Claims
- 1. A thermoplastic elastomer comprising an adduct of a liquid polysulfide having a general structure described by the formula
- HSCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S[SCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S].sub.m [--SCH.sub.2 CH(SH)CH.sub.2 S--].sub.n SCH.sub.2 CH.sub.2 OCH.sub.2 O--CH.sub.2 CH.sub.2 SH
- wherein m is from about 5 to about 50, n is from 0 to about 1 and n/m is from about 0.005 to about 0.02 when n is greater than 0 and a solid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.6:1 to about 0.7:1, or a liquid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.7:1 to about 0.95:1 and, optionally, an amount of a monofunctional epoxy compound sufficient to raise the ratio of total epoxy equivalents to mercapto equivalents from 0.95:1 to a maximum of 1:1.
- 2. The elastomer of claim 1 wherein the epoxy resin is a liquid and the ratio is from about 0.7:1 to about 0.85:1.
- 3. The elastomer of claim 1 wherein the epoxy resin is solid.
- 4. The elastomer of claim 2 wherein the epoxy resin is aromatic.
- 5. An air-curable hot melt sealant comprising a thermoplastic elastomer which is an adduct of an uncured mercapto-terminated polysulfide having a general structure described by the formula
- HSCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S[SCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S].sub.m [--SCH.sub.2 CH(SH)CH.sub.2 S--].sub.n SCH.sub.2 CH.sub.2 OCH.sub.2 O--CH.sub.2 CH.sub.2 SH
- wherein m is from about 5 to about 50, n is from 0 to about 1 and n/m is from about 0.005 to about 0.02 when n is greater than 0, and a solid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.6:1 to about 0.7:1, or a liquid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.7:1 to about 0.95:1.
- 6. The sealant of claim 5 wherein the polysulfide is a liquid.
- 7. The sealant of claim 5 wherein the epoxy resin is solid.
- 8. A method for preparing a thermoplastic elastomer, said method comprising heating a mixture of a liquid polysulfide having a general structure described by the formula
- HSCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S[SCH.sub.2 CH.sub.2 OCH.sub.2 OCH.sub.2 CH.sub.2 S].sub.m [--SCH.sub.2 CH(SH)CH.sub.2 S--].sub.n SCH.sub.2 CH.sub.2 OCH.sub.2 O--CH.sub.2 CH.sub.2 SH
- wherein m is from about 5 to about 50, n is from 0 to about 1 and n/m is from about 0.005 to about 0.02 when n is greater than 0, a tertiary amine in an amount of from about 0.1 to about 1.0% of the total weight of the mixture, a solid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.6:1 to about 0.7:1, or a liquid epoxy resin in which the ratio of epoxy equivalents to mercapto equivalents is from about 0.7:1 to about 0.95:1; and, optionally, adding an amount of a monofunctional epoxy compound sufficient to raise the ratio of total epoxy equivalents to mercapto equivalents from 0.95:1 to a maximum of 1:1 before heating.
- 9. The elastomer of claim 2 wherein the ratio is from about 0.7:1 to about 0.8:1.
- 10. The sealant of claim 5 wherein the epoxy resin is a liquid and the ratio is from about 0.7:1 to about 0.85:1.
- 11. The sealant of claim 10 wherein the ratio is from about 0.7:1 to about 0.8:1.
- 12. The method of claim 8 wherein the epoxy resin is a liquid and the ratio is from about 0.7:1 to about 0.85:1.
- 13. The method of claim 12 wherein the ratio is from about 0.7:1 to about 0.8:1.
Parent Case Info
This is a continuation in part of application Ser. No. 08/493,015, filed on Jun. 21, 1995, now abandoned; which is a continuation of Ser. No. 08/330,229 filed Oct. 27, 1994, now abandoned; which is a continuation of Ser. No. 08/169,941 filed Dec. 20, 1993, now abandoned.
US Referenced Citations (1)
| Number |
Name |
Date |
Kind |
|
4689389 |
Lee et al. |
Aug 1987 |
|
Foreign Referenced Citations (3)
| Number |
Date |
Country |
| 232058A |
Nov 1984 |
DDX |
| 232504A |
Apr 1985 |
DDX |
| 64-36622 |
Jul 1989 |
JPX |
Continuations (2)
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Number |
Date |
Country |
| Parent |
330229 |
Oct 1994 |
|
| Parent |
169941 |
Dec 1993 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
| Parent |
493015 |
Jun 1995 |
|