Claims
- 1. A hot-melt adhesive composition having a melt viscosity in the range of about 100 to about 150,000 centipoise at 177.degree. C. useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers comprising at least about 10 percent by weight of substantially amorphous poly(vinylmethylether), at least about 20 percent by weight of a tackifier resin having a softening point above about 75.degree. C., and at least about 50 percent by weight of a thermoplastic resin selected from the group consisting of amorphous C.sub.3 to C.sub.6 olefins homopolymers, amorphous copolymers consisting of C.sub.2 to C.sub.6 olefins, and low density polyethylene.
- 2. The hot-melt adhesive of claim 1 wherein the thermoplastic resin is an amorphous C.sub.3 to C.sub.6 olefin homopolymer or an amorphous copolymer consisting of C.sub.2 to C.sub.6 olefins.
- 3. The hot-melt adhesive of claim 1 wherein the thermoplastic resin is a low density polyethylene.
- 4. A hot-melt adhesive composition having a melt viscosity in the range of about 100 to about 150, 000 centipoise at 177.degree. C. useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers comprising at least about 10 percent by weight of substantially amorphous poly(vinylmethylether) at least about 10 percent by weight of a tackifier resin having a softening point above about 75.degree. C., and at least about 50 percent by weight of a thermoplastic resin which is amorphous polypropylene or amorphous polypropylene containing up to about 20 weight percent of crystalline polypropylene.
- 5. A hot-melt adhesive composition having a melt viscosity in the range of about 100 to about 150,000 centipoise at 177.degree. C. useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers, whose surfaces have not been pretreated to improve adhesion, comprising at least about 10 percent by weight of substantially amorphous poly(vinylmethylether), at least about 20 percent by weight of a tackifier resin having a softening point above about 75.degree. C., and at least about 50 percent by weight of a thermoplastic resin selected from the group consisting of amorphous C.sub.3 to C.sub.6 olefins homopolymers, amorphous copolymers consisting of C.sub.2 to C.sub.6 olefins, and low density polyethylene.
- 6. A hot-melt adhesive composition according to claim 1 wherein the amount of tackifier resin is at least about 25 weight percent.
- 7. A hot-melt adhesive composition according to claim 1 wherein the amount of tackifier resin is at least about 30 weight percent.
- 8. The composition of claim 1 wherein the tackifier resin is selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters.
- 9. The composition of claim 1 wherein the tackifier resin is selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters.
- 10. The composition of claim 1 wherein the tackifier resin is selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters.
- 11. The composition of claim 1 wherein the tackifier resin is selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters.
Parent Case Info
This is a continuation of application Ser. No. 07/761,258, filed Sep. 17, 1991, now abandoned which is a divisional of Ser. No. 689,353 filed Apr. 22, 1991, now U.S. Pat. No. 5,080,978, which is a continuation-in-part of U.S. Ser. No. 292,413, filed Dec. 30, 1988, now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
60-173171 |
Sep 1985 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
689353 |
Apr 1991 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
761258 |
Sep 1991 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
292413 |
Dec 1988 |
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