Embodiments relate to the field of circuit protection devices, and, more particularly, to a polymer-based voltage-dependent resistor and a method of manufacturing such a polymer-based voltage-dependent resistor.
Over-voltage protection devices are used to protect electronic circuits and components from damage due to over-voltage fault conditions. These over-voltage protection devices may include metal oxide varistors (MOVs) that are connected between the circuits to be protected and a ground line. MOVs have a current-voltage characteristic that allows them to be used to protect such circuits against catastrophic voltage surges. Because varistor devices are so widely deployed to protect many different types of apparatus, there is a continuing need to improve properties of varistors.
An MOV device (the terms “MOV” and “varistor” are used interchangeably herein unless otherwise noted) is generally composed of a ceramic disc, often based upon ZnO, an electrical contact layer that acts as an electrode, such as a Ag (silver) electrode, and a first metal lead and second metal lead connected at a first surface and second surface, respectively, where the second surface opposes the first surface. The MOV device is also provided with an insulation coating that surrounds the ceramic disc and other materials in many cases. An example of an MOV found in the present market includes a ceramic disc that is coated with epoxy insulation, which has a high dielectric strength.
The manufacturing process of the MOV consists of providing a zinc oxide powder mix with a small amount of metal oxide additive such as Bi2O3, SnO2, NiO, Al2O3 etc. and sintering at greater than 800° C. into ceramic parts. The ceramic varistors are made of an n-type semiconductor surrounded by insulating electric barriers.
After sintering, the varistor comprises ZnO crystals having a diameter of between 10 μm to 150 μm encapsulated by a grain boundary layer consisting substantially of the other inorganic oxide additives. The non-linear current-voltage characteristics of the varistor are dependent upon the potential barrier of the grain boundary layer. One problem with the conventional varistor manufacturing process is that the sintering process makes it difficult to control the size of the ZnO crystal grains and the grain boundary layer, and thus the operational characteristics of the device.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended as an aid in determining the scope of the claimed subject matter.
In accordance with the present disclosure, a polymer voltage-dependent resistor (PVDR) is specified. In one embodiment, the PVDR may be formed into a disk-shaped structure comprising a cured polymer matrix having a varistor powder filler dispersed therein. The filler, in one embodiment, is an extrinsic semiconductor having nominally uniform grains and being dispersed evenly throughout the polymer matrix. Metal electrodes and electrical leads are connected to the disk-shaped structure using conventional methods. In another embodiment, the PVDR is formed as a multilayer device, having multiple layers of the polymer matrix having the filler dispersed therein with metal inner electrodes interleaved between the layers of the polymer matrix.
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention, however, may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, like numbers refer to like elements throughout.
The present embodiments are generally directed to a polymer voltage-dependent resistor (PVDR) using a polymer-based filler infused with conductive particles, for example, doped zinc oxide or other semi-conductive particles, (such as SnO2 or SrTiO3), conductive polymers or metal particles. In a preferred embodiment, a monolithic polymer matrix infused with doped zinc oxide or other semi-conductive particles or metal particles forms the main body of the varistor. In another embodiment, a multi-layer varistor is formed by individual layers with a polymer matrix infused with doped zinc oxide, other semi-conductive particles or metal particles with electrically conductive inner electrodes between the layers of the polymer matrix.
In a preferred embodiment of the invention, the doped metal oxide particles comprise zinc oxide particles having sizes averaging in the range of 1 μm to 100 μm. It is desirable that the size of the zinc oxide particles have a narrow distribution, having a standard deviation within about 10%, such as to provide a homogenous structure throughout the polymer matrix. However, in some embodiments, it may be advantageous to have a mixture of different sizes. In alternate embodiments, other metal oxides with combinations of other metal salts could also be used, including, for example, metal oxides or metallic ion salts or pure metal grains of Sn, Ti, Bi, Co, Mn, Ni, Cr, Sb, Y, Ag, Li, Cu, Al, Ce, In, Ga, La, Nb, Pr, Se, V, W, Zr, Si, or Fe.
The doping process entails adding metal oxides or metallic ion salts, or a combination of both, into the zinc oxide particle system to control the properties of the zinc oxide by a calcination process. In a preferred embodiment, an aluminum(III) salt binder solvent was added to the zinc oxide powder. In alternative embodiments lithium(I) salt or silver (I) salt may also be used. In other alternative embodiments, a metal oxide selected from the group comprising aluminum oxide, antimony oxide, cobalt oxide, manganese oxide, chromium oxide, tin oxide, nickel oxide and bismuth oxide may also be used. In preferred embodiments, the conductive material will comprise in excess of 95% by volume of the varistor powder.
To create the varistor filler 104, the metal oxide particles, the metal ion salt and water may be mixed using a ball mill. Thereafter, the mixture is calcinated in the furnace at approximately 900° C. for 4 hours. The size of the particles of doped zinc oxide can be controlled milling with the ball mill after the calcination step to obtain the target grain size.
Generally, the lower the size of the doped particles of metal oxide, the lower the varistor voltage rating.
The polymer matrix, in preferred embodiments, could be any thermosetting or thermoplastic polymer, or a combination thereof. In preferred embodiments, a silicone and epoxy mixture or polyethylene may be used. Alternatively, any polymer having suitable properties for use in a varistor may be used. In the mixing process, the thermoplastics polymer is melted at or above the melting point and the filler 104 is dispersed into the molten polymer 102. A mixing element, such as a rotating blade, mechanically shears the polymer and creates a mixing process. Once the mixing process is complete, the molten polymer-powder composite may be transferred to a high-pressure hot press to form a polymer film. For a thermosetting polymer, the filler is dispersed and well mixed with a mixing blade which mechanically shears the polymer and creates a mixing process. The thermosetting polymer may then be cured under heat, for example, by exposing the filler/polymer matrix composite to approximately 100° C. for approximately 1 hour, depending upon the specific properties of the polymer matrix.
The filler 104 can range from 10% to 70% by volume of the body of the PVDR, with the remaining volume being the polymer matrix. In a preferred embodiment, the volume of the filler 104 in the body of the PVDR is in the range of 60% by volume. The filler 104 acts as a variable resistor with the threshold voltage. The particles of the filer 104 form a conductive path through the body of the PVDR. The polymer matrix acts as a dielectric layer between the particles of the filler 104.
As used herein, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural elements or steps, unless such exclusion is explicitly recited. Furthermore, references to “one embodiment” of the present invention are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.
While the present invention has been disclosed with reference to certain embodiments, numerous modifications, alterations and changes to the described embodiments are possible without departing from the sphere and scope of the present invention, as defined in the appended claim(s). Accordingly, it is intended that the present invention not be limited to the described embodiments, but that it has the full scope defined by the language of the following claims, and equivalents thereof.
Filing Document | Filing Date | Country | Kind |
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PCT/CN2018/110096 | 10/12/2018 | WO | 00 |