Claims
- 1. A composition having improved adhesion to polyester and polyvinyl chloride materials comprising
- (a) a vinyl chloride resin selected from polyvinyl chloride and copolymers prepared from vinyl chloride and up to 30% of another copolymerizable vinyl monomer,
- (b) a plasticizer for said vinyl chloride resin in an amount sufficient to form a plastisol, and
- (c) from about 4 to about 20% by weight, based on the weight of said composition, of a saturated, linear thermoplastic polyester derived from about 100 mole % of a dicarboxylic acid and about 100 mole % of a glycol component, said polyester being dispersed in said plastisol, said polyester having a melting point of about 70.degree. to about 200.degree. C., a heat of fusion of about 10 calories per gram or less, and an inherent viscosity of about 0.3 to about 1.0.
- 2. Composition according to claim 1 wherein the melting temperature of the polyester is between about 70.degree. C. and about 180.degree. C.
- 3. Composition according to claim 1 wherein the plasticizer is present in an amount between about 80 and about 130 parts per 100 parts poly(vinyl chloride).
- 4. Composition according to claim 1 wherein said polyester is derived from one or more dibasic acids selected from terephthalic acid, isophthalic acid, succinic acid, 1,4-cyclohexanedicarboxylic acid, adipic acid and glutaric acid, and one or more glycols selected from ethylene glycol, diethylene glycol, 1,4-butanediol, 1,6-hexanediol, and 1,4-cyclohexanedimethanol.
- 5. Composition according to claim 1 wherein said polyester is derived from 1,4-cyclohexanedicarboxylic acid, glutaric acid, 1,4-butanediol and diethylene glycol.
- 6. Composition according to claim 1 wherein said polyester is derived from a dibasic acid component comprising at least 40 mole % terephthalic acid, and a glycol component consisting essentially of 1,4-butanediol and 1,6-hexanediol.
- 7. The method of bonding substrates which comprises applying the composition according to claim 1 between the substrates to be bonded, and applying heat to form a bond.
- 8. The method of bonding substrates which comprises applying the composition according to claim 5.
- 9. The method of bonding substrates which comprises applying the composition according to claim 6.
- 10. Substrates bonded with the composition according to claim 1.
- 11. Substrates bonded with the composition according to claim 5.
- 12. Substrates bonded with the composition according to claim 6.
Parent Case Info
This is a continuation of abandoned application Ser. No. 276,725 filed June 24, 1981, abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3549571 |
Berg et al. |
Dec 1970 |
|
3723379 |
Althouse et al. |
Mar 1973 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
276725 |
Jun 1981 |
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