Claims
- 1. A thermoplastic polyoxymethylene composition consisting essentially of
- (a) 5-40 weight percent of at least one thermoplastic polyurethane, which polyurethane has a glass transition temperature of lower than 0.degree. C.,
- (b) 0.2-1.0 weight percent of ethylene bis-stearamide, and
- (c) a complemental amount of at least one polyoxymethylene polymer, which polyoxymethylene polymer has a weight average molecular weight of from 20,000 to 100,000,
- wherein said weight percents recited above for components (a) and (b) are each based on the total of components (a), (b) and (c).
- 2. The composition of claim 1 wherein the quantity of polyurethane is 5-15 weight percent, and the quantity of ethylene bis-stearamide is 0.2-0.4 weight percent.
- 3. The composition of claim 1 wherein the quantity of polyurethane is 15-40 weight percent, and the quantity of ethylene bis-stearamide is 0.3-1.0 weight percent.
- 4. The composition of claim 2 wherein the polyurethane is dispersed throughout the polyoxymethylene polymer as discrete particles, and the composition has a Gardner impact value of greater than 9 J.
- 5. The composition of claim 3 wherein the polyurethane has a glass transition temperature of lower than -15.degree. C., the polyurethane is dispersed throughout the polyoxymethylene polymer as a separate phase having an average cross-sectional size in the minimum dimension of not greater than 0.9 microns, and the composition has an Izod value of greater than 375 J/m.
- 6. The composition of claim 4 wherein the polyoxymethylene is a homopolymer with a molecular weight of 30,000-70,000.
- 7. The composition of claim 5 wherein the polyoxymethylene is a homopolymer with a molecular weight of 30,000-70,000.
- 8. The composition of claim 4 wherein the Gardner impact value is greater than 25 J.
- 9. The composition of claim 5 wherein the Izod value is greater than 650 J/m.
- 10. The composition of claim 4 wherein the thermoplastic polyurethane comprises 8 to 12 weight percent of the composition.
- 11. The composition of claim 5 wherein the thermoplastic polyurethane comprises 25 to 32 weight percent of the composition.
- 12. The composition of claim 4 wherein the thermoplastic polyurethane is derived from the reaction of butylene adipate, methylene bis(phenylisocyanate) and 1,4-butane diol.
- 13. The composition of claim 5 wherein the thermoplastic polyurethane is derived from the reaction of butylene adipate, methylene bis(phenylisocyanate) and 1,4-butane diol.
- 14. A method for improving the mold release and mold deposit characteristics of a thermoplastic polyoxymethylene composition, said composition consisting essentially of:
- (a) 5-40 weight percent of at least one thermoplastic polyurethane, which polyurethane has a glass transition temperature of lower than 0.degree. C., and
- (b) a complemental amount of at least one polyoxymethylene polymer, which polyoxymethylene polymer has a weight average molecular weight of from 20,000 to 100,000,
- said method comprising incorporating into the polyoxymethylene composition 0.2-1.0 weight percent of ethylene bis-stearamide, wherein said weight percents recited above for component (a) and for the ethylene bis-stearamide are each based on the total of components (a) and (b) and the ethylene bis-stearamide.
- 15. The method of claim 14 wherein the quantity of ethylene bis-stearamide is 0.2-0.4 weight percent, and the quantity of polyurethane is 5-15 weight percent.
- 16. The method of claim 14 wherein the quantity of ethylene bis-stearamide is 0.3-1.0 weight percent, and the quantity of polyurethane is 15-40 weight percent.
- 17. The method of claim 14 wherein the ethylene bis-stearamide is incorporated into the composition by melt compounding under high shear.
- 18. Shaped articles made from the composition of claim 1.
- 19. A method of preparing the shaped articles of claim 18 by injection molding where the mold temperature is 10.degree. to 120.degree. C.
- 20. The method of claim 19 wherein the mold temperature is 50.degree. to 90.degree. C.
Parent Case Info
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of copending U.S. patent application Ser. No. 469,758, filed Feb. 25, 1983, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (5)
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683009 |
Mar 1964 |
CAX |
116456 |
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EPX |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
469758 |
Feb 1983 |
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