Claims
- 1. A bonded structure comprising a hot-melt adhesive composition useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers comprising at least about 10% by weight of substantially amorphous poly(vinylmethylether), at least about 20% by weight of a tackifier resin having a softening point above about 75.degree. C., and at least about 50 percent by weight of a thermoplastic resin selected from the group consisting of amorphous C.sub.3 to C.sub.6 olefin homopolymers, amorphous copolymers consisting of C.sub.2 to C.sub.6 olefins and low density polyethylene, and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, polycarbonate, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, galvanized steel, carbon steel, carbon steel aluminum, paper, glass, polyethylene terephthalate, poly(2,6-dimethylphenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 2. A bonded structure comprising the adhesive of claim 1 which contains a tackifier resin selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin ester and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, polycarbonate, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, galvanized steel, carbon steel, aluminum, paper, glass, polyethylene terephthalate, poly(2,6-dimethyl-phenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 3. A bonded structure comprising a hot-melt adhesive composition useful for binding polyethylene, polypropylene, and ethylene-propylene copolymers comprising at least about 10% by weight of substantially amorphous poly(vinylmethylether), at least about 20% by weight of a tackifier resin having a softening point above about 75.degree. C., and at least about 50 percent by weight of a thermoplastic resin which is amorphous polypropylene or amorphous polypropylene containing up to about 20 weight percent of crystalline polypropylene and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, polycarbonate, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, galvanized steel, carbon steel, aluminum, paper, glass, polyethylene terephthalate, poly(2,6-dimethyl-phenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 4. A bonded structure comprising the adhesive of claim 3 which contains a tackifier resin selected from the group consisting of terpene resins, terpene-phenol resins, coumarone-indene resins, aliphatic and aromatic petroleum resins, hydrogenated petroleum resins, resins made by copolymerization of pure aromatic monomers, a wood rosin, and wood rosin esters and a solid substrate selected from the group consisting of high density polyethylene, low density polyethylene, polypropylene, ethylene-propylene copolymers, polymethylpentene, polycarbonate, latex-backed carpet, polyethylene-backed carpet, high impact polystyrene, galvanized steel, carbon steel, aluminum, paper, glass, polyethylene terephthalate, poly(2,6-dimethyl-phenylene oxide) and blends thereof with polystyrene, and a copolymer of acrylonitrile, butadiene and styrene.
- 5. A bonded structure comprising the adhesive of claim 2 and a polyethylene substrate.
- 6. A bonded structure comprising the adhesive of claim 4 and a polyethylene substrate.
- 7. A bonded structure comprising the adhesive of claim 2 and a polypropylene substrate.
- 8. A bonded structure comprising the adhesive of claim 4 and a polypropylene substrate.
- 9. A bonded structure comprising the adhesive of claim 2 and an ethylene-propylene copolymer substrate.
- 10. A bonded structure comprising the adhesive of claim 4 and an ethylene propylene copolymer substrate.
Parent Case Info
This is a divisional of application Ser. No. 08/034,152, filed Mar. 22, 1993, now U.S. Pat. No. 5,359,000 which is a continuation of Ser. No. 07/761,258, now abandoned, filed Sep. 17, 1991; which is a divisional of 689,353, filed Apr. 22, 1991, now U.S. Pat. No. 5,080,978; which is a CIP of 292,413, filed Dec. 30, 1988, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
60-173171 |
Sep 1985 |
JPX |
Divisions (2)
|
Number |
Date |
Country |
Parent |
34152 |
Mar 1993 |
|
Parent |
689353 |
Apr 1991 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
761258 |
Sep 1991 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
292413 |
Dec 1988 |
|