Claims
- 1. A thermoplastic molding composition for fabricating articles having good solvent resistance, physical and mechanical properties at high temperatures comprising an amorphous, normally solid polysiloxane-modified polyimidesulfone or polyimideketone containing repeating imidization radical residua of:
- (1) a dianhydride having the generic formula: ##STR6## wherein X is at least one of >C.dbd.O, --O--, --SO.sub.2 -- or a valence bond; and
- Ar is an arylene group having 6 to about 10 carbon atoms;
- (2) a diaminodiaryl compound having the generic formula:
- H.sub.2 N--Ar--Y--Ar--NH.sub.2
- wherein Ar is as defined above and Y is >C.dbd.O or --SO.sub.2 --; and
- (3) a diaminopolysiloxane having the generic formula: ##STR7## wherein Q is a substituted or unsubstituted aromatic group, Z is --O--, --S--, --SO--, --SO.sub.2 --, --SO.sub.2 NH--, --NHSO.sub.2 --, ##STR8## --C(O)O-- or --OC(O)--, D is a substituted or unsubstituted hydrocarbylene,
- R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are each substituted or unsubstituted hydrocarbyl and
- x, y and z each have a value from 0 to 100; with the following provisos:
- (A) the mole ratio of the dianhydride (1) to the total diamine present, the groups conferred by (2) and (3), is about 1:1, and
- (B) the amount of diaminopolysiloxane (3) present is about 1 to 20 mole % of the total diamine present.
- 2. The molding composition claimed in claim 1 wherein X is >C.dbd.O, Ar is phenylene and Y is --SO.sub.2 --.
- 3. The molding composition claimed in claim 1 wherein X is >C.dbd.O, Ar is phenylene and Y is >C.dbd.O.
- 4. The molding composition claimed in claim 1 wherein the two radical residua of (2) and (3) are randomly distributed throughout the polyimide with the radical residuum of (1).
- 5. The molding composition claimed in claim 1 wherein the radical residua in the polyimide are present as blocks or groups of (1) and (2) and (1) and (3).
- 6. The molding composition claimed in claim 1 wherein X is --O--, Ar is phenylene and Y is SO.sub.2.
- 7. The molding composition claimed in claim 1 wherein X is --O--, Ar is phenylene and Y is >C.dbd.O.
- 8. The molding composition claimed in claim 1 wherein X is O, Ar is phenylene and Y is --SO.sub.2 --.
- 9. The molding composition claimed in claim 1 wherein each of R.sup.1 and R.sup.2 is methyl and y and z are each O.
- 10. The molding composition claimed in claim 1 wherein each of R.sup.1 and R.sup.2 is phenyl and y and z are each O.
- 11. The molding composition claimed in claim 1 wherein R.sup.1 is methyl and R.sup.2 is phenyl and y and z are each O.
- 12. The molding composition claimed in claim 1 wherein X is a valence bond, Ar is phenylene and Y is >C.dbd.O.
- 13. The molding composition claimed in claim 1 wherein Q is phenylene.
- 14. The molding composition claimed in claim 1 wherein Z is --O--.
- 15. The molding composition claimed in claim 1 wherein D is a hydrocarbylene having 4 carbon atoms.
- 16. The molding composition claimed in claim 1 containing a filler.
- 17. The molding composition claimed in claim 16 wherein the filler is carbon fiber.
- 18. The molding composition claimed in claim 16 wherein the filler is glass fiber.
- 19. The molding composition claimed in claim 16 wherein the filler is a powdered metal.
- 20. The molding composition claimed in claim 16 wherein the filler is an aromatic polyamide.
- 21. The molding composition claimed in claim 16 wherein the filler is a liquid crystalline polyester.
- 22. The molding composition claimed in claim 16 wherein the filler is a silicon nitride.
- 23. The molding composition claimed in claim 1 wherein the amount of diaminopolysiloxane present is about 10 to 15 mole % of the total diamine present.
Parent Case Info
This application is a continuation-in-part of patent application Ser. No. 07/054,352, filed May 26, 1987, now abandoned, by the same inventors and assigned to the same assignee, as herein.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4395527 |
Berger |
Jul 1983 |
|
4652598 |
Edelman |
Mar 1987 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
54352 |
May 1987 |
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