Claims
- 1. A hot-melt adhesive composition useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers comprising at least about 10 weight percent of substantially amorphous poly(vinylmethylether) and at least about 10 percent by weight of a thermoplastic resin which is an ethylene-vinylacetate copolymer.
- 2. The composition of claim 1 which contains a tackifier resin selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters.
- 3. A bonded structure comprising the adhesive of claim 1 and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, polyethylene terephthalate, poly(2,6-dimethyl-phenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 4. A bonded structure comprising the adhesive of claim 2 and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, polyethylene terephthalate, poly(2,6-dimethyl-phenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 5. A bonded structure comprising the adhesive of claim 2 and a polyethylene substrate.
- 6. A bonded structure comprising the adhesive of claim 2 and a polypropylene substrate.
- 7. A bonded structure comprising the adhesive of claim 2 and an ethylene-propylene copolymer substrate.
Parent Case Info
This application is a continuation-in-part of U.S. Ser. No. 292,413, filed Dec. 30, 1988.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
60-173171 |
Sep 1985 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
292413 |
Dec 1988 |
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