Claims
- 1. In a process for polymerizing epoxy compounds using a Lewis base, the improvement comprises effecting the polymerization of the presence of 0.01 to 50 parts by weight per 100 parts by weight of the epoxy compound of a Lewis base which is in the form of complex of formula
- ML.sub.x B.sub.y
- wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, B is a Lewis base, x is an integer from 1 to 2 and y is an integer from 1 to 5 with the proviso that B is not polyvalent phenolic compound.
- 2. The process of claim 1 wherein the ligand is selected from the group consisting of acetyl, acetone dipivalolyl methane or benzoyl acetone.
- 3. The process of claim 1 wherein the ligand is acetyl acetone or an aliphatic or aromatic carboxylic acid.
- 4. The process of claim 1 wherein the metal ion is selected from the group consisting of cobalt, nickel, iron, zinc and manganese ions.
- 5. The process of claim 1 wherein the Lewis base is selected from the group consisting of, imidazole, tetrahydrofuran, alcohols excluding phenolic compounds, ketones, thioethers and mercaptans.
- 6. The process of claim 1 wherein the Lewis base is selected from the group consisting of, malonic acid diesters or dinitriles, acetoacetic acid esters, cyanoacetic acid esters and nitromethane.
- 7. A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound of 0.01 to 50 parts by weight of a metal complex compound of the formula
- ML B.sub.y
- wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, B is a Lewis base, x is an integer from 1 to 2 and y is an integer from 1 to 5, with the proviso that B is not a polyvalent phenolic compound.
- 8. The mixture of claim 7 containing 1 to 10 parts by weight of the metal complex.
- 9. The composition of claim 7 wherein the ligand is selected from the group consisting of acetyl acetone, dipivaloyl methane or benzoyl acetone.
- 10. The composition of claim 7 wherein the ligand is acetyl acetone or an aliphatic or aromatic carboxylic acid.
- 11. The composition of claim 7 wherein the metal ion is selected from the group consisting of cobalt, nickel, iron, zinc and manganese ions.
- 12. The composition of claim 7 wherein Lewis base is selected from the group consisting of, imidazole, tetrahydrofuran, alcohols excluding phenolic compounds, ketones, thioethers and mercaptans.
- 13. The composition of claim 7 wherein the Lewis base is selected from the group consisting of, malonic acid diesters or dinitriles, acetoacetic acid esters, cyanoacetic acid esters and nitromethane.
- 14. A bonding and sealing composition containing as the bonding and sealing agent the mixture of claim 7.
- 15. A molding composition containing a mixture of claim 7 as the binder.
- 16. An high-grade electric circuit board made of a polymerized mixture of claim 7.
- 17. High performance composite materials bonded with a polymerized mixture of claim 7.
- 18. The process of claim 1 wherein the Lewis base is imidazole or an alkylated imidazole.
- 19. A mixture of claim 7 wherein the Lewis base is imidazole or an alkylated imidazole.
Priority Claims (2)
Number |
Date |
Country |
Kind |
338525.7 |
Mar 1990 |
DEX |
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338526.5 |
Mar 1990 |
DEX |
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PRIOR APPLICATION
This application is a division of U.S. patent application Ser. No. 204,782 filed Mar. 2, 1994, now U.S. Pat. No. 5,395,913 which is a continuation of U.S. patent application Ser. No. 953,517 filed Sep. 29, 1992 which is a continuation-in-part of U.S. patent application Ser. No. 761,885 filed Sep. 17, 1991 both now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3677978 |
Dowbenko |
Jul 1972 |
|
4116886 |
Cella |
Sep 1978 |
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Foreign Referenced Citations (1)
Number |
Date |
Country |
556612 |
Jan 1978 |
SUX |
Divisions (1)
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Number |
Date |
Country |
Parent |
204782 |
Mar 1994 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
953517 |
Sep 1992 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
761885 |
Sep 1991 |
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