the linkage is bonded to the particle through a siloxane functional group, a phosphonate functional group or an oxo functional group.
- 36. A composite composition comprising chemically bonded inorganic particles and blends of distinct polymers.
- 37. The composite composition of claim 36 wherein the blends of distinct polymers comprise ordered copolymers.
- 38. The composite composition of claim 37 wherein the ordered copolymers are block copolymers.
- 39. The composite composition of claim 38 wherein the block copolymers comprise polystyrene-block-poly(methyl methacrylate), polystyrene-block-polyacrylamide, polysiloxane-block-polyacrylate/polyacrylic acid, or mixtures thereof.
- 40. The composite composition of claim 37 wherein the ordered copolymers comprise graft copolymers, comb copolymers, star-block copolymers, dendrimers or mixtures thereof.
- 41. The composite composition of claim 36 wherein the blends of distinct polymers comprise physical mixtures of chemically distinct polymers.
- 42. The composite composition of claim 36 wherein the inorganic particles are chemically bonded to a subset of the distinct polymers of the blend of distinct polymers.
- 43. The composite composition of claim 36 wherein the composite is localized within boundaries on a surface of a substrate.
- 44. The composite composition of claim 36 wherein the inorganic particles comprise metal/metalloid particles, metal/metalloid oxides, metal/metalloid nitrides, metal/metalloid carbides, metal/metalloid sulfides, metal/metalloid phosphates, or mixtures thereof.
- 45. A structure comprising the composite of claim 36.
- 46. The structure of claim 45 wherein the structure comprises a fiber.
- 47. The structure of claim 45 wherein the structure comprises a film.
- 48. The structure of claim 46 wherein the inorganic particles are localized within boundaries on the film.
- 49. A structure comprising a surface and a composite localized within boundaries on the surface, the composite comprising inorganic particles bonded to a polymer.
- 50. The structure of claim 49 wherein the structure is a fiber.
- 51. A method for forming chemically bonded polymer inorganic particle composites, the method comprising binding side chain functional groups of polymer units to functional groups of a linker compound bonded to the inorganic particles.
- 52. An optical device comprising a composite, the composite comprising a polymer and inorganic particles chemically bonded to the polymer.
- 53. The optical device of claim 52 wherein the composite has an index-of-refraction at least about 1.8.
- 54. The optical device of claim 52 wherein the composite has an index-of-refraction of no more than about 1.5.
- 55. The optical device of claim 52 wherein the composite comprises at least about 5 weight percent of the inorganic particles.
- 56. The optical device of claim 52 comprising a fiber including the composite.
- 57. The optical device of claim 52 comprising a substrate with a film comprising the composite.
- 58. A method for forming a device on a solid substrate, the method comprising associating a composite with the solid substrate, the composite comprising a polymer chemically bonded with an inorganic particle.
- 59. The method of claim 58 wherein the composite is localized into a specific region on the solid substrate surface.
- 60. The method of claim 58 wherein the inorganic particles comprise metal/metalloid particles, metal/metalloid oxides, metal/metalloid nitrides, metal/metalloid carbides, metal/metalloid sulfides, metal/metalloid phosphates or mixtures thereof.
- 61. The method of claim 58 wherein the polymer comprises polyamides, polyimides, polyacrylates, poly acrylic acid, polyacrylamides, polysiloxanes or mixtures thereof.
- 62. The method of claim 58 wherein the polymer comprises polymers with conjugates polymer backbones, polymers with aromatic polymer backbones, or mixtures thereof.
- 63. The method of claim 58 wherein the polymer comprises electrically conducting polymers.
- 64. The method of claim 58 wherein the composite has at least about 25 weight percent inorganic particles.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Application Serial No. 60/265,169 filed on Jan. 26, 2001, entitled “Polymer-Inorganic Particle Composites,” incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60265169 |
Jan 2001 |
US |