Claims
- 1. A polyoxymethylene resin composition, which comprises a polyoxymethylene resin (A), a silicone compound-grafted polyolefinic resin (B-1) and a silicone compound (B-2), the amount of the silicone compound-grafted polyolefinic resin (B1) being 0.05 to 10 parts by weight on the basis of 100 parts by weight of the polyoxymethylene resin (A), and the ratio of (B1)/(B2) by weight in the composition being 99/1 to 70/30.
- 2. A polyoxymethylene resin composition, which comprises a polyoxymethylene resin (A) and a polyolefinic resin composition (B) comprising a silicone compound-grafted polyolefinic resin (B1), obtained by a grafting reaction of a polyolefinic resin with a silicone compound in a graft ratio of the silicone compound to the polyolefinic resin of 95 to 30% by weight, and a silicone compound (B2), the amount of the silicone compound-grafted polyolefinic resin (B1) being 0.05 to 10 parts by weight on the basis of 100 parts by weight of the polyoxymethylene resin (A), and the ratio of (B1)/(B2) by weight in the composition being 99/1 to 70/30.
- 3. The polyoxymethylene resin composition according to any one of claims 1 or 2, wherein 0.05 to 5 parts by weight of a lubricant (C) selected from the group consisting of alcohols, fatty acids, esters of alcohols with fatty acids, esters of alcohols with discarboxylic acids, polyoxyalkylene glycols and olefin compounds having an average degree of polymerization of 10 to 500, and/or 0.5 to 100 parts by weight of an inorganic filler (D) are further included on the basis of 100 parts by weight of the polyoxymethylene resin (A).
- 4. The polyoxymethylene resin composition according to claim 3, wherein the inorganic filler is at least one member selected from fibrous, granular, plate-shaped and hollow fillers.
- 5. The polyoxymethylene resin composition according to claim 2, wherein in the grafting reaction of the polyolefinic resin with the silicone compound the ratio of the polyolefinic resin to the silicone compound by weight is in the range of 80/20 to 20/80.
- 6. The polyoxymethylene resin composition according to claim 1 or 2, wherein the polyolefinic resin is at least one resin selected from low density polyethylene, linear low density polyethylene, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer and ethylene-ethyl acrylate copolymer.
- 7. A molding formed from the polyoxymethylene resin composition according to claim 1 or 2.
- 8. The molding according to claim 7, wherein the molding is at least one component selected from the group consisting of a working part, a resinous part for a chassis obtained by outsert molding, a chassis, a tray and a side plate.
- 9. The molding according to claim 8, wherein the mechanical working component is at least one component selected from the group consisting of gears, cams, sliders, levers, arms, clutches, joints, shafts, bearings, key stems and key tops.
- 10. The molding according to claim 7, wherein the molding is a component for OA appliances.
- 11. The molding according to claim 7, wherein the molding is a component for video appliances.
- 12. The molding according to claim 7, wherein the molding is a component for music, image and information appliances.
- 13. The molding according to claim 7, wherein the molding is a component for communication appliances.
- 14. The molding according to claim 7, wherein the molding is a component for automobile interior and exterior furnishings.
- 15. The molding according to claim 7, wherein the molding comprises a component for industrial goods.
Priority Claims (3)
Number |
Date |
Country |
Kind |
11-308788 |
Oct 1999 |
JP |
|
11-317108 |
Nov 1999 |
JP |
|
2000-064559 |
Mar 2000 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/JP00/07574 which has an International filing date of Oct. 27, 2000, which designated the United States of America and was not published in English.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP00/07574 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO01/32775 |
5/10/2001 |
WO |
A |
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5173532 |
Endo et al. |
Dec 1992 |
A |
Foreign Referenced Citations (3)
Number |
Date |
Country |
26 59 357 |
Jul 1978 |
DE |
1 590 549 |
Mar 1981 |
GB |
A9286899 |
Nov 1997 |
JP |