Claims
- 1. An enhanced evaporator tube for transferring heat between a liquid refrigerant in contact with the exterior surface of the tube and a fluid flowing through the tube, comprising:
- a first metal substrate tube having an unenhanced exterior surface; and
- a layer of metal particles generally similar to said first metal bonded in thermal conducting relationship to said substrate tube, said layer of metal particles having random voids in every direction through said layer of metal particles wherein said voids form interconnecting subsurface channels which communicate with the liquid refrigerant to vaporize the liquid refrigerant in said voids forming interconnecting subsurface channels.
- 2. An enhanced evaporator for transferring heat between a liquid refrigerant in contact with the exterior surface of the tube and a fluid flowing through the tube as set forth in claim 1, wherein said first metal substrate tube is copper.
Parent Case Info
This application is a division of application Ser. No. 881,437, filed July 2, 1986, now U.S. Pat. No. 4,753,849, issued June 28, 1988.
US Referenced Citations (4)
| Number |
Name |
Date |
Kind |
|
4288897 |
Withers, Jr. |
Sep 1981 |
|
|
4354550 |
Modahl et al. |
Oct 1982 |
|
|
4359086 |
Sanborn et al. |
Nov 1982 |
|
|
4381818 |
Sachar et al. |
May 1983 |
|
Divisions (1)
|
Number |
Date |
Country |
| Parent |
881437 |
Jul 1986 |
|